Infineon Technologies TC1797512F180EFACKXUMA1

Overview

TC1797512F180EFACKXUMA1 from Infineon Technologies is a 32-bit TriCore V1.3.1 single-chip microcontroller featuring a 180 MHz CPU, 4 MB program flash with ECC, 128 KB LDRAM, and integrated Peripheral Control Processor (PCP2) operating at 180 MHz. It integrates dual CAN controllers, FlexRay™ protocol controller, multi-channel ADCs (including FADC), and an external bus interface supporting 75 MHz burst access - deployed in automotive powertrain and chassis control units requiring ASIL-B compliance.

For engineers reviewing the TC1797512F180EFACKXUMA1 datasheet, TC1797512F180EFACKXUMA1 pinout, TC1797512F180EFACKXUMA1 application, or TC1797512F180EFACKXUMA1 equivalent, key selection criteria include real-time interrupt latency (<100 ns), on-chip memory partitioning for safety-critical code separation, E-Ray PLL jitter performance (±50 ps RMS), and BGA-416 package thermal resistance (θ_JA = 22 °C/W) for engine control module thermal design.

Technical Context

The TC1797512F180EFACKXUMA1 implements a dual-core architecture: a high-performance TriCore CPU with 4-stage super-scalar pipeline and single-precision FPU, plus a dedicated 180 MHz Peripheral Control Processor (PCP2) with 16 KB PRAM and 32 KB CMEM. Both cores share a 64-bit local memory bus but operate with independent cache hierarchies (ICACHE up to 16 KB, DCACHE up to 4 KB).

Its system-level timing relies on three clock domains: BFCLKO (base frequency output), E-Ray PLL (for FlexRay synchronization with ±50 ps RMS jitter), and peripheral clocks derived via programmable dividers from the main PLL. Memory protection is enforced via MPU with 16 regions, and safety is enhanced by lockstep-capable peripherals including dual watchdog timers and ECC-protected PFLASH/DFLASH.

Key Specifications

Pinout & Package

P/PG-BGA-416-27 package: 416-ball plastic ball grid array, 17 mm × 17 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free finish. Thermal pad on underside for PCB heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive real-time microcontroller applications.

Compared with TC1797512F180EFACKXUMA1, the TC1796 variant trades FlexRay and clock speed for cost reduction in CAN-centric systems, while the TC275 offers hardware security and smaller form factor at the expense of memory capacity and real-time I/O bandwidth needed for powertrain actuation.

Availability

TC1797512F180EFACKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and transmission control modules requiring stable component supply across extended automotive production lifecycles.

Supply support for TC1797512F180EFACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, headquartered in Munich with global R&D and manufacturing facilities.

The TC1797 belongs to Infineon's TriCore automotive microcontroller family, designed specifically for ASIL-B/C powertrain and chassis applications demanding deterministic real-time performance, functional safety, and high integration density.

FAQ

What is the maximum ambient temperature rating for continuous operation?

The TC1797512F180EFACKXUMA1 is rated for continuous operation from –40°C to +125°C ambient temperature, validated per AEC-Q100 Grade 1 qualification. Its thermal design assumes θ_JA = 22 °C/W on a 4-layer PCB with 2 oz copper and 6 thermal vias under the package thermal pad.

Does this part support JTAG-based boundary scan testing?

Yes, the TC1797512F180EFACKXUMA1 implements IEEE 1149.1-compliant JTAG TAP controller with full boundary scan support across all I/O pins. The TRSTn pin enables asynchronous reset of the TAP controller, and TDO output is slew-rate controlled for signal integrity in high-speed test fixtures.

How is functional safety compliance implemented in hardware?

Hardware safety features include lockstep-capable watchdog timers with independent clock sources, MPU with 16 configurable memory regions, ECC on all on-chip memories (PFLASH, DFLASH, LDRAM), and parity protection on instruction and data caches. These meet ISO 26262 ASIL-B requirements without external safety monitors.

Can the External Bus Interface (EBU) connect to standard NOR flash devices?

Yes, the EBU supports common 8/16-bit NOR flash devices with programmable wait-state generation, burst-mode timing up to 75 MHz, and address/data multiplexing. It implements standard Intel/AMD command sets and includes hardware write-protection control via dedicated EBU pins.