Infineon Technologies TC212S8F133SCACKXUMA1
- Part No.:
- TC212S8F133SCACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-TQFP Exposed Pad
- Datasheet:
-
TC212S8F133SCACKXUMA1.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 80TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,800
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC212S8F133SCACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating at up to 133 MHz, 1 MB program flash, 96 KB data flash for EEPROM emulation, and integrated safety features including ECC-protected memories, SMU, and MTU. It supports ASIL-D functional safety and targets automotive powertrain and chassis control systems.
For engineers reviewing the TC212S8F133SCACKXUMA1 datasheet, TC212S8F133SCACKXUMA1 pinout, TC212S8F133SCACKXUMA1 application, or TC212S8F133SCACKXUMA1 equivalent, key selection criteria include its dual-core lockstep architecture, 128-message-object MultiCAN+ module, GTM-based timing autonomy, and 133 MHz real-time deterministic execution under extended temperature.
Technical Context
This MCU implements a safety-certified dual-core architecture where the primary TC1.6E core executes application code while its shadow checker core performs real-time instruction-level comparison. The system includes an on-chip 64-bit SRI crossbar enabling concurrent access between CPU, DMA, and memory subsystems.
It integrates a dedicated Safety Management Unit (SMU) that monitors clock, reset, memory, and peripheral health, and triggers safe state transitions upon fault detection. The GTM provides hardware-accelerated signal conditioning, PWM generation, and time-triggered I/O management independent of CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore TC1.6E + lockstepped checker core - enables ASIL-D compliance via hardware-level fault detection |
| Max Clock Frequency | 133 MHz across full industrial temperature range - guarantees deterministic real-time response in safety-critical loops |
| Flash Memory | 1 MB PFLASH + 96 KB DFLASH - supports secure boot, OTA updates, and EEPROM emulation without external storage |
| ADC System | VADC with 2 clusters, 12+12 channels, 0–5.5 V input range - enables direct sensor interfacing for engine knock, pressure, and position sensing |
| CAN Interface | MultiCAN+ with 3 nodes, 128 message objects, CAN FD support - allows high-bandwidth vehicle network communication with flexible message filtering and FIFO buffering |
| Timer Subsystem | GTM + CCU6 + GPT12 - delivers autonomous PWM, capture/compare, and time-triggered I/O for motor control and ignition timing |
| Safety Features | ECC on all SRAM/Flash, SMU, MTU, IOM - satisfies ISO 26262 ASIL-D requirements without external safety monitor ICs |
Pinout & Package
TC212S8F133SCACKXUMA1 uses the PG-TQFP-80-7 package: 80-pin thermally enhanced thin quad flat pack with 0.5 mm pitch, exposed thermal pad, and RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | 1.3 V Core Power Supply | Supplies regulated voltage to CPU, cache, and internal logic; requires low-noise decoupling near pin |
| VDDH | 5 V I/O and Analog Supply | Provides power for GPIO, ADC reference, CAN transceivers, and SENT receivers |
| OSCIN / OSCOUT | External Crystal Oscillator Input/Output | Supports 1–20 MHz crystal for precise clock generation; used with internal PLL for 133 MHz system clock |
| TRSTN | JTAG Test Reset | Active-low asynchronous reset for debug interface; required for OCDS Level 1 debugging and flash programming |
| ESR0 / ESR1 | Error Signal Outputs | Indicate SMU-detected faults (e.g., memory ECC error, clock failure); drive external watchdog or fail-safe circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Architecture | Hardware-synchronized TC1.6E + checker core ensures continuous instruction-level comparison for transient fault detection |
| On-Chip Safety Monitoring | SMU independently validates clock stability, reset integrity, memory ECC status, and peripheral health without CPU involvement |
| Autonomous GTM Timing Engine | GTM handles complex PWM, sigma-delta modulation, and time-triggered I/O sequencing-reducing CPU load in motor control applications |
| MultiCAN+ with CAN FD | Three CAN nodes share 128 configurable message objects and support ISO 11898-1:2015 FD frames up to 5 Mbit/s for high-speed diagnostics and actuator control |
| VADC with Dual Clusters | Two independent ADC kernels enable simultaneous sampling of engine sensors (e.g., crankshaft position + throttle angle + intake pressure) |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D software stack with lockstep CPU, GTM-managed ignition timing, and VADC-sampled sensor fusion. Use Value: Deterministic 133 MHz execution and hardware ECC ensure correct torque delivery and fail-safe shutdown within <100 µs upon fault detection. | Use Scenario: Closed-loop torque assist, motor phase current regulation, and steering angle feedback in 12 V EPS systems. IC Role / Device Role / Timing Role: Main controller managing FOC motor control via GTM PWM outputs, SENT-based torque sensor interface, and ASCLIN LIN communication to column module. Use Value: Integrated SENT receivers and GTM's hardware current reconstruction eliminate need for external ADCs or timers, reducing BOM count by 3 components. |
| Brake-by-Wire Actuator | Transmission Control Module (TCM) |
Use Scenario: Redundant hydraulic pressure control, wheel speed monitoring, and fail-operational braking coordination. IC Role / Device Role / Timing Role: ASIL-D safety controller running dual-channel brake pressure algorithms, using MultiCAN+ for cross-module arbitration and SMU for runtime self-test. Use Value: ECC-protected 1 MB flash stores redundant firmware images; SMU-triggered safe state transition meets ISO 26262 requirement for <200 ms fail-safe reaction. | Use Scenario: Gear shift scheduling, clutch engagement control, and adaptive learning for automatic transmissions. IC Role / Device Role / Timing Role: High-integrity controller interfacing with solenoid drivers via GTM PWM, reading transmission sensors via VADC, and communicating via CAN FD to engine ECU. Use Value: 128-message-object CAN FD buffer enables zero-latency gear shift commands and synchronized torque requests during tip-in/tip-out events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC213S12F133SCACKXUMA1 | PG-TQFP-100 package, adds 2 extra ASCLIN interfaces and 1 additional QSPI channel | Required when LIN master + slave coexistence or dual external flash interfaces needed | Select if board layout accommodates larger footprint and additional serial peripherals are mandatory |
| TC222S8F133SCACKXUMA1 | Same package and pinout but includes enhanced EVR with higher current capability and improved transient response | Better suited for high-current I/O domains or noisy power environments requiring tighter voltage regulation | Choose when VDDH supply ripple exceeds ±50 mV or peak I/O current >200 mA per domain |
Compared with TC212S8F133SCACKXUMA1, TC213 offers expanded serial connectivity at the cost of PCB area, while TC222 improves power delivery robustness without changing pin compatibility-making TC222 a drop-in upgrade for noise-sensitive deployments.
Availability
TC212S8F133SCACKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake-by-wire actuation, and transmission control modules requiring stable component supply across long production lifecycles.
Supply support for TC212S8F133SCACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with R&D centers across Europe, Asia, and the Americas.
The AURIX™ TC2xx product line was designed specifically for ISO 26262 ASIL-D automotive applications-including engine management, chassis control, and advanced driver assistance-delivering hardware-based safety mechanisms and deterministic real-time performance.
FAQ
What is the maximum ambient temperature rating for TC212S8F133SCACKXUMA1?
The device is qualified for operation from −40 °C to +125 °C ambient temperature, verified per AEC-Q100 Grade 1 requirements. This rating applies to the full 133 MHz operating frequency range and includes derating of internal regulators and flash endurance. Thermal design must maintain case temperature below 135 °C under worst-case power dissipation.
Does TC212S8F133SCACKXUMA1 support JTAG debugging in production mode?
Yes, it supports IEEE 1149.1 four-wire JTAG and ARM CoreSight DAP interfaces for full OCDS Level 1 debug access-including CPU register inspection, flash programming, and real-time trace-even after security fuses are blown. Debug authentication keys must be provisioned during initial programming to retain access post-lock.
How is EEPROM emulation implemented in the 96 KB DFLASH?
The DFLASH implements wear-leveling and atomic page update logic via Infineon's Flash API (FEE), supporting up to 100,000 write cycles per logical sector. Each 256-byte logical EEPROM block maps to multiple physical flash pages, with background garbage collection managed by the FEE driver during idle CPU cycles.
Can the GTM replace external timer/peripheral ICs in motor control designs?
Yes-the GTM provides fully autonomous PWM generation, dead-time insertion, sigma-delta modulation, and position capture with sub-microsecond resolution. In typical 3-phase inverter control, it eliminates need for external gate drivers with integrated dead-time, external comparators for overcurrent protection, and discrete timers for commutation sequencing.
TC212S8F133SCACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 133MHz
- Connectivity:
- CANbus, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 59
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 56K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC212S8F133SCACKXUMA1 FAQ
1.How can I place an order for TC212S8F133SCACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC212S8F133SCACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC212S8F133SCACKXUMA1 reliable?
The price and inventory of TC212S8F133SCACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC212S8F133SCACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC212S8F133SCACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC212S8F133SCACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC212S8F133SCACKXUMA1?
TC212S8F133SCACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC212S8F133SCACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC212S8F133SCACKXUMA1?
For technical support, including TC212S8F133SCACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC212S8F133SCACKXUMA1 requirements.
6.How does Aetrix verify that TC212S8F133SCACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC212S8F133SCACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC212S8F133SCACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC212S8F133SCACKXUMA1?
All TC212S8F133SCACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC212S8F133SCACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC212S8F133SCACKXUMA1 part is unused and in its original packaging.
Return procedure for TC212S8F133SCACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC212S8F133SCACKXUMA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

