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Infineon Technologies S6J336CHTBSC20000

Part No.:
S6J336CHTBSC20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixS6J336CHTBSC20000.pdf
Description:
TRAVEO-40NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:813

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Product details

Overview

S6J336CHTBSC20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for instrument cluster control, supporting CAN FD communication, Secure Hardware Extension (SHE), and ASIL-B compliance. It operates from -40 °C to 105 °C, integrates 2,112 KB TC-Flash and 128 KB TC-RAM, and delivers real-time motor control, LCD driving, and audio waveform generation in digital dashboards.

For engineers reviewing the S6J336CHTBSC20000 datasheet, S6J336CHTBSC20000 pinout, S6J336CHTBSC20000 application, or S6J336CHTBSC20000 equivalent, key selection criteria include its 132 MHz R5F core, dual-voltage operation (3.3 V/5 V), TEQFP-144 package, AEC-Q100 qualification, and integrated safety features including MPU, TPU, ECC, and watchdog timers.

Technical Context

This MCU implements a dual-domain power architecture (PD1/PD2/PD4) with dedicated clock domains for performance, low-power, and safety-critical peripherals. Its HPM bus runs at up to 132 MHz while LLPM and resource clocks support independent peripheral timing - enabling concurrent LCD refresh, stepper motor control, and CAN FD message handling without contention.

The device integrates hardware-accelerated security via SHE with fixed-function cryptographic engines (AES-128, SHA-256, HMAC), paired with memory protection units (MPU), timer protection units (TPU), and ECC on Flash/RAM - fulfilling ISO 26262 ASIL-B requirements for functional safety in automotive clusters.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-R5F @ 132 MHz - deterministic real-time execution with lockstep-capable pipeline for safety-critical metering tasks.
Flash Memory2,112 KB TC-Flash + 112 KB Work-Flash - supports dual-bank update and secure boot with ECC protection.
RAM128 KB TC-RAM + 128 KB System-RAM (incl. 24 KB backup) - enables persistent data retention across sleep/wake cycles.
Operating Temp-40 °C to +105 °C - qualified per AEC-Q100 Grade 2 for under-hood and dashboard mounting environments.
Interface Count4× CAN FD, 12× MFS (UART/I²C/LIN), 2× I²S, 1× DDR-HSSPI - enables multi-sensor fusion and high-fidelity audio output.
SecuritySecure Hardware Extension (SHE) with AES-128/SHA-256/HMAC - provides hardware-rooted key management and secure boot verification.
PackageTEQFP-144 (0.4 mm pitch) - RoHS-compliant automotive package with thermal pad for enhanced heat dissipation in sealed enclosures.

Pinout & Package

TEQFP-144 (0.4 mm pitch) package with exposed thermal pad; 144-pin layout optimized for automotive EMI resilience and signal integrity in instrument cluster PCBs.

Pin/TerminalCircuit RoleDesign Meaning
VCC5 / VCC53_1Main power supply inputAccepts 5.0 V ±0.5 V or 3.3 V ±0.3 V - powers core logic and I/O banks with internal LDO regulation.
AVCC5Analog power supplySeparate 5 V rail for 12-bit ADC and analog comparators - reduces noise coupling into precision sensing paths.
RTC_XIN / RTC_XOUTReal-time clock oscillator terminalsSupports 32.768 kHz crystal for battery-backed timekeeping - maintains calendar accuracy during vehicle ignition-off states.
CANFD0_TX / CANFD0_RXCAN FD channel 0 differential pairHigh-speed (up to 5 Mbps) fault-tolerant interface - enables firmware updates and diagnostic messaging over vehicle backbone networks.
LCDC_COM0–LCDC_COM3LCD segment driver outputs4-channel common electrode drivers - directly drives multiplexed analog gauges (speedometer, tachometer) without external drivers.
SMC_OUT0–SMC_OUT5Stepper motor controller outputs6-channel PWM outputs with phase control - drives analog needle movement in electromechanical cluster displays.

Key Features

FeatureDesign Value
ASIL-B Safety ArchitectureIntegrated MPU, TPU, ECC on Flash/RAM, and dual-clock domain supervision - satisfies ISO 26262 requirements for cluster display control without external safety monitors.
Dual-Voltage I/O SupportConfigurable 3.3 V or 5 V operation - simplifies integration with legacy 5 V sensors and modern low-voltage displays in mixed-voltage instrument panels.
Hardware Sound Mixer10-input mixer with PCM-PWM conversion - enables audible alerts (low-fuel, door-open) using internal DAC-less audio synthesis, reducing BOM cost.
Segment LCD Controller4 COM × 32 SEG drive capability - directly interfaces with analog gauge glass without external segment drivers or level shifters.
Secure Boot with SHEImmutable root-of-trust using embedded SHE keys - prevents unauthorized firmware execution and ensures OTA update authenticity in connected vehicles.

Applications

Digital Instrument ClusterAutomotive Head-Up Display (HUD) Control

Use Scenario: Real-time rendering of speed, RPM, fuel level, and warning icons on TFT or analog gauge displays.

IC Role / Device Role / Timing Role: Primary cluster controller managing LCD refresh, stepper motor positioning, and CAN FD telemetry ingestion.

Use Value: 132 MHz R5F core ensures sub-50 ms gauge response time; integrated SMC eliminates external motor driver ICs.

Use Scenario: Driving projection alignment, brightness control, and status overlay on windshield-projected HUD units.

IC Role / Device Role / Timing Role: HUD subsystem manager coordinating image timing, thermal compensation, and vehicle bus diagnostics.

Use Value: Dual-bank Flash enables seamless HUD firmware updates; 12-bit ADC monitors ambient light and temperature for adaptive contrast.

Central Body Control Module (CBCM)Electric Vehicle (EV) Range & Charging Dashboard

Use Scenario: Aggregating door lock status, lighting control, and HVAC feedback across LIN/CAN networks.

IC Role / Device Role / Timing Role: Secondary body controller interfacing with LIN slaves and CAN FD gateway modules.

Use Value: 12-channel MFS supports simultaneous LIN transceivers; 48-channel ADC monitors switch inputs and sensor voltages.

Use Scenario: Visualizing state-of-charge, regenerative braking energy, and charging station compatibility in EV dashboards.

IC Role / Device Role / Timing Role: EV-specific cluster processor handling battery telemetry parsing and range prediction UI rendering.

Use Value: SHE-enabled secure boot protects SOC estimation algorithms; CAN FD bandwidth supports high-rate cell voltage streaming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive cluster microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RH850/F1K32-bit RXv2 core @ 120 MHz; 1.5 MB Flash; no integrated SHE - relies on external security co-processor.Stronger LIN support (up to 16 channels); weaker audio subsystem - less suitable for voice-alert clusters.Prefer when LIN-heavy body control is primary function and external security IC is acceptable.
TC375ATriCore™ AURIX™ TC3xx platform; 300 MHz core; 4 MB Flash; ASIL-D capable - higher safety tier than required for clusters.Targeted at ADAS domain controllers; over-engineered for pure cluster use - increases cost and software complexity.Choose only if future expansion to safety-critical ADAS integration is planned within same hardware platform.

Compared with RH850/F1K and TC375A, S6J336CHTBSC20000 offers optimal balance of ASIL-B compliance, integrated SHE, audio/LCD peripherals, and TEQFP-144 footprint - minimizing BOM count and software porting effort specifically for instrument cluster designs.

Availability

S6J336CHTBSC20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, central body control modules, and EV charging dashboards requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.

Supply support for S6J336CHTBSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

This part belongs to the TRAVEO™ T1G automotive microcontroller family, engineered specifically for digital instrument clusters and human-machine interface (HMI) systems demanding real-time responsiveness, functional safety, and integrated graphics/audio capabilities.

FAQ

What is the maximum operating frequency of the Arm® Cortex®-R5F core in S6J336CHTBSC20000?

The Arm® Cortex®-R5F core operates at up to 132 MHz, verified under recommended conditions (VCC5 = 5.0 V ±0.5 V, TA = -40 °C to 105 °C). This frequency is sustained across the full automotive temperature range with on-chip PLL and SSCG circuitry providing jitter-controlled clock synthesis.

Does S6J336CHTBSC20000 support CAN FD with ISO 11898-1:2015 physical layer compliance?

Yes - it integrates four fully compliant CAN FD controllers supporting data rates up to 5 Mbps, bit-rate switching, and ISO 11898-1:2015 frame formatting. Each channel includes 16 KB ECC-protected RAM for message buffering, eliminating need for external CAN transceivers with integrated buffers.

How is the Secure Hardware Extension (SHE) implemented, and what cryptographic functions does it support?

SHE is implemented as a dedicated hardware module with AES-128 encryption/decryption, SHA-256 hashing, and HMAC-SHA-256 authentication. It uses immutable keys stored in fuse-based registers and supports secure boot, firmware signature verification, and key derivation - all without CPU intervention or software exposure of secrets.

What are the supported package variants and thermal characteristics of the TEQFP-144 footprint?

S6J336CHTBSC20000 uses TEQFP-144 with 0.4 mm pitch and exposed thermal pad. Its θJA is 32 °C/W (JEDEC JESD51-2 standard, 4-layer board), and maximum junction temperature is 125 °C. The package meets AEC-Q200 stress test requirements for vibration, thermal cycling, and humidity resistance.

S6J336CHTBSC20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
144-LQFP
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
132MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
94
Program Memory Size:
112KB (112K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J336CHTBSC20000 FAQ

1.How can I place an order for S6J336CHTBSC20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6J336CHTBSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6J336CHTBSC20000 reliable?

The price and inventory of S6J336CHTBSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CHTBSC20000 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6J336CHTBSC20000?

For technical support, including S6J336CHTBSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CHTBSC20000 requirements.

6.How does Aetrix verify that S6J336CHTBSC20000 is sourced from the original manufacturer or authorized distributors?

All S6J336CHTBSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CHTBSC20000 meets industry standards.

7.What is the process for return or replacement of S6J336CHTBSC20000?

All S6J336CHTBSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CHTBSC20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J336CHTBSC20000 part is unused and in its original packaging.

Return procedure for S6J336CHTBSC20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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