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Infineon Technologies S6J336CHEBSC20000
- Part No.:
- S6J336CHEBSC20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
S6J336CHEBSC20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:4,214
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Product details
Overview
S6J336CHEBSC20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control. It operates at up to 132 MHz, integrates 2,112 KB TC-Flash and 128 KB TC-RAM, supports CAN FD (4 channels), and meets ASIL-B per ISO 26262 for use in speedometer, tachometer, fuel gauge, and temperature meter systems.
For engineers reviewing the S6J336CHEBSC20000 datasheet, S6J336CHEBSC20000 pinout, S6J336CHEBSC20000 application, or S6J336CHEBSC20000 equivalent, key selection criteria include its -40 °C to 105 °C operating range, dual-voltage support (3.3 V/5 V), TEQFP-144 package, and integrated Secure Hardware Extension (SHE) for automotive security compliance.
Technical Context
This MCU implements a lockstep-capable Arm® Cortex®-R5F core with L1 instruction and data caches (16 KB each), MPU, TPU, and ECC-protected memory subsystems. Its safety architecture includes watchdog timers, clock supervisors, low-voltage detectors, and hardware-based SHE for secure boot and cryptographic key management.
The peripheral set targets real-time cluster display control: 48-channel 12-bit ADC, segment LCD controller (4 COM × 32 SEG), indicator PWM, RTC with automatic calibration, and multi-function serial interfaces including 10 I²C (2 Fast-mode), 12 MFS (UART/LIN/I²C), and 2 I²S channels - one output-only for audio feedback.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F, lockstep-capable, up to 132 MHz - enables deterministic real-time execution for ASIL-B cluster functions |
| Flash Memory | TC-Flash: 2,112 KB + Work-Flash: 112 KB - supports dual-bank firmware updates and parameter storage |
| RAM | TC-RAM: 128 KB + System-RAM: 128 KB (incl. 24 KB backup) - accommodates display buffers, safety-critical variables, and RTC retention |
| Operating Temp | -40 °C to +105 °C - qualified for under-hood and dashboard mounting in automotive environments |
| Power Supply | 3.3 V ± 0.3 V or 5.0 V ± 0.5 V - compatible with standard automotive power domains and LDO outputs |
| CAN FD | 4 independent channels, each with 16 KB ECC-protected RAM - provides 128-message buffer capacity per channel for high-bandwidth vehicle networking |
| Security | Secure Hardware Extension (SHE) module with AES-128, SHA-256, and secure key storage - enables secure boot and OTA update authentication |
Pinout & Package
Package: TEQFP-144 (0.4 mm pitch), RoHS-compliant, automotive-qualified with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53_1 | Main power supply (5 V or 3.3 V) | Primary analog/digital domain input; supports dual-voltage operation with internal LDO regulation |
| AVCC5 | Analog reference voltage | Provides stable 5 V reference for 12-bit ADC and analog peripherals |
| RTC_XIN / RTC_XOUT | Real-time clock crystal interface | Connects to 32.768 kHz crystal for battery-backed timekeeping with automatic calibration |
| SWDIO / SWCLK | JTAG/SWD debug interface | Enables non-intrusive debugging, flash programming, and boundary-scan testing during development and production |
| TXD0 / RXD0 | MFS0 UART channel | Configurable as LIN physical layer interface for communication with body control modules |
| LCDC_SEG0–31 | LCD segment drivers | Direct drive capability for up to 32-segment displays without external driver ICs |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 differential pair | High-speed (up to 5 Mbps) automotive bus interface compliant with ISO 11898-1:2015 |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Compliance | Hardware safety mechanisms (MPU, TPU, ECC RAM, clock/fault monitors) certified per ISO 26262 Part 5 for cluster MCU applications |
| Segment LCD Controller | Integrated 4-COM × 32-SEG driver with programmable bias and frame frequency - eliminates external LCD driver IC in analog gauge clusters |
| Dual-Voltage Operation | Simultaneous 3.3 V and 5 V supply domains with internal LDO - simplifies integration into legacy 5 V and modern 3.3 V automotive ECUs |
| Sound Waveform Generator | 5-output unit supporting PCM-PWM and I²S - delivers audible alerts (e.g., low-fuel warning) without external audio codec |
| Multi-Channel CAN FD | 4 independent CAN FD controllers with dedicated 16 KB ECC RAM per channel - enables concurrent communication with powertrain, ADAS, and infotainment networks |
Applications
| Digital Instrument Cluster | Automotive Head-Up Display (HUD) Control |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, fuel level, and coolant temperature on TFT or analog needle displays. IC Role / Device Role / Timing Role: Primary cluster MCU executing gauge animation, sensor fusion, and CAN FD message aggregation. Use Value: Integrated LCD controller and 48-channel ADC reduce BOM count by eliminating discrete display and signal-conditioning ICs. | Use Scenario: Driving HUD projection alignment, brightness adaptation, and warning overlay generation based on ADAS inputs. IC Role / Device Role / Timing Role: Secondary display controller synchronizing HUD content with vehicle dynamics via CAN FD and SPI-connected DMD/LCoS driver. Use Value: Dual-voltage I/O and 132 MHz R5F core enable low-latency processing of camera and radar metadata for dynamic HUD positioning. |
| Electric Vehicle (EV) Range & Charging Monitor | Commercial Vehicle Telematics Gateway |
Use Scenario: Aggregating battery SOC, charging status, regenerative braking energy, and thermal metrics for driver-facing display. IC Role / Device Role / Timing Role: Safety-certified data concentrator interfacing with BMS over CAN FD and driving segmented battery-state indicators. Use Value: SHE-secured boot and ASIL-B runtime integrity ensure tamper-resistant EV state reporting required by regulatory frameworks. | Use Scenario: Consolidating fleet diagnostics, GPS location, driver ID, and engine parameters for telematics transmission. IC Role / Device Role / Timing Role: Gateway MCU managing multiple CAN FD buses (powertrain, chassis, body), LIN subnets, and cellular modem interface. Use Value: 4-channel CAN FD with 128-message buffers per channel enables concurrent high-throughput logging without packet loss in heavy-duty applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/F1K | 32-bit RH850 core, 120 MHz max, 2 MB Flash, no integrated LCD controller | Requires external LCD driver IC; stronger focus on powertrain control than display-centric clusters | Select when prioritizing mature powertrain ecosystem over integrated display functionality |
| TC375A | TriCore™ AURIX™, 300 MHz, 4 MB Flash, 2x ETH, no SHE but HSM support | Targeted at zonal gateways and ADAS fusion; higher compute but larger footprint and cost | Select when Ethernet connectivity and functional safety up to ASIL-D are required beyond cluster scope |
Compared with RH850/F1K and TC375A, S6J336CHEBSC20000 delivers optimal balance of display integration (LCD + indicator PWM), automotive security (SHE), and cluster-specific peripherals (stepper motor control, sound generator) in a TEQFP-144 package - reducing system-level complexity where display fidelity and ASIL-B compliance are primary requirements.
Availability
S6J336CHEBSC20000 is available at Aetrix Electronics and suitable for automotive digital instrument clusters, EV range monitors, commercial vehicle telematics gateways, and HUD control units requiring stable component supply across extended product lifecycles.
Supply support for S6J336CHEBSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G series - including S6J336CHEBSC20000 - was developed specifically for automotive digital cockpit applications, emphasizing integrated display control, functional safety, and secure communication for next-generation instrument clusters.
FAQ
What is the maximum operating frequency of the Arm® Cortex®-R5F core in S6J336CHEBSC20000?
The Arm® Cortex®-R5F core operates at up to 132 MHz, verified under recommended conditions (VCC5 = 5.0 V ± 0.5 V, TA = –40 °C to +105 °C). This frequency is sustained across the full automotive temperature range and supports deterministic real-time execution for ASIL-B cluster functions without thermal throttling.
Does S6J336CHEBSC20000 support CAN FD with ISO 11898-1:2015 compliance?
Yes, S6J336CHEBSC20000 integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015. Each channel supports bit rates up to 5 Mbps, flexible data length (up to 64 bytes), and includes 16 KB of ECC-protected RAM - enabling 128-message buffering per channel for robust automotive network handling.
How is the Secure Hardware Extension (SHE) implemented in this MCU?
The SHE module implements AES-128 encryption/decryption, SHA-256 hashing, and secure key storage using dedicated hardware accelerators. It supports secure boot, firmware authentication, and OTA update integrity verification - all accessible via defined registers and protected from software access without proper privilege escalation.
What LCD display configurations does the integrated segment controller support?
The integrated segment LCD controller supports up to 4 common lines and 32 segment lines (4 × 32), with programmable bias voltage, frame frequency, and duty cycle. It drives passive-matrix LCDs directly without external driver ICs and includes built-in charge pump for higher contrast in low-power modes.
S6J336CHEBSC20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 132MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 94
- Program Memory Size:
- 112KB (112K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J336CHEBSC20000 FAQ
1.How can I place an order for S6J336CHEBSC20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J336CHEBSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J336CHEBSC20000 reliable?
The price and inventory of S6J336CHEBSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CHEBSC20000 is usually 5 days.
3.What payment methods are accepted for S6J336CHEBSC20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J336CHEBSC20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J336CHEBSC20000?
S6J336CHEBSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J336CHEBSC20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J336CHEBSC20000?
For technical support, including S6J336CHEBSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CHEBSC20000 requirements.
6.How does Aetrix verify that S6J336CHEBSC20000 is sourced from the original manufacturer or authorized distributors?
All S6J336CHEBSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CHEBSC20000 meets industry standards.
7.What is the process for return or replacement of S6J336CHEBSC20000?
All S6J336CHEBSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CHEBSC20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J336CHEBSC20000 part is unused and in its original packaging.
Return procedure for S6J336CHEBSC20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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