My Inquiry
My Account
Infineon Technologies S6J336CHSBSC20000
- Part No.:
- S6J336CHSBSC20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
S6J336CHSBSC20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:840
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J336CHSBSC20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control. It operates at up to 132 MHz, integrates 2,112 KB TC-Flash and 128 KB TC-RAM, supports CAN FD and Secure Hardware Extension (SHE), and is qualified to AEC-Q100 Grade 2 (−40 °C to +105 °C) for speedometer, tachometer, fuel gauge, and temperature meter applications.
For engineers reviewing the S6J336CHSBSC20000 datasheet, S6J336CHSBSC20000 pinout, S6J336CHSBSC20000 application, or S6J336CHSBSC20000 equivalent, key selection criteria include ASIL-B compliance per ISO 26262, dual-voltage operation (3.3 V or 5 V), TEQFP-144 package with 94 general-purpose I/O ports, and integrated LCD controller with 4 COM × 32 SEG support.
Technical Context
This MCU implements a lockstep-capable Arm® Cortex®-R5F core with MPU, TPU, ECC-protected RAM, and hardware safety monitors including watchdog timers and clock supervisors. Its memory subsystem includes separate TC-Flash (2,112 KB) and Work-Flash (112 KB), plus TC-RAM (128 KB) and System-RAM (128 KB with 24 KB backup area).
The peripheral set targets automotive HMI: 4-channel CAN FD with 16 KB ECC RAM per channel, 48-channel 12-bit ADC, 6-unit stepper motor controller, segment LCD controller, PCM-PWM audio output, and multi-function serial interfaces supporting UART, LIN, I²C, and CSIO - all operating under triple power domains (PD1/PD2/PD4).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F, up to 132 MHz - enables real-time deterministic execution for cluster UI rendering and sensor fusion. |
| Flash Memory | TC-Flash: 2,112 KB / Work-Flash: 112 KB - supports dual-bank firmware updates and secure boot code separation. |
| RAM | TC-RAM: 128 KB / System-RAM: 128 KB (incl. 16 KB + 8 KB backup) - provides dedicated space for safety-critical variables and non-volatile context retention. |
| Operating Temp | −40 °C to +105 °C - meets AEC-Q100 Grade 2 requirements for under-hood and dashboard mounting environments. |
| Functional Safety | ASIL-B compliant per ISO 26262 - validated via integrated MPU, TPU, ECC on RAM/Flash, and hardware watchdogs. |
| Interface Support | 4× CAN FD, 12× MFS (UART/LIN/I²C/CSIO), 2× I²S, DDR-HSSPI - enables full cluster connectivity to ECU, audio ICs, and external displays. |
| Package | TEQFP-144 (0.4 mm pitch) - surface-mount package with 94 GPIOs, optimized for compact automotive PCB layouts. |
Pinout & Package
Package: TEQFP-144 (0.4 mm pitch), RoHS-compliant, moisture sensitivity level (MSL) 3, rated for automotive temperature range.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53_1 | Main power supply (5.0 V ± 0.5 V or 3.3 V ± 0.3 V) | Supports dual-voltage system integration; internal LDO generates regulated core voltage. |
| P00–P117 | General-purpose I/O (94 usable ports) | Configurable as digital input/output, analog input, or peripheral function pins (e.g., CAN FD TX/RX, LCD SEG/COM). |
| CLKIN / CLKOUT | External crystal oscillator interface | Accepts 1–20 MHz crystal; drives internal PLL/SSCG for precise clock generation across safety domains. |
| JTAG_TCK / TMS / TDI / TDO | JTAG debug interface | Enables boundary-scan testing, flash programming, and real-time debugging per IEEE 1149.1. |
| RESET_N | Active-low reset input | Asynchronous reset with internal pull-up; synchronized to system clock for glitch-free initialization. |
Key Features
| Feature | Design Value |
|---|---|
| Secure Hardware Extension (SHE) | Hardware-accelerated AES-128, SHA-256, and key management - enables secure boot, firmware authentication, and OTA update integrity. |
| Segment LCD Controller | 4 COM × 32 SEG drive capability - directly drives analog-style instrument cluster displays without external driver ICs. |
| Stepper Motor Controller | 6 independent gauge drivers with microstepping support - controls analog needle movement in speedometer and fuel gauge modules. |
| CAN FD Interface | 4 channels, each with 128-message buffer (16 KB ECC RAM) - supports high-bandwidth diagnostics and real-time vehicle data streaming at up to 5 Mbps. |
| Power Domain Isolation | Three independent domains (PD1/PD2/PD4) with individual voltage monitoring - enables selective shutdown and fault containment per subsystem. |
Applications
| Digital Instrument Cluster | Automotive Gauge Control |
|---|---|
Use Scenario: Centralized display unit showing vehicle speed, RPM, coolant temperature, and fuel level in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary application processor managing UI rendering, sensor data aggregation, and CAN FD communication with body ECUs. Use Value: Integrates LCD controller, stepper motor drivers, and 48-channel ADC to eliminate discrete display and gauge driver components. | Use Scenario: Analog needle-based speedometer and tachometer requiring precise angular positioning and smooth motion profiles. IC Role / Device Role / Timing Role: Dedicated stepper motor controller with microstepping and real-time position feedback via ADC inputs. Use Value: Delivers <1° step resolution and jitter-free needle movement using on-chip SMC units and 12-bit ADC for potentiometer sensing. |
| Secure Vehicle Diagnostics | Cluster Audio Feedback |
Use Scenario: UDS-compliant diagnostic gateway supporting secure firmware updates and encrypted parameter reprogramming over CAN FD. IC Role / Device Role / Timing Role: Secure boot loader and SHE-based cryptographic engine handling key derivation, signature verification, and flash encryption. Use Value: Meets ISO/SAE 21434 cybersecurity requirements with hardware-rooted trust anchored in SHE module ID 0x000F_0300. | Use Scenario: Audible alerts (e.g., low-fuel warning, lane departure chime) generated directly from instrument cluster hardware. IC Role / Device Role / Timing Role: Integrated sound waveform generator, mixer, and PCM-PWM output driving piezo or small speakers without external audio codec. Use Value: Reduces BOM count by eliminating external audio ICs while delivering 16-bit-equivalent dynamic range via PWM oversampling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7017152AFP#AA0 (Renesas) | 32-bit RH850/U2A core, 200 MHz, 2 MB Flash, no integrated LCD controller | Requires external segment LCD driver; stronger focus on powertrain control than HMI | Select when higher CPU performance and functional safety ASIL-D capability are prioritized over integrated display peripherals. |
| SPC58EC80E3 (STMicroelectronics) | Power Architecture e200z4, 180 MHz, 2 MB Flash, 384 KB RAM, no SHE but supports HSM | Lacks native segment LCD and stepper motor controllers; targets gateway/diagnostics use cases | Prefer when leveraging existing Power Architecture toolchains and requiring HSM-based secure boot instead of SHE. |
Compared with R7F7017152AFP#AA0 and SPC58EC80E3, S6J336CHSBSC20000 delivers tighter integration for instrument clusters - combining ASIL-B safety, CAN FD, LCD/stepper control, and SHE security in a single TEQFP-144 package - reducing system-level component count and layout complexity.
Availability
S6J336CHSBSC20000 is available at Aetrix Electronics and suitable for automotive instrument cluster development, digital gauge systems, and secure vehicle diagnostics requiring stable component supply across production lifecycles.
Supply support for S6J336CHSBSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
S6J336CHSBSC20000 belongs to the TRAVEO™ T1G automotive microcontroller family, engineered specifically for digital instrument clusters and human-machine interface applications demanding functional safety, display integration, and secure communication.
FAQ
What is the maximum operating frequency of the Arm® Cortex®-R5F core in S6J336CHSBSC20000?
The Arm® Cortex®-R5F core operates at up to 132 MHz under recommended conditions (VCC5 = 5.0 V ± 0.5 V, TA = −40 °C to +105 °C). This frequency is sustained across the full automotive temperature range and supports deterministic real-time execution for cluster UI tasks and CAN FD message processing.
Does S6J336CHSBSC20000 support both 3.3 V and 5 V supply configurations?
Yes - S6J336CHSBSC20000 supports dual supply modes: 5.0 V ± 0.5 V or 3.3 V ± 0.3 V. The device includes an embedded LDO for internal voltage regulation, and pin configuration (VCC5/VCC53_1) determines active supply domain per the ordering option "H" (144-pin TEQFP) and "S" (qualified product).
How many CAN FD channels does S6J336CHSBSC20000 integrate, and what memory is allocated per channel?
S6J336CHSBSC20000 integrates four CAN FD controllers, each backed by 16 KB of ECC-protected RAM - equivalent to a 128-message buffer per channel. This allocation supports simultaneous high-throughput diagnostics, ECU synchronization, and real-time telemetry at data rates up to 5 Mbps.
Is the S6J336CHSBSC20000 qualified to AEC-Q100, and which grade applies?
Yes - S6J336CHSBSC20000 is qualified to AEC-Q100 Grade 2, specifying operation from −40 °C to +105 °C ambient temperature. This qualification covers the full device, including flash memory, RAM, peripherals, and safety mechanisms, and is documented in Infineon's official AEC-Q100 test reports for the TRAVEO™ T1G series.
S6J336CHSBSC20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 132MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 94
- Program Memory Size:
- 112KB (112K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J336CHSBSC20000 FAQ
1.How can I place an order for S6J336CHSBSC20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J336CHSBSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J336CHSBSC20000 reliable?
The price and inventory of S6J336CHSBSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CHSBSC20000 is usually 5 days.
3.What payment methods are accepted for S6J336CHSBSC20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J336CHSBSC20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J336CHSBSC20000?
S6J336CHSBSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J336CHSBSC20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J336CHSBSC20000?
For technical support, including S6J336CHSBSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CHSBSC20000 requirements.
6.How does Aetrix verify that S6J336CHSBSC20000 is sourced from the original manufacturer or authorized distributors?
All S6J336CHSBSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CHSBSC20000 meets industry standards.
7.What is the process for return or replacement of S6J336CHSBSC20000?
All S6J336CHSBSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CHSBSC20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J336CHSBSC20000 part is unused and in its original packaging.
Return procedure for S6J336CHSBSC20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J336CHSBSC20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
