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Infineon Technologies S6J336CJABSE20000
- Part No.:
- S6J336CJABSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
S6J336CJABSE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:1,264
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Product details
Overview
S6J336CJABSE20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control, featuring CAN FD interface, Secure Hardware Extension (SHE), ASIL-B compliance, and operation from –40 °C to 105 °C. It integrates 2,112 KB TC-Flash, 128 KB TC-RAM, 128 KB System-RAM (including 24 KB backup), and supports 5 V or 3.3 V supply.
For engineers reviewing the S6J336CJABSE20000 datasheet, S6J336CJABSE20000 pinout, S6J336CJABSE20000 application, or S6J336CJABSE20000 equivalent, key selection criteria include CAN FD channel count (4), real-time clock with automatic calibration, LCD controller (4 COM × 32 SEG), stepper motor control (6 gauges), and dual-domain power management (PD1/PD2/PD4).
Technical Context
This MCU implements a dual-core lockstep-capable Arm® Cortex®-R5F CPU running at up to 132 MHz with 16 KB I-Cache and 16 KB D-Cache. It uses 40-nm CMOS process and features three independent power domains (PD1/PD2/PD4) with embedded LDO support for 5.0 V supply regulation.
The peripheral set includes four CAN FD controllers with 16 KB ECC-protected RAM per channel (equivalent to 128-message buffers), a 12-bit ADC with 48 channels, six 32-bit reload timers, and a dedicated sound subsystem comprising PCM-PWM, I2S (2 ch), sound mixer (10-input), and waveform generator (5-output).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F, up to 132 MHz - deterministic real-time execution with MPU/TPU for ASIL-B safety partitioning |
| Flash Memory | TC-Flash: 2,112 KB / Work-Flash: 112 KB - supports secure firmware updates and dual-bank swapping |
| RAM | TC-RAM: 128 KB / System-RAM: 128 KB (incl. 16 KB + 8 KB backup) - enables context retention during low-power modes |
| Operating Temp | –40 °C to +105 °C - qualified per AEC-Q100 Grade 2 for under-hood automotive instrument clusters |
| CAN FD | 4 channels, 16 KB ECC RAM per channel - provides 128-message buffer capacity per channel with error correction |
| Security | Secure Hardware Extension (SHE) with fixed MK_CEER - enables AES-128 encryption, secure boot, and key management |
| Package | TEQFP-176, 0.5 mm pitch - thermally enhanced quad flat package for high-reliability automotive PCB layouts |
Pinout & Package
TEQFP-176 (0.5 mm pitch) package with exposed thermal pad; 176-pin layout optimized for automotive EMI resilience and thermal dissipation in instrument cluster modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53_1 | Main power supply (5.0 V or 3.3 V) | Supports dual-voltage operation; internal LDO regulates core logic from 5.0 V input |
| AVCC5 | Analog power supply | Separate 5.0 V rail for ADC and analog peripherals to minimize noise coupling |
| RTC_XIN / RTC_XOUT | Real-time clock crystal oscillator terminals | Enables autonomous timekeeping with automatic calibration via sub-clock QPRC |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 differential transceiver pins | High-speed CAN FD physical layer interface compliant with ISO 11898-1:2015 |
| LCDC_COM0–LCDC_COM3 | LCD segment driver outputs | Drive 4 common lines for multiplexed segment LCD displays (up to 4 × 32 SEG) |
| SMC_OUT0–SMC_OUT5 | Stepper motor controller outputs | Direct drive of 6-gauge stepper motors without external drivers in cluster pointer applications |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Safety Support | Integrated MPU, TPU, ECC on Flash/RAM, watchdog timers, and clock supervisor - enables ISO 26262-compliant system design without external safety monitors |
| Dual Power Domains (PD1/PD2/PD4) | Independent voltage and clock control per domain - allows selective shutdown of non-critical peripherals to reduce dynamic power in always-on cluster functions |
| Segment LCD Controller | 4 COM × 32 SEG with integrated bias generation - eliminates external LCD bias IC and reduces BOM cost in analog gauge replacement |
| Sound Subsystem | PCM-PWM + I2S + sound mixer - enables audible alerts (e.g., low-fuel warning) using internal DAC-less PWM audio synthesis |
| External Bus Interface | 22-bit address / 16-bit data bus - supports connection to external NOR flash or display memory for extended UI assets |
Applications
| Digital Instrument Cluster | Automotive HUD Controller |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, fuel level, and temperature on TFT or segmented LCD displays in vehicle dashboards. IC Role / Device Role / Timing Role: Primary cluster MCU managing LCD timing, CAN FD message parsing, and indicator PWM generation. Use Value: Integrated 4 COM × 32 SEG LCD controller and 6-gauge SMC eliminate external display drivers, reducing board area by ≥35%. | Use Scenario: Driving head-up display projection with synchronized tachometer overlay and ADAS alert icons. IC Role / Device Role / Timing Role: Timing-critical graphics controller interfacing with external display processor via DDR-HSSPI and CAN FD for vehicle data ingestion. Use Value: 132 MHz Cortex-R5F with 16 KB instruction cache ensures <50 µs interrupt latency for HUD refresh synchronization. |
| Electronic Parking Brake UI | EV Battery Status Dashboard |
Use Scenario: Visual feedback and status reporting for parking brake engagement/disengagement with haptic and audio cues. IC Role / Device Role / Timing Role: Safety-critical UI controller executing ASIL-B software partitions, monitoring brake switch inputs, and driving indicator LEDs/PWM. Use Value: SHE module enables secure firmware authentication; built-in LVD and clock supervisor ensure fail-safe state reporting. | Use Scenario: Real-time visualization of battery SOC, temperature gradients, and charging status on EV dashboard displays. IC Role / Device Role / Timing Role: High-accuracy sensor hub aggregating CAN FD battery management messages and 48-channel ADC readings from thermistor arrays. Use Value: 48-channel 12-bit ADC with hardware-triggered sampling achieves ±0.5 °C thermal measurement resolution across 12-cell packs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7017152AFP#AA0 (Renesas) | 32-bit RH850/U2A core, 200 MHz, 2 MB flash, no integrated LCD controller | Requires external LCD driver IC; stronger focus on powertrain integration than cluster-specific peripherals | Select when needing higher CPU performance and CAN FD+LIN coexistence, but accept added BOM for display interface |
| SPC58EC80E3 (STMicroelectronics) | Power Architecture e200z4, 180 MHz, 2 MB flash, 256 KB RAM, no SHE | Lacks hardware security engine; uses HSM instead - requires different secure boot architecture | Choose for legacy Power Architecture toolchain continuity and broader automotive qualification history, but re-architect security layer |
Compared with R7F7017152AFP#AA0 and SPC58EC80E3, S6J336CJABSE20000 delivers cluster-optimized integration (LCD + SMC + audio) and standardized SHE-based security, reducing system-level validation effort for ISO 26262 ASIL-B instrument clusters.
Availability
S6J336CJABSE20000 is available at Aetrix Electronics and suitable for automotive digital instrument clusters, head-up display controllers, electronic parking brake UIs, and EV battery status dashboards requiring stable component supply across multi-year vehicle production cycles.
Supply support for S6J336CJABSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G series - including S6J336CJABSE20000 - was engineered specifically for automotive digital cockpit applications, emphasizing integrated display control, functional safety, and secure communication for next-generation instrument clusters.
FAQ
What is the maximum operating frequency of the Arm® Cortex®-R5F core in S6J336CJABSE20000?
The Arm® Cortex®-R5F core operates at up to 132 MHz, verified under recommended conditions (VCC5 = 5.0 V ± 0.5 V, TA = –40 °C to 105 °C). This frequency is sustained across the full automotive temperature range with on-chip PLL and SSCG clock generation, enabling deterministic real-time response for cluster UI rendering and CAN FD message handling.
Does S6J336CJABSE20000 support CAN FD with ISO 11898-1:2015 compliance?
Yes - it integrates four fully independent CAN FD controllers compliant with ISO 11898-1:2015, each with dedicated 16 KB ECC-protected RAM (128-message buffer equivalent). Each channel supports bit rates up to 5 Mbps and flexible data payloads up to 64 bytes, validated per Infineon's automotive qualification test plan.
How is the Secure Hardware Extension (SHE) implemented in this MCU?
SHE is implemented as a dedicated hardware cryptographic module supporting AES-128 encryption/decryption, SHA-256 hashing, and secure key storage. The MK_CEER register is fixed to Enable (per part number suffix 'E'), ensuring factory-programmed master key protection and preventing runtime key erasure - required for UNECE R155-compliant secure boot.
What LCD interface capabilities does S6J336CJABSE20000 provide?
It includes a segment LCD controller supporting up to 4 common lines and 32 segment lines (4 × 32 SEG), with integrated bias generation and software-configurable duty cycle. It drives passive-matrix LCDs directly without external bias ICs, and supports partial wake-up for low-power gauge updates while main CPU remains in sleep mode.
S6J336CJABSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 132MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 126
- Program Memory Size:
- 112KB (112K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 48x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J336CJABSE20000 FAQ
1.How can I place an order for S6J336CJABSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J336CJABSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J336CJABSE20000 reliable?
The price and inventory of S6J336CJABSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CJABSE20000 is usually 5 days.
3.What payment methods are accepted for S6J336CJABSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J336CJABSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J336CJABSE20000?
S6J336CJABSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J336CJABSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J336CJABSE20000?
For technical support, including S6J336CJABSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CJABSE20000 requirements.
6.How does Aetrix verify that S6J336CJABSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J336CJABSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CJABSE20000 meets industry standards.
7.What is the process for return or replacement of S6J336CJABSE20000?
All S6J336CJABSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CJABSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J336CJABSE20000 part is unused and in its original packaging.
Return procedure for S6J336CJABSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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