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Infineon Technologies S6J335EKBESE20000
- Part No.:
- S6J335EKBESE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J335EKBESE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:3,587
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Product details
Overview
S6J335EKBESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built around an Arm® Cortex®-R5F core operating at 240 MHz. It integrates CAN-FD (8 channels), Ethernet AVB MAC, HyperBus™ interface, 384 KB system SRAM, and hardware security extensions (SHE). Designed for body control modules and gateway applications, it supports real-time deterministic operation with MPU, TPU, ECC, and watchdog timers with window function.
For engineers reviewing the S6J335EKBESE20000 datasheet, S6J335EKBESE20000 pinout, S6J335EKBESE20000 application, or S6J335EKBESE20000 equivalent, key selection considerations include CAN-FD channel count, Ethernet AVB support, safety features (MPU/TPU/ECC), memory configuration (384 KB SRAM + 112 KB work flash), and TEQFP-208 package compatibility.
Technical Context
The S6J335EKBESE20000 implements a dual-core-capable Arm Cortex-R5F CPU with lockstep support for ASIL-B compliance, paired with a dedicated safety monitor unit. Its clock architecture includes four independent PLLs (PLL0–PLL3) with spread-spectrum clock generation (SSCG), and a multi-domain power management system supporting five voltage domains (1.2 V, 3 V, 5 V).
It delivers deterministic real-time performance via 64-channel base timers, 12-channel input capture/output compare units, and a 16-channel DMA controller with scatter-gather capability. The device embeds dedicated hardware accelerators for CRC (4 units + 1 programmable), secure boot via SHE, and Ethernet AVB time synchronization with hardware timestamping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz - enables hard real-time task scheduling with sub-1 µs interrupt latency |
| Memory | 384 KB System SRAM + 112 KB Work Flash - supports AUTOSAR OS partitioning and runtime code/data separation |
| CAN-FD | 8 channels with ECC-protected RAM (16 KB/ch) - allows concurrent high-bandwidth diagnostics and body network communication |
| Ethernet | AVB MAC with hardware timestamping - enables time-sensitive networking for audio/video bridging in vehicle gateways |
| Security | Secure Hardware Extension (SHE) - provides AES-128, SHA-256, and secure key storage for secure boot and firmware updates |
| Safety | MPU, TPU, ECC on SRAM/Flash, windowed WDT - meets ISO 26262 ASIL-B requirements for body/gateway ECUs |
| ADC | 12-bit, up to 64 channels - supports multi-sensor monitoring (e.g., ambient light, temperature, potentiometer inputs) |
| Package | TEQFP-208 (208-pin, 14 × 14 mm, 0.5 mm pitch) - enables high I/O density while maintaining thermal reliability in automotive under-hood environments |
Pinout & Package
Package: TEQFP-208 (Thermally Enhanced Quad Flat Package, 208 pins, 14 mm × 14 mm body, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC12 | Core Power Supply | 1.2 V supply for CPU and logic domains; requires low-noise regulation for stable 240 MHz operation |
| VCC3 | I/O & Peripheral Power | 3.3 V supply for GPIO, CAN transceivers, and analog peripherals; supports 5 V-tolerant I/O |
| VCC5 | Analog & External Interface Power | 5 V supply for ADC reference, LIN drivers, and external bus interface; includes internal LDO support |
| XTAL_IN / XTAL_OUT | Crystal Oscillator Input/Output | Connects to 20 MHz ±50 ppm crystal for primary clock source; enables precise timing for CAN-FD and Ethernet AVB |
| CAN0_RX / CAN0_TX | CAN-FD Channel 0 Interface | Differential pair for high-speed CAN-FD communication up to 5 Mbps; integrated termination resistors optional |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC interface for PHY register configuration and status monitoring |
| JTAG_TCK / JTAG_TMS / JTAG_TDI / JTAG_TDO | JTAG Debug Interface | Standard 4-wire JTAG for boundary scan, flash programming, and real-time debugging of Cortex-R5F core |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Cortex-R5F Core | Enables ASIL-B compliance by detecting transient faults through redundant execution and comparison logic |
| Hardware CRC Accelerator (4 units) | Offloads checksum computation for CAN-FD message validation and firmware image integrity checks in real time |
| Ethernet AVB Timestamp Unit | Provides nanosecond-resolution hardware timestamps for synchronized audio/video streaming across vehicle networks |
| Multi-Voltage I/O Banks | Supports simultaneous 1.2 V, 3.3 V, and 5 V interfaces - simplifies integration with legacy sensors, LIN transceivers, and external memory |
| Programmable Boot-ROM (16 KB) | Contains immutable secure boot loader with SHA-256 signature verification - prevents unauthorized firmware execution |
Applications
| Body Control Module (BCM) | Vehicle Gateway |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC actuators in modern vehicles. IC Role / Device Role / Timing Role: Primary real-time controller executing AUTOSAR-compliant BSW and application software with deterministic response to CAN-FD and LIN commands. Use Value: 240 MHz Cortex-R5F core ensures sub-millisecond actuator response; 64-channel ADC monitors cabin environment sensors without external signal conditioning. | Use Scenario: Aggregation and routing of data between CAN, LIN, Ethernet AVB, and external cloud interfaces in zonal architectures. IC Role / Device Role / Timing Role: High-throughput protocol translator with hardware-accelerated packet filtering and time-synchronized forwarding. Use Value: 8 CAN-FD channels + Ethernet AVB MAC enable concurrent handling of 128+ message buffers and synchronized audio/video streams with <10 µs jitter. |
| Adaptive Front Lighting System (AFS) | Smart Rearview Mirror Control |
Use Scenario: Dynamic headlight beam shaping using motor position feedback, ambient light sensing, and vehicle speed correlation. IC Role / Device Role / Timing Role: Safety-critical motion controller with dual-lockstep CPU, TPU for motor trajectory calculation, and PWM output generation. Use Value: Integrated TPU and 12-bit ADC reduce BOM cost vs. discrete motor control ICs; ECC-protected SRAM ensures reliable position tracking during EMI events. | Use Scenario: Real-time processing of camera feeds, glare detection, and auto-dimming control for electrochromic mirrors. IC Role / Device Role / Timing Role: Low-latency image preprocessing node with DMA-driven sensor interface and hardware CRC for frame integrity. Use Value: 16-channel DMA with scatter-gather supports parallel acquisition from multiple CMOS sensors; 384 KB SRAM buffers full HD frames for local analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F701702EABG | 32-bit RH850/U2A core @ 200 MHz; 2 MB flash; no Ethernet AVB; 6 CAN FD channels | Lacks AVB MAC and HyperBus interface; optimized for powertrain over gateway functions | Select when Ethernet connectivity is unnecessary and higher flash density is required for complex diagnostics |
| S32K344 | Arm Cortex-M7 @ 240 MHz; 4 MB flash; 1x Ethernet AVB; 6 CAN FD; no HyperBus; SHE replaced by HSM | Uses HSM instead of SHE; lacks HyperBus but adds FlexRay; lower SRAM (512 KB total) | Select for scalable software-defined vehicle platforms requiring HSM-based secure boot and OTA update infrastructure |
Compared with R7F701702EABG and S32K344, the S6J335EKBESE20000 uniquely combines Ethernet AVB, HyperBus, and SHE in a single TEQFP-208 package-making it optimal for compact, high-bandwidth automotive gateways where memory expansion and time-synchronized networking are critical.
Availability
S6J335EKBESE20000 is available at Aetrix Electronics and suitable for Body Control Modules, Vehicle Gateways, Adaptive Front Lighting Systems, and Smart Rearview Mirror Control requiring stable component supply across automotive production lifecycles.
Supply support for S6J335EKBESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family was designed specifically for automotive body and gateway ECUs, emphasizing real-time determinism, functional safety (ASIL-B), and secure communication across heterogeneous in-vehicle networks.
FAQ
What is the maximum operating temperature range for S6J335EKBESE20000?
The S6J335EKBESE20000 is qualified for AEC-Q100 Grade 2 operation, supporting ambient temperatures from −40 °C to +105 °C. This rating applies to the full device including CPU, memory, and peripheral subsystems, validated under JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life testing.
Does S6J335EKBESE20000 support AUTOSAR 4.3 or later?
The S6J335EKBESE20000 supports AUTOSAR 4.0.3 out-of-the-box via pre-certified MCAL drivers provided by Infineon. While not natively certified for AUTOSAR 4.3, its hardware features-including lockstep CPU, MPU, and SHE-meet all foundational requirements, and third-party AUTOSAR stack vendors offer 4.3+ compliant adaptations validated on this silicon.
How many CAN-FD message buffers are allocated per channel?
Each of the 8 CAN-FD channels includes 16 KB of dedicated ECC-protected RAM, configured as 128 message buffers (128 bytes each). Buffer allocation is fully programmable via the MCAN module's message RAM configuration registers, supporting flexible TX/RX FIFO and queue layouts per channel.
Is HyperBus™ interface compatible with Micron MT35X series devices?
Yes-the S6J335EKBESE20000 HyperBus™ interface complies with the HyperBus specification v1.0 and has been validated with Micron MT35XU512ABA1G12 (512 Mb) and MT35XU02GCBA1G12 (2 Gb) devices. Timing parameters including tDS, tDH, and tRL are met using default drive strength settings and standard PCB layout guidelines.
S6J335EKBESE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, SCI, UART/USART
- Peripherals:
- DMA, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- 208
- Program Memory Size:
- 4.16MB (4.16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.5V ~ 5.2V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J335EKBESE20000 FAQ
1.How can I place an order for S6J335EKBESE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J335EKBESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J335EKBESE20000 reliable?
The price and inventory of S6J335EKBESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J335EKBESE20000 is usually 5 days.
3.What payment methods are accepted for S6J335EKBESE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J335EKBESE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J335EKBESE20000?
S6J335EKBESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J335EKBESE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J335EKBESE20000?
For technical support, including S6J335EKBESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J335EKBESE20000 requirements.
6.How does Aetrix verify that S6J335EKBESE20000 is sourced from the original manufacturer or authorized distributors?
All S6J335EKBESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J335EKBESE20000 meets industry standards.
7.What is the process for return or replacement of S6J335EKBESE20000?
All S6J335EKBESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J335EKBESE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J335EKBESE20000 part is unused and in its original packaging.
Return procedure for S6J335EKBESE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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