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Infineon Technologies S6J336CHEBSE20000

Part No.:
S6J336CHEBSE20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP Exposed Pad
Datasheet:
AetrixS6J336CHEBSE20000.pdf
Description:
TRAVEO-40NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,670

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Product details

Overview

S6J336CHEBSE20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control, supporting speedometer, tachometer, fuel gauge, and temperature meter functions. It integrates CAN FD (4 channels), Secure Hardware Extension (SHE), ASIL-B compliance per ISO 26262, 132 MHz core clock, and operates from -40 °C to 105 °C.

For engineers reviewing the S6J336CHEBSE20000 datasheet, S6J336CHEBSE20000 pinout, S6J336CHEBSE20000 application, or S6J336CHEBSE20000 equivalent, key selection criteria include AEC-Q100 qualification, dual-voltage operation (3.3 V/5 V), TC-Flash (2,112 KB), TC-RAM (128 KB), and TEQFP-144 package compatibility with LCD controller and stepper motor interfaces.

Technical Context

This MCU implements a lockstep-capable Arm Cortex-R5F core with integrated L1 instruction and data caches (16 KB each), memory protection unit (MPU), and timer protection unit (TPU) for functional safety. It features three independent power domains (PD1/PD2/PD4) and supports partial wake-up via 8-channel free-run timers and 48-channel 12-bit ADC.

The peripheral set includes a segment LCD controller (4 COM × 32 SEG), 6-gauge stepper motor controller (SMC), dual I2S interfaces (one output-only), and DDR-HSSPI for high-speed external memory access - all synchronized under a multi-clock domain architecture with PLL0/SSCG0 clock generation and ECC-protected CAN FD RAM (16 KB/channel).

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-R5F @ 132 MHz with FPU, MPU, TPU, and lockstep support for ASIL-B
Flash MemoryTC-Flash: 2,112 KB (program execution); Work-Flash: 112 KB (data logging/config)
RAMTC-RAM: 128 KB (cacheable, real-time code); System-RAM: 128 KB (includes 24 KB backup area)
Operating Temp-40 °C to +105 °C ambient (AEC-Q100 Grade 2 qualified)
Power SupplySingle-supply operation: 5.0 V ±0.5 V or 3.3 V ±0.3 V with internal LDO support
CAN FD4 independent channels with 128-message buffer per channel (ECC-protected RAM)
SecuritySecure Hardware Extension (SHE) with dedicated SHE_MID register and CEER control

Pinout & Package

Package: TEQFP-144 (0.5 mm pitch), RoHS-compliant, thermally enhanced quad flat package with exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO / VSSIOI/O Power Supply / GroundSeparate 3.3 V/5 V domain for GPIOs; enables mixed-voltage interface with external sensors/displays
VDDCORE / VSSCORECore Power Supply / GroundSupplies CPU, cache, and internal logic; requires low-noise regulation for timing stability
XTAL / EXTALCrystal Oscillator Input/OutputSupports 4 MHz crystal for system clock; used with internal PLL0 for 132 MHz core derivation
JTAG_TCK / TMS / TDI / TDOJTAG Debug InterfaceIEEE 1149.1-compliant boundary scan and debug access; required for flash programming and safety verification
AD0–AD47Analog Input Channels48-channel 12-bit ADC inputs; supports simultaneous sampling for multi-sensor cluster feedback (e.g., temp, voltage, pressure)
SEG0–SEG31 / COM0–COM3LCD Segment/COM DriversDirect drive for 4×32 segment LCD; eliminates external driver IC in analog gauge replacement designs

Key Features

FeatureDesign Value
ASIL-B ComplianceHardware-enforced safety mechanisms (MPU, TPU, ECC RAM, watchdogs) validated per ISO 26262 Part 5
Segment LCD ControllerIntegrated 4 COM × 32 SEG driver with programmable bias and frame rate; reduces BOM count by eliminating external LCD ASIC
Stepper Motor Control6 independent gauge drivers with microstepping support; enables precise analog needle positioning without external motor drivers
CAN FD + SHE Security4-channel CAN FD with embedded 128-message buffers and hardware-accelerated SHE crypto engine for secure boot and firmware updates
Dual-Voltage I/OConfigurable GPIO banks supporting 3.3 V or 5 V logic levels; simplifies integration with legacy automotive sensors and displays

Applications

Digital Instrument ClusterAutomotive Gauge Replacement

Use Scenario: Centralized display unit showing vehicle speed, RPM, fuel level, and coolant temperature using analog needles and digital segments.

IC Role / Device Role / Timing Role: Primary cluster controller executing real-time gauge rendering, CAN FD message parsing, and sensor fusion from body control module.

Use Value: Enables deterministic 132 MHz processing of 48-channel ADC inputs and 6-axis stepper control while meeting ASIL-B fault tolerance requirements.

Use Scenario: Retrofit solution replacing electromechanical gauges with compact, software-defined analog needle displays in legacy vehicles.

IC Role / Device Role / Timing Role: Standalone gauge controller interfacing with existing 5 V sensor outputs and driving 4×32 segment LCDs or stepper motors directly.

Use Value: Eliminates need for external LCD driver or motor driver ICs, reducing PCB area and component count by ≥30%.

CAN FD Gateway NodeSecure Boot Module

Use Scenario: In-vehicle gateway aggregating CAN FD messages between ADAS domain and instrument cluster for HUD synchronization.

IC Role / Device Role / Timing Role: High-throughput CAN FD receiver/transmitter with DMA-assisted message filtering and timestamping at 5 Mbps data phase.

Use Value: Delivers <1 µs interrupt latency on CAN FD frame reception, enabling sub-millisecond response for safety-critical alerts.

Use Scenario: Secure firmware update enabler in OTA-capable clusters requiring cryptographic signature verification before flash programming.

IC Role / Device Role / Timing Role: Root-of-trust module executing SHE-based AES-128 decryption and SHA-256 hash validation prior to boot ROM handoff.

Use Value: Provides hardware-enforced secure boot chain with immutable SHE_MID identity and CEER-controlled erase protection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive cluster controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7F701715xAFP#AA0 (Renesas)Arm Cortex-R7 core @ 300 MHz; no integrated segment LCD controller; uses external PMICTargets higher-end HUD-integrated clusters; requires external LCD driver and separate safety monitorSelect when >200 MHz compute headroom and dual-display support are needed; not drop-in for LCD-integrated designs
SPC58EC80E3 (STMicroelectronics)Power Architecture e200z7 @ 200 MHz; 2 MB Flash; no SHE but supports HSM; different CAN FD buffer architectureFocused on powertrain gateways; lacks integrated stepper motor controller and LCD driverPrefer for CAN FD routing-heavy applications where security relies on HSM instead of SHE; incompatible pinout and peripheral mapping

Compared with R7F701715xAFP#AA0 and SPC58EC80E3, S6J336CHEBSE20000 uniquely combines ASIL-B-certified Cortex-R5F, on-die segment LCD/stepper control, and SHE-based secure boot - making it optimal for cost-sensitive, space-constrained digital clusters requiring minimal external components.

Availability

S6J336CHEBSE20000 is available at Aetrix Electronics and suitable for automotive instrument cluster development, AEC-Q100-compliant ECU prototyping, and secure OTA update module production requiring stable component supply across extended lifecycle windows.

Supply support for S6J336CHEBSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

The TRAVEO™ T1G series - including S6J336CHEBSE20000 - was engineered specifically for automotive digital cockpit applications demanding functional safety, high-resolution display control, and secure communication in constrained form factors.

FAQ

What is the maximum operating frequency of the Arm Cortex-R5F core in S6J336CHEBSE20000?

The Arm Cortex-R5F core operates at up to 132 MHz, verified under recommended conditions (VDDCORE = 1.1 V, TA = -40 °C to 105 °C). This frequency is derived from the internal PLL0 with SSCG spread-spectrum modulation to reduce EMI in automotive environments, and is sustained across the full AEC-Q100 Grade 2 temperature range.

Does S6J336CHEBSE20000 support both 3.3 V and 5 V I/O operation simultaneously?

Yes - the device supports dual-voltage I/O operation: VDDIO can be independently configured for either 3.3 V ±0.3 V or 5.0 V ±0.5 V, allowing direct interface with legacy 5 V automotive sensors and modern 3.3 V displays without level shifters. GPIO banks are grouped by voltage domain and configured via register settings during initialization.

How many CAN FD channels does S6J336CHEBSE20000 integrate, and what is their buffer architecture?

S6J336CHEBSE20000 integrates four independent CAN FD controllers, each backed by 16 KB of ECC-protected RAM - equivalent to a configurable 128-message buffer per channel. Buffers support flexible message objects with hardware timestamping, acceptance filtering, and automatic retransmission, optimized for deterministic cluster-to-ECU messaging at 5 Mbps data phase.

Is the segment LCD controller capable of driving analog needle displays via stepper motors?

Yes - while the integrated segment LCD controller drives 4 COM × 32 SEG displays directly, the device also includes a dedicated 6-gauge Stepper Motor Controller (SMC) with microstepping support. This allows concurrent operation: LCD for digital readouts and SMC for analog needle positioning, both controlled from the same Cortex-R5F core without external drivers.

S6J336CHEBSE20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP Exposed Pad
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
132MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
94
Program Memory Size:
112KB (112K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J336CHEBSE20000 FAQ

1.How can I place an order for S6J336CHEBSE20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6J336CHEBSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6J336CHEBSE20000 reliable?

The price and inventory of S6J336CHEBSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CHEBSE20000 is usually 5 days.

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Once your S6J336CHEBSE20000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6J336CHEBSE20000?

For technical support, including S6J336CHEBSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CHEBSE20000 requirements.

6.How does Aetrix verify that S6J336CHEBSE20000 is sourced from the original manufacturer or authorized distributors?

All S6J336CHEBSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CHEBSE20000 meets industry standards.

7.What is the process for return or replacement of S6J336CHEBSE20000?

All S6J336CHEBSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CHEBSE20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J336CHEBSE20000 part is unused and in its original packaging.

Return procedure for S6J336CHEBSE20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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