Infineon Technologies T1930N32TOFVTXPSA1
- Part No.:
- T1930N32TOFVTXPSA1
- Manufacturer:
- Infineon Technologies
- Category:
- SCRs - Modules
- Package:
- DO-200AE
- Datasheet:
-
T1930N32TOFVTXPSA1.pdf
- Description:
- SCR MODULE 3800V 4200A DO200AE
- Quantity:
- Payment:

- Shipping:

Inventory:6,478
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
T1930N32TOFVTXPSA1 from Infineon Technologies is a high-power, phase-control thyristor designed for line-frequency AC power regulation in industrial rectifiers and medium-voltage motor drives. It delivers 3200 V repetitive peak off-state voltage (VDRM/VRRM), 4200 A RMS on-state current (ITRMS), and 40 kA non-repetitive surge current (ITSM) at 10 ms, operating up to 125 °C junction temperature in two-sided cooled configurations.
For engineers reviewing the T1930N32TOFVTXPSA1 datasheet, T1930N32TOFVTXPSA1 pinout, T1930N32TOFVTXPSA1 application, or T1930N32TOFVTXPSA1 equivalent, key selection criteria include gate trigger current (≤300 mA), critical dv/dt rating (1000 V/µs), thermal resistance (0.0078 °C/W, two-sided), and latching current (1500 mA) under standard test conditions.
Technical Context
This thyristor employs a pressure-contact silicon pellet structure with dual cathode terminals (main cathode + auxiliary cathode) and flat gate control, enabling robust commutation in forced- and natural-commutated phase-controlled converters. Its 150 A/µs critical di/dt and 1000 V/µs critical dv/dt support reliable turn-on under high dv/dt transients and fast current rise in high-inductance AC line applications.
The device operates in half-wave or full-wave controlled rectifier topologies with sinusoidal or rectangular conduction angles (30°–180°), where its on-state voltage (1.60 V at 2 kA, 2.90 V at 8 kA) and slope resistance (0.20 mΩ) directly determine conduction losses and thermal design margins for heatsink sizing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDRM / VRRM | 3200 V - maximum repetitive blocking voltage in forward/reverse direction, defining usable AC line voltage class (e.g., 2.3 kV RMS systems) |
| ITRMS | 4920 A - RMS on-state current rating, used for thermal design of heatsink and cooling system under continuous conduction |
| ITAVM (TC = 85 °C) | 2180 A - average on-state current limit at case temperature 85 °C, basis for DC or low-duty-cycle load calculations |
| ITSM (10 ms) | 40000 A - non-repetitive surge current capability, determines short-circuit withstand in rectifier fault scenarios |
| (dvD/dt)cr | 1000 V/µs - minimum required snubber dv/dt immunity to prevent false triggering during voltage transients |
| RthJC (two-sided) | 0.0078 °C/W - junction-to-case thermal resistance with two-sided cooling, sets minimum heatsink thermal resistance for 125 °C Tj max |
| IGT max | 300 mA - maximum gate trigger current required at 25 °C and 12 V anode-cathode voltage, defines driver strength requirement |
| tq typ | 450 µs - typical circuit-commutated turn-off time at max junction temperature, constrains minimum commutation interval in inverter operation |
Pinout & Package
Package: Press-pack, two-sided cooled, Si-pellet with pressure contact, clamping force 42–95 kN, weight ≈1200 g, creepage distance 25 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (1) | Main power terminal (anode) | Carries full load current into device; requires direct thermal interface to heatsink in press-pack mounting |
| Cathode (2) | Main power terminal (cathode) | Carries full load current out; electrically and thermally coupled to heatsink opposite anode side |
| Gate (4) | Control input | Flat metal surface requiring low-impedance gate drive; triggers conduction when IGT ≥ 300 mA at vD = 12 V |
| Auxiliary Cathode (5) | Secondary cathode connection | Provides dedicated low-inductance return path for gate current and aids in uniform current distribution across pellet |
Key Features
| Feature | Design Value |
|---|---|
| Two-sided thermal interface | 0.0078 °C/W RthJC enables >4 kW continuous dissipation with optimized heatsink, reducing thermal bottleneck in high-power rectifiers |
| High dv/dt immunity | 1000 V/µs critical rate ensures stable blocking without spurious turn-on during fast AC line transients or switching noise |
| Pressure-contact Si pellet | Robust mechanical construction supports 42–95 kN clamping force, maintaining low contact resistance over lifetime in industrial environments |
| Dual cathode terminals | Separate main and auxiliary cathodes minimize gate loop inductance and improve triggering reliability under high di/dt conditions |
| 125 °C max junction temperature | Enables operation in high-ambient industrial enclosures without derating when heatsink temperature is maintained ≤85 °C |
Applications
| Industrial Medium-Voltage Rectifier | DC Motor Drive Power Stage |
|---|---|
Use Scenario: 3-phase, 2.3 kV AC input rectification for electrochemical process power supplies. IC Role / Device Role / Timing Role: Main power switching element in six-pulse thyristor bridge, triggered synchronously with AC zero-crossing for precise DC output voltage control. Use Value: 3200 V VDRM and 4200 A ITRMS allow direct connection to 2.3 kV grid without series stacking; 450 µs tq supports 50/60 Hz commutation timing. | Use Scenario: Field-weakening and armature voltage control in 3 MW paper mill DC drives. IC Role / Device Role / Timing Role: Phase-controlled rectifier supplying variable DC voltage to motor armature, modulated via gate firing angle. Use Value: 0.20 mΩ slope resistance minimizes conduction loss at 3000 A armature current; dual cathode reduces gate drive impedance mismatch. |
| Static VAR Compensator (SVC) | High-Power Induction Heating Inverter |
Use Scenario: Thyristor-switched capacitor/reactor banks in utility-scale reactive power compensation. IC Role / Device Role / Timing Role: Bidirectional AC switch controlling capacitor bank insertion timing relative to voltage waveform. Use Value: 1000 V/µs (dv/dt)cr prevents misfiring during rapid grid voltage fluctuations; 300 mA IGT ensures compatibility with standard gate pulse transformers. | Use Scenario: Medium-frequency (1–10 kHz) resonant inverter feeding induction furnace coils. IC Role / Device Role / Timing Role: Line-commutated inverter leg in asymmetrical half-bridge topology, conducting for 180° conduction angle. Use Value: 40 kA ITSM withstands high di/dt during resonant current peaks; 150 A/µs (di/dt)cr supports fast turn-on without snubber overshoot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar phase-control thyristor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| T1930N32TOFVTXPSA2 | Same die, identical electrical specs, but rated for 130 °C max junction temperature per updated revision | Supports higher ambient or reduced cooling margin in sealed enclosures where 125 °C-rated version would require derating | Select when extended thermal headroom is needed and manufacturer confirms qualification for target lifetime |
| TT1930N32KOF | Identical VDRM, ITRMS, and package; differs in gate trigger characteristics (IGT ≤ 250 mA) and tighter RthJC tolerance (0.0075 °C/W) | Better suited for low-power gate drivers and precision thermal management in high-reliability traction converters | Choose when gate drive power budget is constrained or junction temperature monitoring requires tighter thermal model accuracy |
Compared with T1930N32TOFVTXPSA1, the PSA2 variant extends thermal operating range while maintaining pin-and-thermal compatibility, whereas TT1930N32KOF offers improved gate sensitivity and thermal consistency-both require validation of gate drive timing and snubber design against original layout.
Availability
T1930N32TOFVTXPSA1 is available at Aetrix Electronics and suitable for industrial medium-voltage rectifiers, DC motor drive power stages, static VAR compensators, and high-power induction heating inverters requiring stable component supply across multi-year production cycles.
Supply support for T1930N32TOFVTXPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.
This part belongs to Infineon's "Netz-Thyristor" high-power phase-control thyristor product line, engineered for ruggedized AC line power conversion in industrial energy systems where reliability under high dv/dt, high di/dt, and elevated temperature is mandatory.
FAQ
What is the recommended gate drive circuit for T1930N32TOFVTXPSA1?
A pulse transformer-based gate driver delivering ≥1.6 A peak gate current with <3 µs delay (tgd) and ≥60 W peak gate power (PGM) for 0.5 ms is recommended. The gate must be driven with a sharp-edged pulse (diG/dt ≥ 1.6 A/µs) to ensure reliable turn-on at full temperature; auxiliary cathode connection must be included to minimize loop inductance.
Can T1930N32TOFVTXPSA1 be used in forced-commutated inverters?
Yes, but only in line-commutated or hybrid topologies where natural AC voltage reversal provides turn-off. Its 450 µs typical turn-off time (tq) and lack of gate turn-off capability preclude use in fully self-commutated (GTO/GCT-like) inverters; it is not rated for active gate-controlled commutation.
What is the significance of the "F" and "O" letters in the part number T1930N32TOFVTXPSA1?
The "F" denotes the 5th letter specifying critical dv/dt rating (1000 V/µs), and the "O" is the 4th letter indicating circuit-commutated turn-off time (tq = 450 µs typ). These letters encode key performance parameters defined in Infineon's thyristor coding system and are essential for cross-reference and replacement verification.
How does two-sided cooling affect thermal design compared to single-sided?
Two-sided cooling reduces RthJC to 0.0078 °C/W versus 0.0152 °C/W (anode-only) or 0.0183 °C/W (cathode-only), lowering junction temperature by ~45 °C at 3000 A ITRMS. This allows either higher current density or relaxed heatsink requirements, but demands precise parallel mounting force (42–95 kN) and matched thermal interface materials on both sides.
T1930N32TOFVTXPSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- DO-200AE
- Packaging:
- Tray
- Product Status:
- Active
- Structure:
- Single
- Number of SCRs, Diodes:
- 1 SCR
- Voltage - Off State:
- 3.8 kV
- Current - On State (It (AV)) (Max):
- 2180 A
- Current - On State (It (RMS)) (Max):
- 4200 A
- Voltage - Gate Trigger (Vgt) (Max):
- 3 V
- Current - Gate Trigger (Igt) (Max):
- 300 mA
- Current - Non Rep. Surge 50, 60Hz (Itsm):
- 40000A @ 50Hz
- Current - Hold (Ih) (Max):
- 300 mA
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
T1930N32TOFVTXPSA1 FAQ
1.How can I place an order for T1930N32TOFVTXPSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for T1930N32TOFVTXPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for T1930N32TOFVTXPSA1 reliable?
The price and inventory of T1930N32TOFVTXPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for T1930N32TOFVTXPSA1 is usually 5 days.
3.What payment methods are accepted for T1930N32TOFVTXPSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for T1930N32TOFVTXPSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for T1930N32TOFVTXPSA1?
T1930N32TOFVTXPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your T1930N32TOFVTXPSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for T1930N32TOFVTXPSA1?
For technical support, including T1930N32TOFVTXPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your T1930N32TOFVTXPSA1 requirements.
6.How does Aetrix verify that T1930N32TOFVTXPSA1 is sourced from the original manufacturer or authorized distributors?
All T1930N32TOFVTXPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that T1930N32TOFVTXPSA1 meets industry standards.
7.What is the process for return or replacement of T1930N32TOFVTXPSA1?
All T1930N32TOFVTXPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with T1930N32TOFVTXPSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The T1930N32TOFVTXPSA1 part is unused and in its original packaging.
Return procedure for T1930N32TOFVTXPSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
T1930N32TOFVTXPSA1 Tags

-
MCC95-16IO1B
IXYS

-
TT190N16SOFHPSA2
Infineon Technologies

-
MCC162-16IO1
IXYS
-
B612F-2T
Sensata-Crydom

-
MCC312-16IO1
IXYS

-
TT250N16KOFHPSA1
Infineon Technologies

-
CLA60PD1200NA
IXYS

-
MCC56-16IO1B
IXYS
-
TD120N16SOFHPSA1
Infineon Technologies

-
MCC95-12IO1B
IXYS

-
MCMA140P1600TA
IXYS
-
B512F-2
Sensata-Crydom
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

