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Infineon Technologies S6J336CJEBSE20000

Part No.:
S6J336CJEBSE20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP Exposed Pad
Datasheet:
AetrixS6J336CJEBSE20000.pdf
Description:
TRAVEO-40NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,330

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Product details

Overview

S6J336CJEBSE20000 from Infineon Technologies (formerly Cypress) is an automotive-grade 32-bit Arm® Cortex®-R5F microcontroller designed for digital instrument cluster control, featuring CAN FD interface, Secure Hardware Extension (SHE), ASIL-B compliance, 132 MHz operation, and -40 °C to +105 °C temperature range.

For engineers reviewing the S6J336CJEBSE20000 datasheet, S6J336CJEBSE20000 pinout, S6J336CJEBSE20000 application, or S6J336CJEBSE20000 equivalent, key selection criteria include TC-Flash size (2,112 KB), dual RAM domains (TC-RAM/System-RAM, each 128 KB), TEQFP-176 package, 4-channel CAN FD with ECC-protected RAM, and integrated LCD controller for gauge rendering.

Technical Context

This MCU implements a lockstep-capable Arm Cortex-R5F core with L1 instruction/data caches (16 KB each), programmable power domains (PD1/PD2/PD4), and hardware safety mechanisms including MPU, TPU, ECC on Flash/RAM, and clock supervision. It supports deterministic real-time execution via base timers (16 units), reload timers (6 channels), and low-latency interrupt handling.

The peripheral set is optimized for cluster applications: integrated segment LCD controller (4 COM × 32 SEG), sound waveform generator (5 outputs), PCM-PWM stereo unit, indicator PWM, and multi-function serial interfaces (12 MFS channels supporting UART/LIN/I²C/CSIO). DDR-HSSPI and external bus interface enable off-chip memory expansion.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-R5F, 132 MHz max - enables deterministic real-time execution for cluster UI and safety-critical metering tasks.
Flash MemoryTC-Flash: 2,112 KB / Work-Flash: 112 KB - supports dual-bank firmware updates and secure boot code separation.
RAMTC-RAM: 128 KB / System-RAM: 128 KB (incl. 24 KB backup area) - provides isolated data domains for functional safety partitioning.
CAN FD4 independent channels, 16 KB ECC-protected RAM per channel - delivers high-bandwidth vehicle network communication with error resilience.
Operating Temp-40 °C to +105 °C - meets AEC-Q100 Grade 2 requirements for under-hood and dashboard-mounted automotive electronics.
SecuritySecure Hardware Extension (SHE) with fixed MK_CEER - enables secure key storage, cryptographic acceleration, and anti-tampering features per ISO 15408.
PackageTEQFP-176, 0.5 mm pitch - provides high I/O count (126 GPIO) and thermal performance for dense cluster PCB layouts.

Pinout & Package

TEQFP-176 (0.5 mm pitch) package with exposed thermal pad; 176-pin grid array optimized for automotive EMI robustness and thermal dissipation in instrument cluster modules.

Pin/TerminalCircuit RoleDesign Meaning
VCC5 / VCC53_1 / VCC53_2Power supply inputsSupports dual-rail operation: 5.0 V ±0.5 V or 3.3 V ±0.3 V - enables flexible power architecture with internal LDO for domain isolation.
XTAL / EXTALClock input/outputConnects to external crystal (e.g., 4–20 MHz) for PLL reference - required for precise timing of CAN FD bit rates and RTC calibration.
TRSTn / TCK / TMS / TDI / TDOJTAG debug interfaceStandard 5-pin boundary-scan interface - enables production programming, functional test, and post-deployment diagnostics.
CANFD0_TX / CANFD0_RXCAN FD Channel 0 differential pairDedicated pins for high-speed CAN FD physical layer - supports up to 5 Mbps data phase with built-in transceiver compatibility.
SEG0–SEG31 / COM0–COM3LCD segment/com drive outputsDirect drive for 4×32 segment LCD - eliminates external LCD driver IC, reducing BOM cost and board space in analog gauge replacement.

Key Features

FeatureDesign Value
ASIL-B compliance per ISO 26262Hardware safety mechanisms (MPU, TPU, ECC, watchdogs) and diagnostic libraries certified for automotive safety integrity level B.
Integrated LCD controller4 COM × 32 SEG direct drive - reduces system component count and improves reliability versus external LCD drivers in cluster displays.
Sound subsystemPCM-PWM stereo output + 5-channel sound generator + mixer - enables audible alerts and voice feedback without external audio codec.
Dual-domain RAM architectureTC-RAM (128 KB) and System-RAM (128 KB with 24 KB backup) - supports time-critical task isolation and non-volatile state retention during sleep modes.
Multifunction serial interface (MFS)12 configurable channels supporting UART/LIN/I²C/CSIO - simplifies integration with sensors, body controllers, and infotainment gateways.

Applications

Digital Instrument ClusterAutomotive HUD Controller

Use Scenario: Real-time rendering of speedometer, tachometer, fuel level, and warning indicators on TFT or segmented LCD displays.

IC Role / Device Role / Timing Role: Primary cluster MCU executing gauge animation, CAN FD message parsing, and LCD refresh at 60 Hz.

Use Value: Integrated LCD controller and 126 GPIO eliminate external display drivers; ASIL-B support satisfies OEM functional safety requirements.

Use Scenario: Processing vehicle data (speed, ADAS status) and overlaying graphics onto head-up display optics.

IC Role / Device Role / Timing Role: Secondary display controller synchronizing HUD content with main cluster via CAN FD or SPI.

Use Value: Dual RAM domains isolate HUD rendering buffers from cluster OS tasks; 132 MHz R5F ensures sub-16 ms frame latency.

Central Body Control UnitElectric Vehicle Charging Indicator

Use Scenario: Managing lighting, door locks, window motors, and HVAC feedback in entry-level body control modules.

IC Role / Device Role / Timing Role: General-purpose automotive MCU handling LIN slave communication, PWM dimming, and ADC-based sensor monitoring.

Use Value: 48-channel 12-bit ADC and 12 MFS channels reduce need for companion ICs; -40 °C to +105 °C rating ensures under-dash reliability.

Use Scenario: Visual and audible charging status indication (e.g., LED ring, buzzer tones) at EV charging stations.

IC Role / Device Role / Timing Role: Dedicated charging interface MCU interpreting ISO 15118 messages and driving indicator peripherals.

Use Value: SHE module secures V2G communication keys; PCM-PWM and indicator PWM enable combined visual/audible feedback with single-chip implementation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive cluster MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7F701692EABG#AA0 (Renesas)Arm Cortex-R7 core, 300 MHz, 2 MB Flash, no integrated LCD controller, supports CAN FD but lacks SHE.Targeted at higher-performance clusters with graphics acceleration needs; requires external display controller.Select when >200 MHz CPU performance and external GPU interface are required; not suitable for SHE-dependent security architectures.
S32K344 (NXP)Arm Cortex-M7 core, 240 MHz, 4 MB Flash, ASIL-D capable, includes Ethernet AVB but no LCD controller or PCM-PWM.Designed for gateway and domain controller roles; lacks integrated audio/visual peripherals for direct cluster display drive.Choose for central vehicle networks requiring Ethernet and advanced safety certification; avoid when LCD/audio integration is mandatory.

Compared with R7F701692EABG#AA0 and S32K344, S6J336CJEBSE20000 uniquely combines ASIL-B safety, SHE security, integrated LCD/PCM-PWM, and CAN FD in a single TEQFP-176 package-making it optimal for cost-sensitive, safety-compliant digital cluster designs without external display or audio ICs.

Availability

S6J336CJEBSE20000 is available at Aetrix Electronics and suitable for digital instrument clusters, automotive HUD controllers, central body control units, and EV charging indicators requiring stable component supply across automotive production lifecycles.

Supply support for S6J336CJEBSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

The TRAVEO™ T1G series - including S6J336CJEBSE20000 - was developed specifically for automotive digital cockpit applications, emphasizing functional safety, display integration, and secure vehicle network connectivity.

FAQ

What is the maximum operating frequency of the Arm Cortex-R5F core in S6J336CJEBSE20000?

The Arm Cortex-R5F core operates at up to 132 MHz, verified under recommended conditions (VCC5 = 5.0 V ±0.5 V, TA = –40 °C to +105 °C). This frequency is sustained across the full automotive temperature range and enables real-time execution of cluster UI tasks, CAN FD protocol stacks, and safety monitors without throttling.

Does S6J336CJEBSE20000 support CAN FD with ISO 11898-1:2015 compliance?

Yes, S6J336CJEBSE20000 integrates four fully compliant CAN FD controllers meeting ISO 11898-1:2015, supporting data rates up to 5 Mbps in the data phase and featuring dedicated 16 KB ECC-protected RAM per channel for message buffering and error correction.

How is the Secure Hardware Extension (SHE) implemented in this MCU?

SHE is implemented as a dedicated hardware cryptographic module with fixed MK_CEER register, supporting AES-128 encryption/decryption, SHA-256 hashing, and secure key storage. It operates independently of the CPU and is accessible only via defined memory-mapped registers, satisfying ISO 15408 EAL4+ requirements for automotive security.

What LCD panel configurations does the integrated LCD controller support?

The integrated LCD controller supports 4 common (COM) lines and 32 segment (SEG) lines in static or multiplexed mode, enabling direct drive of analog-style gauge displays (e.g., speedometer needles) and segmented alphanumeric indicators without external driver ICs or voltage boosters.

S6J336CJEBSE20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP Exposed Pad
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
132MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
112KB (112K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 48x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J336CJEBSE20000 FAQ

1.How can I place an order for S6J336CJEBSE20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6J336CJEBSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6J336CJEBSE20000 reliable?

The price and inventory of S6J336CJEBSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J336CJEBSE20000 is usually 5 days.

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S6J336CJEBSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6J336CJEBSE20000?

For technical support, including S6J336CJEBSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J336CJEBSE20000 requirements.

6.How does Aetrix verify that S6J336CJEBSE20000 is sourced from the original manufacturer or authorized distributors?

All S6J336CJEBSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J336CJEBSE20000 meets industry standards.

7.What is the process for return or replacement of S6J336CJEBSE20000?

All S6J336CJEBSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J336CJEBSE20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J336CJEBSE20000 part is unused and in its original packaging.

Return procedure for S6J336CJEBSE20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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