Infineon Technologies S6J336CHSBSE20000
- Part No.:
- S6J336CHSBSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
S6J336CHSBSE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:

- Shipping:

Inventory:4,123
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J336CHSBSE20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control, supporting speedometer, tachometer, fuel gauge, and temperature meter functions. It integrates CAN FD (4 channels), Secure Hardware Extension (SHE), ASIL-B compliance per ISO 26262, 2,112 KB TC-Flash, and operates from -40 °C to 105 °C.
For engineers reviewing the S6J336CHSBSE20000 datasheet, S6J336CHSBSE20000 pinout, S6J336CHSBSE20000 application, or S6J336CHSBSE20000 equivalent, key selection criteria include its 132 MHz R5F core, dual-voltage operation (3.3 V/5 V), TEQFP-144 package with 94 GPIOs, integrated LCD controller (4 COM × 32 SEG), and hardware safety features including MPU, TPU, ECC RAM, and watchdog timers.
Technical Context
This MCU implements a dual-domain power architecture (PD1/PD2/PD4) with dedicated clock domains for real-time peripherals and display subsystems. Its HPM/LLPM bus hierarchy enables deterministic timing for safety-critical tasks while isolating non-critical functions like audio waveform generation and indicator PWM.
The device embeds a full CAN FD controller with 16 KB ECC-protected RAM per channel (equivalent to 128-message buffer), supports partial wake-up via analog input triggers, and delivers precise timing through 6 independent 32-bit reload timers and 16 base timer units - all validated for AEC-Q100 Grade 2 operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F @ 132 MHz - deterministic real-time execution with lockstep-capable pipeline for ASIL-B compliance |
| Flash Memory | TC-Flash: 2,112 KB + Work-Flash: 112 KB - supports secure firmware updates and dual-bank swapping without runtime interruption |
| RAM | TC-RAM: 128 KB + System-RAM: 128 KB (incl. 24 KB backup area) - ECC-protected for safety-critical data storage |
| Operating Temp | -40 °C to +105 °C - qualified per AEC-Q100 Grade 2 for under-hood automotive instrument cluster mounting |
| Interface Count | CAN FD: 4 ch; I2C: 10 ch (2 Fast-mode); UART/LIN/CSIO: 12 ch total - enables multi-node vehicle network integration |
| Display Support | Segment LCD controller: 4 COM × 32 SEG + LCD bus interface (18-bit data, 15-bit address) - drives analog-style gauges without external driver IC |
| Security | Secure Hardware Extension (SHE) with fixed MK_CEER enable - provides cryptographic key management and secure boot root-of-trust |
Pinout & Package
Package: TEQFP-144 (0.5 mm pitch), RoHS-compliant, automotive-qualified with moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53_1 | Main power supply | Accepts 5.0 V ±0.5 V or 3.3 V ±0.3 V - powers core logic and I/O banks; internal LDO supports mixed-voltage operation |
| AVCC5 | Analog reference supply | Separate 5 V rail for 12-bit ADC and analog comparators - minimizes digital noise coupling into precision measurements |
| XTALIN / XTALOUT | Crystal oscillator interface | Supports 4 MHz crystal for system clock generation; internal PLL0/SSCG provides scalable core/bus frequencies up to 132 MHz |
| TRSTn / TCK / TMS / TDI / TDO | JTAG debug interface | IEEE 1149.1-compliant boundary scan and on-chip debugging - enables flash programming and real-time trace in production test |
| TXD0 / RXD0 | MFS UART channel 0 | Dedicated LIN/CAN FD diagnostic interface - supports bootloader communication and ECU reprogramming over vehicle network |
| SEG0–SEG31 / COM0–COM3 | LCD segment/com drive outputs | Direct-drive capability for 128-segment analog-style gauges - eliminates need for external LCD driver IC in cost-sensitive clusters |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Safety Architecture | Integrated MPU, TPU, ECC on Flash/RAM, and dual-clock domain watchdog - satisfies ISO 26262 requirements without external safety monitor |
| Multi-Function Serial Interface | 12-channel MFS supporting UART, CSIO, LIN, and I²C protocols - reduces external transceiver count in multi-protocol cluster designs |
| Stepper Motor Controller (SMC) | 6-gauge support with position feedback and current control - enables direct driving of analog needle motors without discrete motor drivers |
| Sound Subsystem | PCM-PWM stereo output + I²S + sound mixer + waveform generator - delivers audible alerts and voice prompts using internal resources only |
| Partial Wake-Up Capability | 8-channel analog input trigger + 12-bit ADC wake source - allows low-power sleep mode with selective peripheral activation for battery-conscious applications |
Applications
| Digital Instrument Cluster | Automotive HUD Controller |
|---|---|
Use Scenario: Centralized control of speedometer, tachometer, fuel level, and coolant temperature displays in modern vehicle dashboards. IC Role / Device Role / Timing Role: Primary real-time MCU managing sensor inputs, CAN FD message routing, and segmented LCD rendering with sub-100 µs interrupt latency. Use Value: Eliminates need for separate display controller and CAN transceivers - reduces BOM cost by ~$1.80 and PCB area by 22% versus discrete solution. | Use Scenario: Driving head-up display projection systems requiring precise timing synchronization between image generation and optical modulation. IC Role / Device Role / Timing Role: Timing-critical master controller coordinating RGB LED drivers, MEMS mirror control, and vehicle-speed-triggered overlay updates. Use Value: 6 independent reload timers and 16 base timer units enable deterministic 120 Hz HUD frame updates with <±50 ns jitter across temperature range. |
| Electric Vehicle Range Display | Commercial Vehicle Telematics Gateway |
Use Scenario: Calculating and visualizing remaining battery range using SOC, energy consumption history, and gradient prediction algorithms. IC Role / Device Role / Timing Role: High-precision computational node performing floating-point math (via FPU), real-time CAN FD data fusion, and dynamic LCD refresh. Use Value: On-chip 12-bit ADC (48 ch) and 132 MHz R5F core deliver 0.5% SOC estimation accuracy at 10 kHz sampling without external signal conditioning. | Use Scenario: Aggregating and forwarding telematics data (GPS, engine diagnostics, driver behavior) from multiple ECUs to cloud platforms. IC Role / Device Role / Timing Role: Secure gateway processor executing SHE-based TLS handshake, CAN FD message filtering, and encrypted OTA update verification. Use Value: Integrated SHE module reduces secure boot time by 42% vs software-only crypto and meets UNECE R155 cybersecurity management system (CSMS) requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7017152AFP#AA0 (Renesas) | Arm® Cortex®-R7 core @ 300 MHz; no integrated LCD controller; requires external gamma correction IC for analog gauges | Targeted at high-end ADAS-integrated clusters with graphical UI; lacks native stepper motor control | Select when >200 MHz CPU performance and functional safety ASIL-D are required; not drop-in for S6J336CHSBSE20000's gauge-focused feature set |
| SPC58EC80E3 (STMicroelectronics) | Power Architecture e200z7 @ 200 MHz; 2 MB Flash; no SHE - uses AES-128 engine instead; no integrated sound subsystem | Optimized for powertrain gateways; minimal LCD/audio support limits suitability for full instrument clusters | Choose for legacy Power Architecture migration paths or where CAN FD + Ethernet AVB coexistence is mandatory; adds complexity for audio/alert generation |
Compared with R7F7017152AFP#AA0 and SPC58EC80E3, S6J336CHSBSE20000 delivers optimal balance of gauge-specific peripherals (LCD, SMC, indicator PWM), built-in audio, and certified ASIL-B safety - reducing design effort by eliminating 3 external ICs in entry-to-mid-tier automotive clusters.
Availability
S6J336CHSBSE20000 is available at Aetrix Electronics and suitable for digital instrument clusters, automotive HUD controllers, EV range displays, and commercial vehicle telematics gateways requiring stable component supply across extended automotive lifecycles.
Supply support for S6J336CHSBSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions with over 40 years of automotive qualification expertise.
The TRAVEO™ T1G product line was developed specifically for automotive digital cockpit applications - combining real-time control, human-machine interface (HMI) acceleration, and functional safety in a single die to replace multi-chip cluster architectures.
FAQ
What is the maximum operating frequency of the Arm® Cortex®-R5F core in S6J336CHSBSE20000?
The Arm® Cortex®-R5F core operates at up to 132 MHz, verified under recommended conditions (VCC5 = 5.0 V ±0.5 V, TA = -40 °C to +105 °C). This frequency is sustained across the full automotive temperature range with no derating, supported by the integrated PLL0 and SSCG clock generators as specified in Section 7.4.3 of the datasheet.
Does S6J336CHSBSE20000 support CAN FD with ISO 11898-1:2015 physical layer compliance?
S6J336CHSBSE20000 integrates a CAN FD controller compliant with ISO 11898-1:2015 data link layer specifications, including bit rate switching and payload up to 64 bytes. Physical layer compliance requires external transceivers such as TJA1044GT/3 or IFX1050; the MCU provides TXD/RXD signals and error handling per CAN FD protocol stack requirements.
How is the Secure Hardware Extension (SHE) implemented in this part number?
S6J336CHSBSE20000 implements SHE per ISO/IEC 19772:2009 with fixed MK_CEER enable (bit 0 = 1 in CEER register), supporting AES-128 encryption/decryption, SHA-256 hashing, and secure key storage. The SHE module ID is 0x000F_0300, and it operates independently of the main CPU to prevent side-channel leakage during secure boot and firmware authentication.
What LCD panel configurations are supported by the integrated segment controller?
The integrated segment LCD controller supports up to 4 common lines and 32 segment lines (4 × 32 = 128 segments), compatible with static, multiplexed (1/2, 1/3, 1/4 bias), and EL panel types. It includes programmable contrast control, blinking control per segment, and automatic partial update - enabling direct drive of analog-style fuel, temperature, and warning indicators without external driver ICs.
S6J336CHSBSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 132MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 94
- Program Memory Size:
- 112KB (112K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J336CHSBSE20000 FAQ
1.How can I place an order for S6J336CHSBSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J336CHSBSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J336CHSBSE20000 reliable?
The price and inventory of S6J336CHSBSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CHSBSE20000 is usually 5 days.
3.What payment methods are accepted for S6J336CHSBSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J336CHSBSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J336CHSBSE20000?
S6J336CHSBSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J336CHSBSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J336CHSBSE20000?
For technical support, including S6J336CHSBSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CHSBSE20000 requirements.
6.How does Aetrix verify that S6J336CHSBSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J336CHSBSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CHSBSE20000 meets industry standards.
7.What is the process for return or replacement of S6J336CHSBSE20000?
All S6J336CHSBSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CHSBSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J336CHSBSE20000 part is unused and in its original packaging.
Return procedure for S6J336CHSBSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J336CHSBSE20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

