My Inquiry
My Account
Infineon Technologies TC1724N192F80HRACKXUMA2
- Part No.:
- TC1724N192F80HRACKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
TC1724N192F80HRACKXUMA2.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,702
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC1724N192F80HRACKXUMA2 from Infineon Technologies is a 32-bit TriCore V1.3.1 super-scalar microcontroller with 133 MHz CPU clock, 1.5 MB program flash (ECC-protected), 64 KB data flash for EEPROM emulation, and integrated MultiCAN (3 nodes) and FlexRay (2-channel E-Ray) modules. It targets automotive powertrain and chassis control systems requiring deterministic real-time execution, functional safety support, and high I/O density.
For engineers reviewing the TC1724N192F80HRACKXUMA2 datasheet, TC1724N192F80HRACKXUMA2 pinout, TC1724N192F80HRACKXUMA2 application, or TC1724N192F80HRACKXUMA2 equivalent, key selection criteria include its dual-core architecture (CPU + PCP2), 95 GPIOs with 3.3 V tolerance, on-chip debug via JTAG/DAP, and compliance with automotive AEC-Q100 Grade 2 temperature range (−40 °C to +125 °C).
Technical Context
The TC1724N192F80HRACKXUMA2 implements a tightly coupled dual-processor system: a TriCore V1.3.1 CPU (133 MHz, 4-stage pipeline, FPU, DSP extensions) and a 32-bit Peripheral Control Processor (PCP2) running at 133 MHz with 8 KB PRAM and 24 KB CMEM. Both execute independently with shared memory access via 64-bit local buses and 32-bit SPB.
Its real-time subsystem includes a 16-channel DMA controller, 2×255-level priority interrupt arbiter, GPTA timer array, two CAPCOM6 units, and two GPT12 modules. Clock generation uses a PLL with configurable output frequencies, while safety-critical functions are supported by ECC on PFLASH/DFLASH and built-in BROM for boot integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore V1.3.1 super-scalar, 4-stage pipeline, 133 MHz max at −40 °C to +125 °C |
| Flash Memory | 1.5 MB PFLASH with ECC; 64 KB DFLASH for EEPROM emulation |
| RAM | 120 KB LDRAM; 8 KB ICACHE (configurable); 4 KB DCACHE (configurable) |
| Peripherals | MultiCAN (3 nodes, 64 message objects); FlexRay E-Ray (2 channels); 2×ASC, 4×SSC, MSC, MLI |
| Analog Interface | 28-channel ADC (ADC0/ADC1), 10-bit resolution; 2-channel FADC (21-cycle conversion) |
| I/O & Debug | 95 GPIOs (3.3 V tolerant); JTAG (IEEE 1149.1) and 2-wire DAP interfaces |
Pinout & Package
TC1724N192F80HRACKXUMA2 is housed in a 192-pin LQFP package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments follow Infineon's standardized TriCore pinout layout for signal grouping (power, clock, CAN/FlexRay, ADC, GPIO banks, debug, reset).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP, VDDA, VSSP, VSSA | Power supply and ground | Dedicated analog/digital domains with separate filtering paths for noise isolation |
| OSCIN, OSCOUT | Crystal oscillator input/output | Supports external crystal (1–20 MHz) or clock source for PLL-based system clock generation |
| CAN0_TX, CAN0_RX, CAN1_TX, CAN1_RX, CAN2_TX, CAN2_RX | CAN transceiver interface | Direct connection to external CAN PHY; supports ISO 11898-2 compliant signaling |
| ERAY_A_TX, ERAY_A_RX, ERAY_B_TX, ERAY_B_RX | FlexRay channel A/B differential I/O | Compliant with FlexRay v2.1 physical layer; enables deterministic time-triggered communication |
| AD0[0..13], AD1[0..13] | Analog input multiplexing | 28 total ADC inputs routed through dedicated analog pins with broken-wire detection capability |
| TCK, TMS, TDI, TDO, TRST | JTAG boundary scan/debug | Full IEEE 1149.1 compliance for CPU, PCP2, DMA, and bus-level debugging |
Key Features
| Feature | Design Value |
|---|---|
| Dual-processor real-time architecture | CPU + PCP2 operate concurrently with shared memory and independent interrupt handling for task partitioning |
| ECC-protected flash memory | Single-bit error correction and double-bit error detection on 1.5 MB PFLASH and 64 KB DFLASH |
| Automotive-grade peripheral set | Integrated MultiCAN (3 nodes), FlexRay (2-channel), ASC/SSC, GPTA, and CAPCOM6 for ASIL-B/C system design |
| On-chip debug & trace | OCDS Level 1 support via JTAG or 2-wire DAP; enables real-time tracing and calibration without external probes |
| Functional safety enablers | BROM with secure boot code; lock-step capable peripherals; memory protection unit (MPU) for memory region isolation |
Applications
| Engine Control Unit (ECU) | Brake Control Module |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary controller executing ASIL-C safety-critical algorithms with deterministic latency under 10 µs interrupt response. Use Value: 133 MHz TriCore core + GPTA timer array enables sub-microsecond PWM edge placement and synchronized ADC sampling across 28 channels. |
Use Scenario: ABS/ESP actuation logic, wheel speed monitoring, and hydraulic pressure control in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety-coordinated master node interfacing with CAN FD backbone and FlexRay for time-triggered actuator commands. Use Value: Dual CAN nodes + FlexRay E-Ray ensure redundant communication paths meeting ISO 26262 ASIL-D fault-tolerance requirements. |
| Electric Power Steering (EPS) | Transmission Control Unit (TCU) |
|
Use Scenario: Torque assist calculation, motor phase current sensing, and steering angle feedback processing in 12 V/48 V EPS systems. IC Role / Device Role / Timing Role: High-bandwidth sensor fusion hub combining ADC, FADC, and CAN messaging with <5 µs loop jitter. Use Value: 2-channel FADC (21-cycle conversion) delivers 10-bit torque sensor readings at >100 kHz sample rate for closed-loop motor control. |
Use Scenario: Gear shift scheduling, clutch engagement timing, and transmission fluid temperature compensation in automatic transmissions. IC Role / Device Role / Timing Role: Deterministic scheduler managing 64 CAN message objects and multi-rate control loops across engine/torque converter interfaces. Use Value: MultiCAN module with FIFO buffering and gateway transfer reduces CPU load by 40% vs. software-managed mailbox polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC1767N192F133HR | Higher integration: adds Ethernet MAC, enhanced security module (HSM), and larger LDRAM (192 KB) | Targeted at domain controllers requiring OTA updates and secure boot; not pin-compatible | Select when Ethernet connectivity and hardware cryptographic acceleration are required beyond TC1724 capabilities |
| TC275TP128F200NACXUMA1 | Newer TriCore V1.6.2 core, 200 MHz, 2 MB PFLASH, integrated HSM, and ASIL-D ready peripherals | Designed for zonal architectures and AUTOSAR Adaptive; requires updated toolchain and board layout | Choose for new designs targeting ASIL-D compliance and future-proofing with scalable software-defined vehicle features |
Compared with TC1724N192F80HRACKXUMA2, TC1767 offers expanded connectivity but higher BOM cost and complexity, while TC275 provides next-generation safety and performance at the expense of legacy software compatibility and footprint change.
Availability
TC1724N192F80HRACKXUMA2 is available at Aetrix Electronics and suitable for engine control units, brake control modules, electric power steering systems, and transmission control units requiring stable component supply across automotive production lifecycles.
Supply support for TC1724N192F80HRACKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
The TC1724 belongs to Infineon's TriCore automotive MCU family, designed specifically for ASIL-B/C real-time control applications in powertrain, chassis, and advanced driver assistance systems (ADAS).
FAQ
What is the maximum operating temperature range for TC1724N192F80HRACKXUMA2?
The device is qualified per AEC-Q100 Grade 2, supporting continuous operation from −40 °C to +125 °C ambient temperature. Junction temperature limits are defined in Section 5.1.5 of the datasheet, with thermal derating applied above 105 °C case temperature depending on PCB copper area and airflow.
Does TC1724N192F80HRACKXUMA2 support AUTOSAR-compliant software stacks?
Yes - the TC1724 is certified for use with AUTOSAR 4.0+ compliant MCAL drivers and supports standard OS services including OSEK/VDX and AUTOSAR OS. Its memory protection unit (MPU), interrupt controller, and debug interface meet AUTOSAR BSW requirements for memory partitioning and runtime error detection.
How is functional safety (ISO 26262) supported in this microcontroller?
The TC1724 includes hardware safety mechanisms such as ECC on all flash memories, lock-step capable peripherals (e.g., GPTA), memory protection unit (MPU), and built-in self-test (BIST) for RAM. It supports ASIL-B decomposition and ASIL-C implementation when combined with appropriate software diagnostics and system-level redundancy.
Can the FlexRay module operate independently of the CPU core?
Yes - the FlexRay E-Ray module contains its own protocol engine and buffer management logic, allowing autonomous frame transmission/reception without CPU intervention. The CPU configures the module via SPB registers and handles only status interrupts or buffer full/empty events, reducing real-time load.
TC1724N192F80HRACKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP
- Series:
- TC17xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- ASC, CANbus, MLI, MSC, SSC
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- 95
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 152K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 3.63V
- Data Converters:
- A/D 4x10b, 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC1724N192F80HRACKXUMA2 FAQ
1.How can I place an order for TC1724N192F80HRACKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC1724N192F80HRACKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC1724N192F80HRACKXUMA2 reliable?
The price and inventory of TC1724N192F80HRACKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC1724N192F80HRACKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC1724N192F80HRACKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC1724N192F80HRACKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC1724N192F80HRACKXUMA2?
TC1724N192F80HRACKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC1724N192F80HRACKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC1724N192F80HRACKXUMA2?
For technical support, including TC1724N192F80HRACKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC1724N192F80HRACKXUMA2 requirements.
6.How does Aetrix verify that TC1724N192F80HRACKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC1724N192F80HRACKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC1724N192F80HRACKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC1724N192F80HRACKXUMA2?
All TC1724N192F80HRACKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC1724N192F80HRACKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC1724N192F80HRACKXUMA2 part is unused and in its original packaging.
Return procedure for TC1724N192F80HRACKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC1724N192F80HRACKXUMA2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
