My Inquiry
My Account
Infineon Technologies S6J336AHEBSC20000
- Part No.:
- S6J336AHEBSC20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
S6J336AHEBSC20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:4,053
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J336AHEBSC20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control, featuring CAN FD interface, Secure Hardware Extension (SHE), ASIL-B compliance, and operation from –40 °C to 105 °C.
For engineers reviewing the S6J336AHEBSC20000 datasheet, S6J336AHEBSC20000 pinout, S6J336AHEBSC20000 application, or S6J336AHEBSC20000 equivalent, key selection criteria include TC-Flash size (2,112 KB), dual RAM banks (TC-RAM/System-RAM, each 128 KB), 144-pin TEQFP-0.4 mm package, 132 MHz core clock, and integrated LCD controller with 4 COM × 32 SEG support.
Technical Context
This MCU implements a dual-bus architecture with HPM and LLPM domains, enabling concurrent high-performance and low-power peripheral operation. It integrates dedicated safety mechanisms including MPU, TPU, ECC-protected RAM, and hardware watchdog timers aligned with ISO 26262 ASIL-B requirements.
The device supports flexible clocking via PLL0/Expand PLL/SSCG, provides 48-channel 12-bit ADC with partial wake-up capability, and delivers deterministic real-time response through low-latency interrupt handling and 16-channel DMA with configurable priority.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F, 132 MHz max - enables hard real-time execution for cluster graphics and CAN FD message scheduling. |
| Flash Memory | TC-Flash: 2,112 KB / Work-Flash: 112 KB - supports dual-bank firmware updates and secure boot code separation. |
| RAM | TC-RAM: 128 KB / System-RAM: 128 KB (incl. 24 KB backup area) - accommodates display frame buffers and safety-critical runtime data. |
| Operating Temp | –40 °C to +105 °C - qualified for under-hood and dashboard mounting in automotive environments. |
| Package | TEQFP-144, 0.4 mm pitch - provides mechanical robustness and thermal performance for automotive PCB layouts. |
| Security | Secure Hardware Extension (SHE) - enables AES-128 encryption, secure key storage, and authenticated boot per UNECE R155. |
| Peripheral Interface | 4× CAN FD channels (128-message buffer/ch) - supports high-bandwidth vehicle network communication with payload up to 64 bytes. |
Pinout & Package
Package: TEQFP-144 (0.4 mm pitch), RoHS-compliant, automotive-qualified plastic quad flat package with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53_1 | Main power supply (5.0 V ± 0.5 V or 3.3 V ± 0.3 V) | Supplies CPU core, flash, and system logic; supports dual-voltage configuration for mixed-signal integration. |
| AVCC5 | Analog power supply | Isolates ADC and analog peripherals from digital noise; requires separate filtering per layout guidelines. |
| XTALIN / XTALOUT | External crystal oscillator input/output | Supports 4 MHz crystal for precision clock generation; internal slow clock (100 kHz) available for RTC during sleep. |
| TRST#, TCK, TMS, TDI, TDO | JTAG debug interface signals | Enables boundary scan, flash programming, and real-time debugging without halting safety-critical tasks. |
| TXD0 / RXD0 | MFS0 UART channel I/O | Configurable as LIN physical layer interface or diagnostic serial link per ISO 14229. |
| AD0–AD47 | Analog input channels | 48-channel 12-bit ADC with programmable sampling trigger and partial wake-up capability for sensor monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B compliant safety architecture | Integrated MPU, TPU, ECC on RAM/Flash, and lockstep-capable peripherals meet ISO 26262 Part 6 requirements. |
| Dual-domain power management | Three independent power domains (PD1/PD2/PD4) enable selective peripheral shutdown while retaining RTC and wake-up functionality. |
| Segment LCD controller | Drives up to 4 COM × 32 SEG displays directly - eliminates external driver ICs in analog gauge clusters. |
| Sound waveform generator | 5-output unit supporting audible alerts and chimes without external audio codec - reduces BOM count. |
| Multi-function serial interface (MFS) | 12 configurable channels supporting UART, CSIO, LIN, and I²C - simplifies connectivity to sensors, actuators, and body ECUs. |
Applications
| Digital Instrument Cluster | Automotive Head-Up Display (HUD) Control |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, fuel level, and warning icons on TFT or segmented LCD dashboards. IC Role / Device Role / Timing Role: Primary cluster controller managing graphics pipeline, CAN FD telemetry ingestion, and indicator PWM timing. Use Value: 132 MHz Cortex-R5F core and 2,112 KB TC-Flash enable seamless animation and over-the-air update partitioning. | Use Scenario: Driving projection alignment, brightness adaptation, and vehicle status overlay on windshield-projected HUDs. IC Role / Device Role / Timing Role: Timing-critical HUD subsystem controller synchronizing image refresh with vehicle motion data from CAN FD. Use Value: 48-channel ADC and 12-bit resolution allow precise ambient light and temperature sensing for dynamic contrast adjustment. |
| Electronic Parking Brake (EPB) Interface Module | Vehicle Configuration & Personalization Unit |
Use Scenario: Interfacing with EPB motor drivers, brake position sensors, and vehicle stability systems via CAN FD. IC Role / Device Role / Timing Role: Safety-monitored interface node executing ASIL-B diagnostics and fail-safe actuation commands. Use Value: SHE module secures firmware integrity and cryptographic key storage for EPB activation authorization. | Use Scenario: Storing and applying driver-specific settings (seat position, mirror angle, climate presets) across vehicle domains. IC Role / Device Role / Timing Role: Non-volatile configuration manager using System-RAM backup area and encrypted flash sectors. Use Value: 24 KB backup RAM (16+8 KB) retains user profiles during ignition-off periods without external battery backup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7016863AFP#AA0 (Renesas) | 32-bit RH850/U2A core, 200 MHz, 2 MB flash, no integrated LCD controller | Requires external segment driver; stronger focus on powertrain control than cluster UI | Select when higher CPU throughput is needed and LCD driving is handled externally. |
| SPC58EC80E5 (STMicroelectronics) | Power Architecture e200z4, 180 MHz, 4 MB flash, ASIL-D capable, no SHE | Lacks hardware crypto acceleration; targets gateway/routing rather than display-centric functions | Select for multi-domain gateway roles where CAN FD routing and firewalling outweigh display integration needs. |
Compared with R7F7016863AFP#AA0 and SPC58EC80E5, S6J336AHEBSC20000 uniquely combines ASIL-B safety, SHE-based security, and native 4×32 segment LCD control in a single 144-pin TEQFP package-reducing system-level complexity for cost-sensitive instrument clusters.
Availability
S6J336AHEBSC20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, HUD control units, and electronic parking brake interface modules requiring stable component supply across extended product lifecycles.
Supply support for S6J336AHEBSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G series - including S6J336AHEBSC20000 - was developed to deliver scalable, safety-certified microcontrollers for automotive human-machine interface (HMI) applications, particularly digital instrument clusters and central display units.
FAQ
What is the maximum operating frequency of the Arm® Cortex®-R5F core in S6J336AHEBSC20000?
The core operates at up to 132 MHz, verified under recommended conditions (VCC5 = 5.0 V ± 0.5 V, TA = –40 °C to 105 °C). This frequency is sustained across the full automotive temperature range and supports deterministic execution of real-time cluster tasks including CAN FD message processing and LCD refresh scheduling.
Does S6J336AHEBSC20000 support CAN FD with bit rate switching?
Yes - it integrates four independent CAN FD controllers compliant with ISO 11898-1:2015, each supporting data rates up to 5 Mbps in the fast phase and arbitration rates up to 1 Mbps. Bit rate switching is implemented in hardware and managed by the CAN FD protocol engine without CPU intervention.
How is the Secure Hardware Extension (SHE) implemented in this MCU?
SHE is a dedicated on-die cryptographic module supporting AES-128 encryption/decryption, SHA-256 hashing, and secure key generation/storage. It operates independently of the main CPU, uses hardened memory protection, and interfaces via APB bus with access controlled by the PPU - meeting UNECE R155 cybersecurity management system requirements.
What LCD panel configurations does the integrated segment controller support?
The built-in segment LCD controller drives up to 4 common lines and 32 segment lines (4 × 32), supporting static, 2-mux, 3-mux, and 4-mux multiplexing. It includes charge pump output, contrast voltage control, and blinking control - enabling direct drive of analog gauges and warning indicators without external bias circuitry.
S6J336AHEBSC20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 132MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 94
- Program Memory Size:
- 112KB (112K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J336AHEBSC20000 FAQ
1.How can I place an order for S6J336AHEBSC20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J336AHEBSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J336AHEBSC20000 reliable?
The price and inventory of S6J336AHEBSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336AHEBSC20000 is usually 5 days.
3.What payment methods are accepted for S6J336AHEBSC20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J336AHEBSC20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J336AHEBSC20000?
S6J336AHEBSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J336AHEBSC20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J336AHEBSC20000?
For technical support, including S6J336AHEBSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336AHEBSC20000 requirements.
6.How does Aetrix verify that S6J336AHEBSC20000 is sourced from the original manufacturer or authorized distributors?
All S6J336AHEBSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336AHEBSC20000 meets industry standards.
7.What is the process for return or replacement of S6J336AHEBSC20000?
All S6J336AHEBSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336AHEBSC20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J336AHEBSC20000 part is unused and in its original packaging.
Return procedure for S6J336AHEBSC20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J336AHEBSC20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
