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Infineon Technologies S6J335EJBESE20000

Part No.:
S6J335EJBESE20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP Exposed Pad
Datasheet:
AetrixS6J335EJBESE20000.pdf
Description:
TRAVEO-40NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,330

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Product details

Overview

S6J335EJBESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built on the Arm® Cortex®-R5F core running at 240 MHz. It integrates CAN-FD (8 channels), Ethernet AVB MAC, HyperBus™ interface, 384 KB system SRAM, and hardware security (SHE), targeting body control modules and gateway systems requiring real-time deterministic response and functional safety compliance.

For engineers reviewing the S6J335EJBESE20000 datasheet, S6J335EJBESE20000 pinout, S6J335EJBESE20000 application, or S6J335EJBESE20000 equivalent, key selection criteria include CAN-FD channel count, ECC-protected RAM allocation, boot-ROM size (16 KB), real-time clock support, and package-specific I/O mapping for TEQFP-208.

Technical Context

The device implements dual-domain power management with five independent power domains and supports AUTOSAR 4.0.3. Its HPM bus runs at 200 MHz and LLPM bus at 240 MHz, enabling concurrent high-speed peripheral access and low-latency interrupt handling via 512-vector NVIC.

It features three PLLs (PLL0–PLL2) with SSCG capability, programmable CRC generators (4 units), and dedicated safety mechanisms including MPU, TPU, ECC on Flash/SRAM, and windowed watchdog timers-designed to meet ASIL-B requirements in automotive body/gateway applications.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-R5F @ 240 MHz with FPU, MPU, TPU, and little-endian operation
Memory Program FLASH: 4,160 KB; Work FLASH: 112 KB; System SRAM: 384 KB; TCRAM: 128 KB; Backup RAM: 32 KB
Communication 8× CAN-FD channels with 16 KB ECC RAM per channel; 1× Ethernet AVB MAC; 12× multi-function serial interfaces (UART/I²C/LIN/CSIO)
Analog & Timing 12-bit ADC: 64 channels; Base timer: 64 channels; 32-bit reload timer: 6 channels; RTC with automatic calibration
Security & Safety Secure Hardware Extension (SHE); CRC generator (4 units + 1 programmable); ECC on Flash and SRAM; windowed watchdog timer
Power & Clock 5 V / 3.3 V / 1.2 V supply domains; embedded LDO for 5 V; clock supervisor for all source clocks; CR oscillator (100 kHz / 4 MHz)

Pinout & Package

This device is packaged in a 208-pin TEQFP (Thin Quad Flat Package) with 0.5 mm pitch, thermally enhanced for automotive under-hood environments. Pin assignment follows JEDEC MO-220 standard with dedicated VCC/VSS groups per power domain and isolated analog/digital ground planes.

Pin/Terminal Circuit Role Design Meaning
VCC5, VCC3, VCC12 Power supply inputs Dedicated 5 V, 3.3 V, and 1.2 V rails feeding separate internal power domains
TX0_0–TX7_1, RX0_0–RX7_1 CAN-FD transceiver I/O 8 independent CAN-FD physical layer interfaces supporting FD data rates up to 5 Mbps
ETH_MDC, ETH_MDIO, ETH_TXD[3:0], ETH_RXD[3:0] Ethernet AVB MAC interface IEEE 802.3 compliant 100BASE-TX interface with AVB time-synchronization support
P0_00–P4_31 General-purpose I/O 148 GPIOs with configurable pull-up/down, slew rate, and drive strength; mapped across 5 ports
TCK, TMS, TDI, TDO JTAG debug interface IEEE 1149.1-compliant boundary scan and debug access supporting real-time trace and flash programming

Key Features

Feature Design Value
Real-time deterministic execution Arm Cortex-R5F core with lockstep-capable TPU and 512-vector NVIC enables sub-1 µs interrupt latency
Automotive network integration 8-channel CAN-FD + 1-channel Ethernet AVB enables centralized gateway routing between legacy and next-gen vehicle networks
Functional safety support MPU, ECC on memory, clock supervisor, and windowed WDT satisfy ASIL-B decomposition requirements per ISO 26262
Low-footprint graphics readiness HyperBus™ interface supports external LPDDR2/LPDDR3 with <10 ns read latency for HUD and cluster display subsystems
Secure boot & runtime protection SHE module provides AES-128, SHA-256, and secure key storage for firmware authentication and encrypted OTA updates

Applications

Body Control Module (BCM) Vehicle Gateway

Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC actuators in modern vehicles.

IC Role / Device Role / Timing Role: Primary real-time controller executing AUTOSAR BSW and application software with deterministic timing via base timers and interrupt prioritization.

Use Value: 240 MHz Cortex-R5F core and 384 KB system SRAM enable concurrent execution of multiple ECUs' communication stacks and actuator control loops without external memory.

Use Scenario: Aggregation and translation of messages across CAN-FD, LIN, and Ethernet AVB domains in zonal architecture vehicles.

IC Role / Device Role / Timing Role: Network bridge with hardware-accelerated message filtering, routing, and time-synchronized packet forwarding using Ethernet AVB timestamping.

Use Value: 8 CAN-FD channels with 128 message buffers each and integrated AVB MAC eliminate need for external protocol translators or FPGA glue logic.

LED Lighting Control Smart Junction Box

Use Scenario: Dynamic LED headlight beam shaping and adaptive driving beam (ADB) control with thermal monitoring.

IC Role / Device Role / Timing Role: High-resolution PWM generation and synchronized ADC sampling for current/voltage/temperature feedback across 64 LED strings.

Use Value: 12-bit ADC with 64 channels and 32-bit reload timers allow precise per-string current regulation at >1 kHz update rates without CPU overhead.

Use Scenario: Power distribution and diagnostics for 12–24 V loads in electric vehicle battery disconnect units and PDU modules.

IC Role / Device Role / Timing Role: Fault-tolerant load switch controller with real-time current sensing, overvoltage detection, and safe shutdown sequencing.

Use Value: Integrated low-voltage detector, clock supervisor, and ECC-protected SRAM ensure reliable state retention and fail-safe behavior during brown-out or supply transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 Arm Cortex-M7 core @ 320 MHz; no integrated Ethernet AVB; includes HSE security engine instead of SHE Better suited for motor control due to higher compute density; lacks native AVB for time-sensitive audio/video transport Select when Ethernet AVB is not required and higher single-thread performance is prioritized over CAN-FD channel count
Renesas RH850/U2A 32-bit proprietary core @ 400 MHz; 6× CAN FD; no HyperBus interface; larger on-chip flash (8 MB) Stronger legacy toolchain support for Japanese OEMs; limited graphics interface bandwidth vs. HyperBus™ Select for high-volume production with existing RH850 ecosystem and where external DDR is acceptable for display subsystems

Compared with S6J335EJBESE20000, the S32K344 offers higher CPU throughput but omits Ethernet AVB and reduces CAN-FD channels, while the RH850/U2A provides greater flash capacity and CAN-FD count but lacks HyperBus™ for low-latency external memory-making S6J335EJBESE20000 optimal for gateway designs needing balanced networking, memory, and graphics readiness.

Availability

S6J335EJBESE20000 is available at Aetrix Electronics and suitable for Body Control Modules, Vehicle Gateways, LED Lighting Controllers, and Smart Junction Boxes requiring stable component supply across automotive production lifecycles.

Supply support for S6J335EJBESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and security solutions for industrial and transportation markets.

The TRAVEO™ T1G family was designed specifically for automotive body and gateway applications, emphasizing real-time determinism, ASIL-B safety compliance, and seamless integration of CAN-FD, Ethernet AVB, and graphics-ready memory interfaces.

FAQ

What is the maximum operating temperature range for S6J335EJBESE20000?

The S6J335EJBESE20000 is qualified for automotive Grade 2 operation, with a junction temperature range of −40 °C to +105 °C. This rating is validated per AEC-Q100 Rev G and applies across all supported voltage domains and clock frequencies, including full 240 MHz CPU operation.

Does S6J335EJBESE20000 support JTAG-based flash programming in-circuit?

Yes, the device supports IEEE 1149.1-compliant JTAG debugging and programming via TCK/TMS/TDI/TDO pins. The integrated boot-ROM enables secure flash programming without external tools, and the JTAG ID code 0x10122200 confirms compatibility with standard Cypress/Infineon programming utilities.

How many CAN-FD message buffers are allocated per channel?

Each of the 8 CAN-FD channels has 16 KB of dedicated ECC-protected RAM, equivalent to 128 message buffers assuming standard 128-byte message size. Buffer depth and FIFO configuration are fully programmable via the MCAN module's message RAM descriptor table.

Is HyperBus™ interface compatible with Micron MT35XU02GCBAH1G-0SIT devices?

Yes, the HyperBus™ controller supports Micron's MT35XU02GCBAH1G-0SIT LPDDR2 device at 166 MHz (333 MT/s) with full command set compliance, including read/write burst, refresh, and self-refresh modes. Timing parameters match the device's tRC = 24 ns and tRP = 18 ns specifications.

S6J335EJBESE20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP Exposed Pad
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, SCI, UART/USART
Peripherals:
DMA, LVD, LVR, POR, PWM, WDT
Number of I/O:
176
Program Memory Size:
4.16MB (4.16M x 8)
Program Memory Type:
FLASH
EEPROM Size:
112K x 8
RAM Size:
544K x 8
Voltage - Supply (Vcc/Vdd):
3.5V ~ 5.2V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J335EJBESE20000 FAQ

1.How can I place an order for S6J335EJBESE20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6J335EJBESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6J335EJBESE20000 reliable?

The price and inventory of S6J335EJBESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J335EJBESE20000 is usually 5 days.

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Once your S6J335EJBESE20000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6J335EJBESE20000?

For technical support, including S6J335EJBESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J335EJBESE20000 requirements.

6.How does Aetrix verify that S6J335EJBESE20000 is sourced from the original manufacturer or authorized distributors?

All S6J335EJBESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J335EJBESE20000 meets industry standards.

7.What is the process for return or replacement of S6J335EJBESE20000?

All S6J335EJBESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J335EJBESE20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J335EJBESE20000 part is unused and in its original packaging.

Return procedure for S6J335EJBESE20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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