Infineon Technologies S6J335EKSESE20000
- Part No.:
- S6J335EKSESE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J335EKSESE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:

- Shipping:

Inventory:4,633
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J335EKSESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built on the Arm® Cortex®-R5F core operating at 240 MHz. It integrates CAN-FD (8 channels), Ethernet AVB MAC, HyperBus™ interface, 12-bit ADC (64 channels), and hardware security extensions (SHE). Designed for body control modules and gateway applications, it supports AUTOSAR 4.0.3 and delivers real-time performance with ECC-protected memory and safety features including MPU, TPU, and windowed watchdog.
For engineers reviewing the S6J335EKSESE20000 datasheet, S6J335EKSESE20000 pinout, S6J335EKSESE20000 application, or S6J335EKSESE20000 equivalent, key selection criteria include CAN-FD channel count, real-time interrupt latency, integrated Ethernet AVB support, SHE-based secure boot capability, and TEQFP-208 package compatibility with automotive-grade thermal and EMI requirements.
Technical Context
The S6J335EKSESE20000 implements a dual-core-capable Arm Cortex-R5F CPU with lockstep option, running at up to 240 MHz with 16 KB instruction and 16 KB data cache. Its memory subsystem includes 4,160 KB program Flash, 112 KB work Flash, 384 KB system SRAM, and 32 KB backup RAM - all with ECC support where applicable.
It features five independent power domains, integrated LDOs for 5 V/3 V/1.2 V supplies, clock supervision across all source clocks, and hardware-accelerated cryptographic services via Secure Hardware Extension (SHE). The device supports deterministic real-time execution through programmable timers (6 × 32-bit reload, 8 × 32-bit free-run), 24-channel external interrupts, and low-latency DMA (16 channels).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz - enables hard real-time deterministic execution with FPU, MPU, and TPU for ASIL-B compliance. |
| Memory | 4,160 KB Program Flash + 384 KB System SRAM - sufficient for AUTOSAR OS, complex gateway routing stacks, and OTA update staging. |
| Communication | 8× CAN-FD + 1× Ethernet AVB MAC - supports high-bandwidth vehicle network bridging between CAN FD domains and time-synchronized audio/video streams. |
| Analog Peripherals | 12-bit ADC with 64 input channels - allows simultaneous monitoring of multiple body sensors (e.g., ambient light, temperature, position feedback). |
| Security | Secure Hardware Extension (SHE) - provides AES-128, SHA-256, and secure key storage for secure boot and firmware authentication per ISO/SAE 21434. |
| Safety Features | MPU, TPU, ECC on Flash/SRAM, windowed WDT - meets functional safety requirements for ASIL-B decomposition in body/gateway systems. |
| Package | TEQFP-208 (208-pin Thin Quad Flat Package) - automotive-qualified, 0.4 mm pitch, JEDEC MS-026 compliant with 26.0 × 26.0 mm footprint. |
Pinout & Package
Package: TEQFP-208 (208-pin Thin Quad Flat Package), 0.4 mm pitch, 26.0 × 26.0 mm body size, lead-free and RoHS-compliant, qualified per AEC-Q100 Grade 2 (−40 °C to +105 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53 | 5 V Power Supply | Dual 5 V inputs for I/O and analog circuitry - supports separate noise isolation paths for CAN transceivers and ADC reference. |
| VCC3 / VCC53 | 3 V Power Supply | 3.3 V domain for digital logic and communication peripherals - decoupled from 5 V rails to reduce cross-talk in mixed-voltage systems. |
| VCC12 | 1.2 V Core Supply | Core voltage for Cortex-R5F and internal buses - supplied by on-chip LDO; monitored by low-voltage detector for safe shutdown. |
| CLKIN / CLKOUT | External Clock Interface | Supports crystal or external oscillator input (1–20 MHz); CLKOUT provides buffered clock for trace/debug or peripheral synchronization. |
| TMS / TCK / TDI / TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary scan and debug access - enables production testing, flash programming, and real-time trace via SWD/JTAG. |
| CANFD0_RX / CANFD0_TX | CAN-FD Channel 0 I/O | Differential pair for CAN-FD physical layer - supports bit rates up to 5 Mbps and flexible data phase arbitration per ISO 11898-1:2015. |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC bus - used to configure Ethernet AVB PHY registers and monitor link status. |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet AVB Data Bus | 8-bit parallel RMII-compatible interface - enables full-duplex 100BASE-TX operation with AVB time synchronization (gPTP). |
Key Features
| Feature | Design Value |
|---|---|
| Arm Cortex-R5F with Lockstep Option | Enables ASIL-B compliant fault detection via dual-core comparison without software overhead. |
| Integrated Ethernet AVB MAC | Hardware timestamping and gPTP support eliminate external PHY dependency for time-critical audio/video bridging. |
| HyperBus™ Memory Interface | Single-ended 8-bit DDR interface supporting up to 333 MB/s - reduces PCB layer count vs. parallel NOR/NAND while maintaining low latency. |
| Secure Hardware Extension (SHE) | On-chip AES-128/SHA-256 engine with protected key storage - satisfies UNECE R155 CSMS requirements for secure firmware updates. |
| Real-Time Peripheral Set | 64-channel base timer + 24-channel external interrupt + 16-channel DMA - ensures sub-1 µs response to critical body/gateway events (e.g., door latch, lighting dimming). |
Applications
| Body Control Module (BCM) | Automotive Gateway |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in modern vehicles. IC Role / Device Role / Timing Role: Primary real-time controller managing 148 GPIOs, 64 ADC inputs, and 8 CAN-FD channels for sensor/actuator coordination. Use Value: Enables deterministic response (<10 µs jitter) to safety-critical inputs (e.g., crash signal) while supporting multi-zone PWM lighting control via OCU units. |
Use Scenario: Aggregation and routing of data between CAN FD, LIN, and Ethernet AVB networks in zonal architectures. IC Role / Device Role / Timing Role: Network bridge with hardware-accelerated packet filtering, time-synchronized forwarding, and secure OTA update handling. Use Value: Reduces host CPU load by offloading Ethernet AVB timestamping and CAN FD message buffering (128 msg/ch), enabling <50 µs end-to-end latency. |
| Adaptive Front Lighting System (AFS) | In-Cabin Ambient Lighting Control |
|
Use Scenario: Dynamic headlight beam shaping based on steering angle, speed, and camera input in premium vehicles. IC Role / Device Role / Timing Role: Real-time motion controller interfacing with motor drivers, IMU, and camera preprocessor via SPI and GPIO. Use Value: Achieves 240 MHz deterministic loop execution for closed-loop servo control with sub-degree angular resolution using 12-bit ADC and FRT timers. |
Use Scenario: RGBW LED dimming and color mixing synchronized with vehicle mood settings and ambient light conditions. IC Role / Device Role / Timing Role: Dedicated lighting controller generating 16+ PWM outputs with phase-shifted timing to eliminate flicker. Use Value: Uses 12 OCU channels and 8 free-run timers to drive 16 independent LED strings at 1–20 kHz with <1% duty cycle error across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Arm Cortex-M7 @ 320 MHz; no integrated Ethernet AVB MAC; includes HSE security module instead of SHE. | Lacks native AVB support - requires external PHY and software gPTP stack; better suited for CAN/LIN-only gateways. | Select when higher single-thread CPU throughput is prioritized over integrated Ethernet timing and lower BOM cost. |
| Renesas RH850/U2A | 32-bit proprietary core @ 400 MHz; 10× CAN FD; no HyperBus interface; supports Gb Ethernet but not AVB-specific hardware acceleration. | Stronger CAN FD scalability but lacks AVB timestamping hardware - increases software complexity for time-sensitive audio routing. | Select for high-channel-count body domain controllers where CAN FD bandwidth > Ethernet AVB integration priority. |
Compared with S32K344 and RH850/U2A, the S6J335EKSESE20000 uniquely combines Arm Cortex-R5F real-time determinism, integrated Ethernet AVB MAC with hardware timestamping, and SHE-based secure boot - making it optimal for ASIL-B gateway designs requiring time-synchronized networking and minimal external components.
Availability
S6J335EKSESE20000 is available at Aetrix Electronics and suitable for Body Control Modules, Automotive Gateways, Adaptive Front Lighting Systems, and In-Cabin Ambient Lighting Control requiring stable component supply across extended automotive product lifecycles.
Supply support for S6J335EKSESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family - including S6J335EKSESE20000 - was designed specifically for automotive body and gateway applications demanding real-time performance, functional safety (ASIL-B), and integrated networking (CAN-FD + Ethernet AVB).
FAQ
What is the maximum operating temperature range for S6J335EKSESE20000?
The S6J335EKSESE20000 is qualified per AEC-Q100 Grade 2, supporting continuous operation from −40 °C to +105 °C ambient temperature. Junction temperature limits are defined in the Thermal Characteristics section (Section 9.1.12 of datasheet 002-10634 Rev. *M), with derating applied above 105 °C ambient based on package thermal resistance (θJA = 22.5 °C/W).
Does S6J335EKSESE20000 support AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR 4.0.3-compliant MCAL drivers (including CAN, ETH, ADC, DIO, ICU, and GPT) and basic software modules for S6J335EKSESE20000. These are delivered via the TRAVEO™ T1G AUTOSAR Development Kit and validated with leading RTOS vendors including ETAS RTA-OS and Vector MICROSAR.
How is the Secure Hardware Extension (SHE) implemented in this MCU?
The SHE block in S6J335EKSESE20000 is a dedicated hardware accelerator supporting AES-128 encryption/decryption, SHA-256 hashing, and secure key generation/storage. It interfaces directly with the CPU via APB bus and supports secure boot flow including ROM-based bootloader verification and encrypted image decryption before execution.
Can S6J335EKSESE20000 operate without an external crystal?
Yes - the device includes an embedded CR oscillator with selectable frequencies (100 kHz slow clock and 4 MHz fast clock), enabling crystal-free operation for non-timing-critical functions. However, CAN-FD and Ethernet AVB require precise clock sources; for those, an external 20 MHz crystal or oscillator must be used with PLL0/PLL1 to generate required system clocks.
S6J335EKSESE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, SCI, UART/USART
- Peripherals:
- DMA, LVD, LVR, POR, PWM, WDT
- Number of I/O:
- 208
- Program Memory Size:
- 4.16MB (4.16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.5V ~ 5.2V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J335EKSESE20000 FAQ
1.How can I place an order for S6J335EKSESE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J335EKSESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J335EKSESE20000 reliable?
The price and inventory of S6J335EKSESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J335EKSESE20000 is usually 5 days.
3.What payment methods are accepted for S6J335EKSESE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J335EKSESE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J335EKSESE20000?
S6J335EKSESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J335EKSESE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J335EKSESE20000?
For technical support, including S6J335EKSESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J335EKSESE20000 requirements.
6.How does Aetrix verify that S6J335EKSESE20000 is sourced from the original manufacturer or authorized distributors?
All S6J335EKSESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J335EKSESE20000 meets industry standards.
7.What is the process for return or replacement of S6J335EKSESE20000?
All S6J335EKSESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J335EKSESE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J335EKSESE20000 part is unused and in its original packaging.
Return procedure for S6J335EKSESE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J335EKSESE20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

