Infineon Technologies S6J336CHTBSE20000
- Part No.:
- S6J336CHTBSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
S6J336CHTBSE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:

- Shipping:

Inventory:3,569
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J336CHTBSE20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control, supporting speedometer, tachometer, fuel gauge, and temperature meter functions. It integrates CAN FD (4 channels), Secure Hardware Extension (SHE), ASIL-B compliance per ISO 26262, 2,112 KB TC-Flash, and operates from -40 °C to 105 °C.
For engineers reviewing the S6J336CHTBSE20000 datasheet, S6J336CHTBSE20000 pinout, S6J336CHTBSE20000 application, or S6J336CHTBSE20000 equivalent, key selection criteria include its dual-voltage support (3.3 V/5 V), 132 MHz real-time execution, integrated LCD controller (4 COM × 32 SEG), and hardware safety features including MPU, TPU, ECC RAM, and watchdog timers.
Technical Context
This MCU implements a lockstep-capable Arm Cortex-R5F core with dual 16 KB instruction/data caches, operating at up to 132 MHz with deterministic interrupt latency. Its memory subsystem includes 2,112 KB TC-Flash with 80-MHz access speed, 128 KB TC-RAM, and 128 KB System-RAM (with 24 KB backup area), all backed by ECC on critical SRAM and CAN FD buffers.
The peripheral set targets automotive HMI: integrated LCD controller with segment drive capability, 12-bit ADC (40 channels), 6-channel stepper motor controller, dual I2S interfaces (one output-only), and four independent CAN FD controllers each with 16 KB ECC-protected RAM - enabling concurrent high-bandwidth vehicle network communication and display rendering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F, 132 MHz max - enables deterministic real-time execution for cluster UI rendering and sensor processing. |
| Flash Memory | 2,112 KB TC-Flash + 112 KB Work-Flash - supports secure firmware updates and dual-bank operation for fail-safe boot. |
| RAM | 128 KB TC-RAM + 128 KB System-RAM (incl. 24 KB backup) - provides dedicated space for safety-critical tasks and retained state across power cycles. |
| Operating Temp | -40 °C to +105 °C - qualified for under-hood and dashboard mounting in automotive environments. |
| Safety Certification | ASIL-B compliant per ISO 26262 - integrates MPU, TPU, ECC on RAM/Flash, and clock/fault monitors for functional safety. |
| Interface Count | 4× CAN FD, 12× MFS (UART/LIN/I²C), 2× I2S, DDR-HSSPI - enables full vehicle network integration and audio/HMI subsystem connectivity. |
| Power Supply | 3.3 V ±0.3 V or 5.0 V ±0.5 V - supports legacy 5 V automotive domains and modern low-voltage subsystems without external regulators. |
Pinout & Package
Package: TEQFP-144 (0.5 mm pitch), RoHS-compliant, automotive-qualified with moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53_1 | Main power supply input | Accepts 5.0 V or 3.3 V system rail; internal LDO supports mixed-voltage domain operation. |
| AVCC5 | Analog power supply | Separate 5.0 V or 3.3 V supply for ADC and analog peripherals to minimize noise coupling. |
| RTC_XIN / RTC_XOUT | Real-time clock oscillator terminals | Supports 32.768 kHz crystal for battery-backed timekeeping with automatic calibration. |
| LCDC_COM0–3 / LCDC_SEG0–31 | LCD segment/com driver outputs | Direct drive of 4×32 segment LCD without external drivers - reduces BOM count and PCB area. |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential I/O | High-speed CAN FD physical layer interface compliant with ISO 11898-2, supporting up to 5 Mbps data rate. |
| JTAG_TCK / JTAG_TDI / JTAG_TDO / JTAG_TMS | JTAG debug interface | Standard 4-pin boundary-scan interface for production programming and real-time debugging. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LCD Controller | Drives 4 COM × 32 SEG directly - eliminates external segment drivers and simplifies instrument cluster PCB layout. |
| Dual I2S Audio Interfaces | One output-only (for speaker), one bidirectional (for microphone or codec) - enables voice feedback and audio alerts in clusters. |
| Stepper Motor Control | 6-channel SMC with microstepping support - drives analog gauge needles with precise position and smooth motion profiles. |
| Secure Hardware Extension (SHE) | Hardware-accelerated AES-128, SHA-256, and key management - enables secure boot, firmware authentication, and OTA update integrity. |
| Multi-Domain Power Management | Three independent power domains (PD1/PD2/PD4) with configurable isolation - allows selective shutdown of non-critical peripherals to reduce quiescent current. |
Applications
| Digital Instrument Cluster | Automotive Head-Up Display (HUD) Control |
|---|---|
Use Scenario: Centralized rendering of speed, RPM, fuel level, and warning indicators on TFT or segmented LCD dashboards. IC Role / Device Role / Timing Role: Primary real-time controller managing display refresh, sensor polling, CAN FD message parsing, and gauge actuation. Use Value: Integrated LCD controller and stepper motor drivers reduce external component count by ≥7 parts; ASIL-B compliance satisfies OEM functional safety requirements. | Use Scenario: Driving projection alignment, brightness control, and status overlay generation for windshield-projected HUD units. IC Role / Device Role / Timing Role: Timing-critical graphics co-processor interfacing with DMD or LCoS display engine via DDR-HSSPI and parallel bus. Use Value: 132 MHz Cortex-R5F with deterministic interrupt latency ensures sub-10 ms response to vehicle speed or ADAS alert inputs. |
| Central Body Control Module (CBCM) | Electric Vehicle (EV) Range & Charging Dashboard |
Use Scenario: Aggregating door, lighting, wiper, and HVAC status signals while coordinating with gateway ECUs over CAN FD. IC Role / Device Role / Timing Role: Secondary safety-aware node executing local control logic with redundant watchdog supervision and ECC-protected RAM. Use Value: Dual-voltage support (3.3 V/5 V) enables direct integration into legacy 5 V body networks and new 3.3 V domain architectures. | Use Scenario: Real-time calculation and visualization of remaining range, charging progress, battery thermal status, and regen energy recovery. IC Role / Device Role / Timing Role: High-precision data fusion hub combining CAN FD battery telemetry, 12-bit ADC temperature readings, and LIN-based charger status. Use Value: 40-channel 12-bit ADC with programmable gain amplifiers enables direct thermistor and voltage monitoring without signal conditioning ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/F1K | 32-bit RXv2 core (not Arm), 120 MHz max, 1.5 MB Flash, no integrated LCD controller | Requires external LCD driver; stronger focus on powertrain control than HMI | Select when migrating from Renesas ecosystem or requiring ASIL-D capable lockstep cores. |
| TC375A | TriCore™ AURIX™, 300 MHz, 4 MB Flash, 512 KB RAM, integrated Ethernet MAC | Higher compute density but larger package (LQFP-292); no native segment LCD support | Select when Ethernet backbone integration or higher ASIL-D coverage is required beyond cluster scope. |
Compared with RH850/F1K and TC375A, S6J336CHTBSE20000 delivers optimal balance of HMI-specific peripherals (LCD, stepper, audio), compact TEQFP-144 footprint, and ASIL-B compliance - making it purpose-built for cost-sensitive, space-constrained digital cluster designs.
Availability
S6J336CHTBSE20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, central body control modules, and EV range dashboard systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.
Supply support for S6J336CHTBSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and security solutions.
The TRAVEO™ T1G series - including S6J336CHTBSE20000 - was developed specifically for automotive human-machine interface applications, emphasizing integrated display control, functional safety, and secure communication in digital cockpit systems.
FAQ
What is the maximum operating frequency of the Arm Cortex-R5F core in S6J336CHTBSE20000?
The Arm Cortex-R5F core operates at up to 132 MHz, verified under recommended conditions (VCC5 = 5.0 V ±0.5 V, TA = -40 °C to 105 °C). This frequency is sustained across the full automotive temperature range with on-chip PLL and SSCG providing jitter-controlled clock synthesis.
Does S6J336CHTBSE20000 support CAN FD with hardware message filtering and buffering?
Yes - it integrates four independent CAN FD controllers, each with 16 KB of ECC-protected RAM (equivalent to 128-message buffers), plus hardware acceptance filtering, TX/RX FIFOs, and bit-rate switching support up to 5 Mbps, as confirmed in Section 7.4.12 of the datasheet.
How is the Secure Hardware Extension (SHE) implemented, and what cryptographic functions does it accelerate?
SHE is a dedicated hardware module supporting AES-128 encryption/decryption, SHA-256 hashing, and secure key storage with tamper-resistant registers. It offloads crypto operations from the CPU and enables secure boot, firmware signature verification, and encrypted OTA updates without software library dependencies.
Can the integrated LCD controller drive both static and multiplexed segment displays?
Yes - the LCD controller supports 4 common lines and up to 32 segment lines in static, 1/2, 1/3, or 1/4 multiplex configurations. It includes programmable bias voltage generation, frame frequency control, and blinking control - all configurable via dedicated registers without CPU intervention.
S6J336CHTBSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 132MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 94
- Program Memory Size:
- 112KB (112K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J336CHTBSE20000 FAQ
1.How can I place an order for S6J336CHTBSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J336CHTBSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J336CHTBSE20000 reliable?
The price and inventory of S6J336CHTBSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CHTBSE20000 is usually 5 days.
3.What payment methods are accepted for S6J336CHTBSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J336CHTBSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J336CHTBSE20000?
S6J336CHTBSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J336CHTBSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J336CHTBSE20000?
For technical support, including S6J336CHTBSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CHTBSE20000 requirements.
6.How does Aetrix verify that S6J336CHTBSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J336CHTBSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CHTBSE20000 meets industry standards.
7.What is the process for return or replacement of S6J336CHTBSE20000?
All S6J336CHTBSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CHTBSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J336CHTBSE20000 part is unused and in its original packaging.
Return procedure for S6J336CHTBSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J336CHTBSE20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

