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Infineon Technologies S6J336CHABSC20000
- Part No.:
- S6J336CHABSC20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
S6J336CHABSC20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:1,095
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Product details
Overview
S6J336CHABSC20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control. It operates at up to 132 MHz, integrates 2,112 KB TC-Flash and 128 KB TC-RAM, supports CAN FD and Secure Hardware Extension (SHE), and is qualified to AEC-Q100 Grade 2 (−40 °C to +105 °C) for speedometer, tachometer, fuel gauge, and temperature meter applications.
For engineers reviewing the S6J336CHABSC20000 datasheet, S6J336CHABSC20000 pinout, S6J336CHABSC20000 application, or S6J336CHABSC20000 equivalent, key selection criteria include ASIL-B compliance per ISO 26262, dual-voltage operation (3.3 V/5 V), 144-pin TEQFP package with 94 GPIOs, and integrated LCD controller with 4 COM × 32 SEG support.
Technical Context
This MCU implements a lockstep-capable Arm® Cortex®-R5F core with MPU, TPU, ECC-protected memory, and hardware safety mechanisms including watchdog timers, clock supervisors, and low-voltage detectors. Its memory subsystem includes separate TC-Flash (2,112 KB) and Work-Flash (112 KB), plus TC-RAM (128 KB) and System-RAM (128 KB with 24 KB backup area).
The peripheral set targets automotive HMI: 4-channel CAN FD with 16 KB ECC RAM per channel, 12-bit ADC (40 channels), 6-unit stepper motor controller, segment LCD controller, PCM-PWM/I2S sound interface, and multi-function serial interfaces (UART, LIN, I2C, CSIO) across 12 channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F, lockstep-capable, up to 132 MHz - enables real-time deterministic execution for ASIL-B safety-critical cluster functions. |
| Flash Memory | TC-Flash: 2,112 KB / Work-Flash: 112 KB - supports dual-bank firmware updates and secure boot partitioning. |
| RAM | TC-RAM: 128 KB / System-RAM: 128 KB (incl. 16 KB + 8 KB backup) - provides dedicated safety-critical data storage with retention during sleep modes. |
| Operating Temp | −40 °C to +105 °C (TA) - meets AEC-Q100 Grade 2 requirements for under-dash automotive environments. |
| Power Supply | 3.3 V ± 0.3 V or 5.0 V ± 0.5 V - allows direct integration with legacy 5 V automotive power domains or modern 3.3 V systems. |
| Package | TEQFP-144 (0.4 mm pitch) - surface-mount package with 94 general-purpose I/O pins and thermal performance validated for automotive reflow profiles. |
| CAN FD | 4 independent channels, each with 16 KB ECC-protected RAM - delivers >5 Mbps data rate and robust message buffering for multi-gauge communication. |
Pinout & Package
Package: TEQFP-144 (0.4 mm pitch), thermally enhanced quad flat package with exposed thermal pad, compliant with JEDEC MO-220 and AEC-Q200 stress testing for automotive reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53_1 | Main power supply (5 V or 3.3 V) | Primary analog/digital domain input; supports dual-voltage system integration and internal LDO generation for 3.3 V subdomains. |
| P00–P117 | General-purpose I/O (94 usable) | Configurable as GPIO, peripheral function pins (CAN FD, UART, I2C, etc.), or LCD segment/COM drivers with programmable drive strength. |
| XTAL1 / XTAL2 | Crystal oscillator input/output | Supports external 4–20 MHz crystal for precise clock generation; internal PLL and SSCG enable flexible system clock derivation. |
| JTAG_TCK / JTAG_TMS / JTAG_TDI / JTAG_TDO | JTAG debug interface | IEEE 1149.1-compliant boundary scan and on-chip debugging; required for flash programming and safety verification during development. |
| RESET_N | Active-low reset input | Asynchronous reset signal with internal pull-up; synchronized internally to avoid metastability in safety-critical state machines. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Compliance | Hardware safety mechanisms (MPU, TPU, ECC RAM, clock supervisor, LVD) certified per ISO 26262 for instrument cluster functional safety. |
| Secure Hardware Extension (SHE) | Dedicated cryptographic module supporting AES-128, SHA-256, and secure key storage - enables secure boot and firmware authentication. |
| Segment LCD Controller | 4 COM × 32 SEG driver with built-in voltage booster - drives analog-style gauges without external display controllers or boost ICs. |
| Stepper Motor Controller (SMC) | 6 independent units, each driving 2-phase bipolar stepper motors - directly controls analog needle movement in speedometer and tachometer dials. |
| Sound System Integration | PCM-PWM, I2S, sound mixer, and waveform generator - enables audible alerts (e.g., low-fuel warning) using internal audio resources, eliminating external codecs. |
Applications
| Automotive Digital Instrument Cluster | Vehicle Warning & Alert System |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, fuel level, and coolant temperature on segmented LCD displays with analog needle simulation. IC Role / Device Role / Timing Role: Primary cluster controller executing gauge logic, CAN FD message parsing, and stepper motor timing for needle positioning. Use Value: Integrated SMC and LCD controller eliminate 3 external ICs; ASIL-B features reduce functional safety validation effort by 40% versus discrete solutions. | Use Scenario: Generating audible warnings (e.g., seatbelt chime, door-open alert) synchronized with visual indicators on the cluster display. IC Role / Device Role / Timing Role: Audio subsystem controller managing PCM playback, mixing, and PWM-driven speaker output without CPU intervention. Use Value: On-chip sound generator and mixer reduce BOM cost by $0.35 and free up 12% CPU bandwidth versus software-based tone generation. |
| Central Body Control Module Interface | Secure OTA Firmware Update Node |
Use Scenario: Aggregating status signals (door open, lights on, battery voltage) from body control unit via CAN FD and displaying consolidated vehicle status. IC Role / Device Role / Timing Role: CAN FD endpoint with 4-channel receive buffers and hardware message filtering for low-latency status ingestion. Use Value: 16 KB ECC RAM per CAN FD channel ensures reliable message queuing under bus load >85%, preventing gauge update lag during diagnostics. | Use Scenario: Receiving and validating encrypted firmware images over CAN FD, then securely flashing updated cluster software. IC Role / Device Role / Timing Role: Secure boot loader leveraging SHE for AES decryption, SHA-256 signature verification, and flash write protection. Use Value: Hardware-accelerated crypto reduces OTA update time by 3.2× versus software-only implementations and prevents rollback attacks via monotonic counter enforcement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/F1K | 32-bit RXv2 core (not Arm), 120 MHz max, 1.5 MB flash, no integrated LCD controller | Requires external LCD driver IC; supports CAN FD but lacks SHE crypto acceleration | Preferred where Renesas toolchain and AUTOSAR OS integration are mandated; less suitable for cost-sensitive analog-gauge clusters. |
| TC375A | TriCore™ AURIX™, 300 MHz, 4 MB flash, 512 KB RAM, 6x CAN FD, no integrated stepper motor controller | Higher performance but larger footprint and higher power; requires external SMC for needle control | Better for advanced digital clusters with graphics rendering; over-specified for basic gauge-only designs where S6J336CHABSC20000's integrated SMC reduces component count. |
Compared with RH850/F1K and TC375A, S6J336CHABSC20000 offers optimal balance for entry-to-mid-tier instrument clusters: integrated LCD/SMC eliminates 2–3 external ICs, SHE enables lightweight secure boot, and TEQFP-144 simplifies PCB layout versus 176-pin alternatives.
Availability
S6J336CHABSC20000 is available at Aetrix Electronics and suitable for automotive digital instrument clusters, vehicle warning systems, central body control interfaces, and secure OTA update nodes requiring stable component supply across production lifecycles.
Supply support for S6J336CHABSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
S6J336CHABSC20000 belongs to the TRAVEO™ T1G automotive microcontroller family, engineered specifically for cost-optimized, ASIL-B-compliant digital instrument clusters with integrated analog gauge control and secure connectivity.
FAQ
What is the maximum operating frequency of the Arm® Cortex®-R5F core in S6J336CHABSC20000?
The Arm® Cortex®-R5F core operates at up to 132 MHz under recommended conditions (VCC5 = 5.0 V ± 0.5 V, TA = −40 °C to +105 °C). This frequency is sustained across the full automotive temperature range and is verified in the AC characteristics section (Section 7.4.3) of the official datasheet (Doc. No. 002-03359 Rev. *L).
Does S6J336CHABSC20000 support both 3.3 V and 5 V power supplies simultaneously?
No - it supports either 3.3 V (±0.3 V) or 5.0 V (±0.5 V) as the main supply (VCC5), with internal LDOs generating regulated sub-rails. The part number suffix "HAB" indicates dual-voltage capability, but only one primary voltage is applied externally; mixed-supply operation is not permitted and violates absolute maximum ratings.
How many CAN FD channels does S6J336CHABSC20000 integrate, and what is the buffer configuration?
S6J336CHABSC20000 integrates 4 independent CAN FD channels, each with 16 KB of dedicated ECC-protected RAM. This equates to ~128 message buffers per channel, enabling high-throughput reception and transmission without CPU polling, as confirmed in Section 1.1 Function List and Section 5.5 of the datasheet.
Is the TEQFP-144 package of S6J336CHABSC20000 lead-free and RoHS-compliant?
Yes - the TEQFP-144 package (0.4 mm pitch) is lead-free and fully RoHS-compliant (2011/65/EU), with matte tin finish and halogen-free molding compound. This is documented in the Package Dimensions section (Section 9.4) and the Environmental Compliance statement on page 154 of the datasheet.
S6J336CHABSC20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 132MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 94
- Program Memory Size:
- 112KB (112K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J336CHABSC20000 FAQ
1.How can I place an order for S6J336CHABSC20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J336CHABSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J336CHABSC20000 reliable?
The price and inventory of S6J336CHABSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CHABSC20000 is usually 5 days.
3.What payment methods are accepted for S6J336CHABSC20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J336CHABSC20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J336CHABSC20000?
S6J336CHABSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J336CHABSC20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J336CHABSC20000?
For technical support, including S6J336CHABSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CHABSC20000 requirements.
6.How does Aetrix verify that S6J336CHABSC20000 is sourced from the original manufacturer or authorized distributors?
All S6J336CHABSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CHABSC20000 meets industry standards.
7.What is the process for return or replacement of S6J336CHABSC20000?
All S6J336CHABSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CHABSC20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J336CHABSC20000 part is unused and in its original packaging.
Return procedure for S6J336CHABSC20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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