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Infineon Technologies S6J342AFTBSV20000

Part No.:
S6J342AFTBSV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixS6J342AFTBSV20000.pdf
Description:
TRAVEO-40NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,794

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Product details

Overview

S6J342AFTBSV20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-R5F automotive microcontroller in the TRAVEO™ T1G family, designed for body control modules requiring ASIL-B compliance, CAN FD communication, and Secure Hardware Extension (SHE). It operates at 132 MHz, integrates 64-channel 12-bit ADC with 1 Msps conversion rate, 6-channel CAN FD controllers, and supports 176-pin TEQFP package with operation up to 125 °C.

For engineers reviewing the S6J342AFTBSV20000 datasheet, S6J342AFTBSV20000 pinout, S6J342AFTBSV20000 application, or S6J342AFTBSV20000 equivalent, key selection criteria include CAN FD channel count, SHE cryptographic acceleration, partial wake-up current behavior, flash retention (20 years), and ASIL-B functional safety support per ISO 26262.

Technical Context

This MCU implements a dual-core Arm Cortex-R5F configuration with lockstep or split-mode operation, integrated PLL0 with SSCG for jitter reduction, and three independent power domains enabling fine-grained low-power state management. It features hardware-based SHE for AES-128, SHA-256, and HMAC acceleration, plus ECC-protected RAM and flash memory.

The device uses a hierarchical bus architecture: HPM (33 MHz) for CPU and flash access, LLPM (33 MHz) for peripherals, and resource clock (up to 40 MHz) for timers and ADC. Its 64-channel ADC supports simultaneous sampling across multiple groups with programmable trigger sources including CAN FD message reception and timer overflows.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-R5F dual-core, lockstep or split mode, 132 MHz max - enables real-time deterministic execution with fault containment.
Flash Memory1088 KB program flash with 20-year data retention - supports long-life automotive deployments without field updates.
ADC64-channel 12-bit SAR ADC, 1 Msps conversion rate - allows high-resolution sensor monitoring across HVAC, lighting, and door modules.
CAN FD6 independent CAN FD controllers with 192 message buffers total - provides scalable gateway and domain controller connectivity.
SHESecure Hardware Extension with AES-128/SHA-256/HMAC - delivers hardware-accelerated secure boot and firmware authentication.
Operating Temp−40 °C to +125 °C - qualified for under-hood and cabin-mounted automotive ECUs.
Power Supply2.7 V to 5.5 V wide input range - compatible with both 3.3 V and 5 V automotive subsystems.

Pinout & Package

Package: TEQFP-176 (176-pin Thin Enhanced Quad Flat Package), 24 × 24 mm, 0.4 mm pitch, thermally enhanced with exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO_0–VDDIO_7I/O Power SupplyEight independent 3.3 V I/O domains enable mixed-voltage interface routing and noise isolation.
VDDA/VSSAAnalog Power/GroundDedicated analog supply pins reduce coupling noise into ADC and reference circuits.
XTALIN/XTALOUTCrystal Oscillator Input/OutputSupports external 4–20 MHz crystal for precise clock source; internal CR oscillators provide backup.
SWDIO/SWCLKDebug Interface2-pin Serial Wire Debug interface compliant with Arm CoreSight - enables non-intrusive debugging and programming.
CANFD0_TX/CANFD0_RXCAN FD Channel 0 SignalsDifferential transceiver interface supporting up to 5 Mbps data phase and ISO 11898-1 physical layer compliance.

Key Features

FeatureDesign Value
ASIL-B ComplianceFully supported per ISO 26262:2018 Part 5, including lockstep CPU, ECC RAM/flash, and diagnostic coverage reporting.
Partial Wake-Up ModeSub-µA standby current with selective peripheral wake-up via GPIO, CAN FD, or timer events - extends battery life in always-on modules.
Multifunction Serial (MFS)14-channel MFS block supporting UART, SPI, I²C, and LIN protocols - eliminates need for external protocol translators.
Power Domain ControlThree independent power domains (CPU, peripheral, analog) with individual gating and voltage scaling - enables dynamic power optimization per subsystem.
Backup Area in System-RAM12 KB of battery-backed RAM with retention during deep sleep - preserves critical session data like door lock state or HVAC settings.

Applications

Body Control Module (BCM)Automotive Gateway

Use Scenario: Centralized control of door locks, windows, mirrors, and interior lighting in modern vehicles.

IC Role / Device Role / Timing Role: Primary application MCU managing real-time I/O, CAN FD messaging, and secure firmware updates.

Use Value: Integrated SHE enables secure OTA updates; 64-channel ADC monitors multi-sensor inputs (e.g., rain/light sensors) without external signal conditioning.

Use Scenario: Protocol translation and message routing between CAN FD, LIN, and FlexRay domains in zonal architectures.

IC Role / Device Role / Timing Role: High-throughput gateway controller with six CAN FD channels and 14 MFS interfaces for cross-bus bridging.

Use Value: Eliminates need for discrete bridge ICs; deterministic 132 MHz R5F core ensures sub-millisecond latency for safety-critical message forwarding.

HVAC Control UnitAdaptive Front Lighting System (AFS)

Use Scenario: Closed-loop climate control using temperature, humidity, and solar load sensors with PWM fan and valve actuation.

IC Role / Device Role / Timing Role: Real-time sensor fusion engine with dedicated ADC groups and FRT timers for precise motor control timing.

Use Value: 1 Msps ADC captures rapid thermal transients; partial wake-up mode maintains ambient sensing during vehicle sleep without draining battery.

Use Scenario: Dynamic headlight beam shaping based on vehicle speed, steering angle, and camera input.

IC Role / Device Role / Timing Role: Safety-aware lighting controller executing ASIL-B-compliant algorithms with hardware CRC and watchdog supervision.

Use Value: Lockstep Cortex-R5F and ECC-protected RAM ensure beam positioning integrity; CAN FD enables low-latency camera-to-lighting coordination.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RH850/F1K32-bit RH850 core, 120 MHz max, 4 MB flash, no integrated SHE - relies on external security co-processor.Lacks native cryptographic acceleration; requires additional BOM cost and PCB area for security functions.Preferred where legacy toolchain compatibility outweighs SHE integration needs.
S32K344Arm Cortex-M7 core, 240 MHz, 4 MB flash, HSE security engine - different ISA, higher performance but larger code footprint.Targets higher-tier ADAS gateways; less optimized for cost-sensitive BCMs with moderate compute needs.Chosen when migrating to NXP's S32 platform ecosystem and requiring higher compute throughput.

Compared with RH850/F1K and S32K344, S6J342AFTBSV20000 offers balanced performance, native SHE, and ASIL-B certification in a compact 176-pin package-making it optimal for mid-tier automotive body electronics where security, safety, and footprint are jointly constrained.

Availability

S6J342AFTBSV20000 is available at Aetrix Electronics and suitable for Body Control Modules, Automotive Gateways, HVAC Controllers, and Adaptive Lighting Systems requiring stable component supply across extended automotive product lifecycles.

Supply support for S6J342AFTBSV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

The TRAVEO™ T1G series was developed by Cypress (acquired by Infineon in 2020) specifically for automotive body electronics demanding functional safety, secure communication, and mixed-signal integration in space-constrained ECUs.

FAQ

What is the maximum operating junction temperature for S6J342AFTBSV20000?

The device is rated for operation up to +125 °C ambient temperature, with a maximum junction temperature of +150 °C under specified thermal conditions using the TEQFP-176 package's exposed thermal pad. Thermal design must maintain θJA ≤ 35 °C/W to meet this limit in sealed enclosures.

Does S6J342AFTBSV20000 support JTAG debugging in production units?

Yes - the part includes full SWD (Serial Wire Debug) and JTAG interfaces accessible via dedicated SWDIO/SWCLK pins. Debug access remains enabled post-production unless disabled via the Chip Erase Enable Register (CEER), which is configurable during programming.

How many CAN FD message buffers are allocated per channel?

Each of the six CAN FD controllers has 32 dedicated message buffers, totaling 192 buffers. Buffers are configurable as transmit or receive, with flexible FIFO and mailbox modes supported in hardware - no software-managed buffer overhead required.

Is the 12-bit ADC synchronized across all 64 channels?

No - the ADC supports group-based simultaneous sampling (up to 8 channels per group), but full 64-channel synchronization requires sequential scanning with <1 µs inter-channel skew. True hardware synchronization is limited to groups defined in the ADC configuration registers.

S6J342AFTBSV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
112K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
3.5V ~ 5.2V
Data Converters:
A/D 35x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J342AFTBSV20000 FAQ

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Please submit a Request for Quotation (RFQ) for S6J342AFTBSV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S6J342AFTBSV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J342AFTBSV20000 is usually 5 days.

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5.How can I obtain technical support or documentation for S6J342AFTBSV20000?

For technical support, including S6J342AFTBSV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J342AFTBSV20000 requirements.

6.How does Aetrix verify that S6J342AFTBSV20000 is sourced from the original manufacturer or authorized distributors?

All S6J342AFTBSV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J342AFTBSV20000 meets industry standards.

7.What is the process for return or replacement of S6J342AFTBSV20000?

All S6J342AFTBSV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J342AFTBSV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J342AFTBSV20000 part is unused and in its original packaging.

Return procedure for S6J342AFTBSV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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