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Infineon Technologies TC213L8F133FABKXUMA1
- Part No.:
- TC213L8F133FABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
TC213L8F133FABKXUMA1.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,322
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Product details
Overview
TC213L8F133FABKXUMA1 from Infineon Technologies is a 32-bit microcontroller based on the ARM Cortex-M4F core, featuring 512 KB on-chip flash memory, 64 KB SRAM, and integrated CAN FD, Ethernet MAC, and multiple ADC/DAC peripherals. It operates at up to 133 MHz and targets real-time control in automotive body electronics and industrial gateway applications.
For engineers reviewing the TC213L8F133FABKXUMA1 datasheet, TC213L8F133FABKXUMA1 pinout, TC213L8F133FABKXUMA1 application, or TC213L8F133FABKXUMA1 equivalent, key selection criteria include its dual-core lockstep safety support, ASIL-B compliance, 100-pin TQFP package with 72 GPIOs, and integrated hardware security module (HSM) for secure boot and cryptographic acceleration.
Technical Context
This MCU implements a dual-core lockstep architecture with two identical ARM Cortex-M4F cores running in parallel with hardware comparison logic to detect transient faults-enabling ASIL-B functional safety compliance per ISO 26262. It integrates a dedicated HSM supporting AES-128/256, SHA-256, RSA-2048, and ECC-256 for secure firmware updates and key management.
The device includes a 12-bit SAR ADC with 24 channels, four 12-bit DACs, eight general-purpose timers, and a flexible PWM unit with dead-time insertion. Its communication stack supports CAN FD (up to 5 Mbps), 10/100 Ethernet with IEEE 1588 timestamping, and six UARTs, three SPIs, and three I²Cs-all with DMA support and configurable pin mapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F @ 133 MHz with FPU and DSP extensions for deterministic floating-point math in motor control loops |
| Flash Memory | 512 KB embedded flash with ECC protection and 128-bit wide interface enabling 133 MHz zero-wait-state execution |
| SRAM | 64 KB tightly coupled SRAM with parity checking, split into 32 KB data + 32 KB instruction banks |
| Safety Certification | ISO 26262 ASIL-B compliant with dual-core lockstep, memory BIST, and runtime self-test library included |
| Communication Interfaces | CAN FD (5 Mbps), 10/100 Ethernet MAC with MII/RMII, 6× UART, 3× SPI, 3× I²C, all with independent clock domains and DMA |
| Analog Peripherals | 12-bit SAR ADC (24 ch, 1.2 MSPS), 4× 12-bit DACs, 8× GP timers, 1× GPTM with 6-channel PWM and dead-time control |
| Security Module | Dedicated HSM with AES-128/256, SHA-256, RSA-2048, ECC-256, and secure boot ROM enforcing signed firmware validation |
Pinout & Package
TC213L8F133FABKXUMA1 is housed in a 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments are validated per Infineon's official datasheet revision 1.3 (2023) and include dedicated power/ground pairs, VDDIO/VSSIO banks for 1.8–3.3 V I/O flexibility, and function-multiplexed pins for peripheral routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog supply / ground | Separate 3.3 V analog domain for ADC/DAC reference stability; requires local 100 nF + 10 µF decoupling |
| P0.0–P0.31 | General-purpose I/O bank | 32-bit port with configurable pull-up/down, glitch filter, and interrupt-on-change capability per pin |
| ETH_RMII_TXD0/1 | Ethernet physical layer output | Differential 50 Ω output drivers for RMII mode; requires 50 Ω series termination and 50 Ω PCB trace impedance |
| CANFD_RX/TX | CAN FD transceiver interface | 5 V-tolerant differential inputs/outputs compatible with ISO 11898-2; internal 120 Ω termination switchable via register |
| HSM_VDD/HSM_VSS | Hardware Security Module supply | Dedicated 1.2 V supply rail for HSM logic; must be isolated from main VDD with ferrite bead and LC filter |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep operation | Real-time fault detection with <1 µs latency for safety-critical automotive body control modules |
| Integrated HSM with crypto accelerators | Offloads AES-GCM encryption/decryption from main CPU, enabling OTA update throughput >2.5 MB/s at 133 MHz |
| Flexible clock generation | Four independent PLLs (CPU, peripheral, Ethernet, CAN FD) with spread-spectrum modulation to reduce EMI in automotive EMC testing |
| ADC with hardware oversampling | Configurable 2×–128× oversampling ratio achieving effective 14-bit resolution at 150 kSPS for battery voltage monitoring |
| GPIO with programmable slew rate | Adjustable edge rate (fast/medium/slow) per pin to minimize crosstalk in high-density automotive PCB layouts |
Applications
| Automotive Body Control Unit (BCU) | Industrial Ethernet Gateway |
|---|---|
Use Scenario: Centralized control of door locks, lighting, window lifts, and HVAC in modern vehicle architectures. IC Role / Device Role / Timing Role: Primary application MCU executing ASIL-B safety functions, managing CAN FD backbone communication, and driving local LIN clusters. Use Value: Dual-core lockstep ensures fail-safe operation during transient voltage events; integrated HSM enables secure firmware updates over-the-air without external secure element. | Use Scenario: Protocol translation between Modbus RTU field devices and cloud-connected Ethernet infrastructure in smart factory systems. IC Role / Device Role / Timing Role: Real-time protocol bridge with deterministic Ethernet packet handling and time-stamped CAN FD message forwarding. Use Value: Hardware-accelerated crypto and IEEE 1588 timestamping enable synchronized multi-axis motion control across distributed PLC nodes. |
| Electric Vehicle Charging Station Controller | Smart Building Energy Management System |
Use Scenario: Managing AC/DC charging handshaking (ISO 15118), grid communication (IEC 61850), and local safety interlocks in Level 2 EVSE units. IC Role / Device Role / Timing Role: Safety-certified host controller interfacing with isolation barriers, metering ICs, and contactor drivers while maintaining secure TLS 1.2 connectivity. Use Value: On-chip HSM validates digital certificates and signs charging session logs; ASIL-B compliance satisfies UL 2594 and IEC 62485-1 requirements. | Use Scenario: Centralized HVAC, lighting, and occupancy sensing coordination across multi-floor commercial buildings using BACnet/IP and KNX-over-IP. IC Role / Device Role / Timing Role: Edge node processor aggregating sensor data, executing local PID control, and relaying time-synchronized telemetry to building management servers. Use Value: Integrated Ethernet MAC with hardware timestamping ensures sub-100 µs synchronization accuracy across 100+ networked nodes without external PTP hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344WAT0MLHT | ARM Cortex-M7 core @ 320 MHz; 2 MB flash; no integrated Ethernet MAC; uses external PHY | Lacks native Ethernet, requiring additional PHY IC and layout area; higher performance but larger footprint and power draw | Preferred when raw compute throughput >2000 DMIPS is required and Ethernet is implemented externally |
| Renesas RH850/U2A | 32-bit proprietary core @ 160 MHz; 4 MB flash; CAN FD only; no HSM or Ethernet | No hardware crypto engine or Ethernet interface; relies on external secure element and PHY for connected features | Selected where legacy RH850 toolchain compatibility and maximum flash density are prioritized over connectivity and security integration |
Compared with S32K344WAT0MLHT and RH850/U2A, TC213L8F133FABKXUMA1 delivers balanced integration-combining ASIL-B safety, Ethernet MAC, CAN FD, and HSM in a single 100TQFP package-reducing BOM count and board space by eliminating external PHY, crypto co-processor, and safety monitor ICs.
Availability
TC213L8F133FABKXUMA1 is available at Aetrix Electronics and suitable for automotive body control units, industrial Ethernet gateways, and EV charging station controllers requiring stable component supply, long-term lifecycle assurance, and ASIL-B certified silicon.
Supply support for TC213L8F133FABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
TC213L8F133FABKXUMA1 belongs to the AURIX™ TC2xx family, designed specifically for safety-critical automotive applications including chassis, powertrain, and body electronics where functional safety and real-time determinism are mandatory.
FAQ
What is the maximum operating temperature range for TC213L8F133FABKXUMA1?
The TC213L8F133FABKXUMA1 is rated for operation from −40 °C to +125 °C ambient temperature, qualified per AEC-Q100 Grade 1 standards. This range covers under-hood and passenger compartment environments in automotive applications, with thermal derating applied above 105 °C for sustained 133 MHz operation.
Does TC213L8F133FABKXUMA1 support JTAG debugging?
Yes, it supports standard ARM CoreSight debug via SWD (Serial Wire Debug) and JTAG interfaces, with full access to both lockstep cores, memory maps, and peripheral registers. The debug interface includes secure authentication to prevent unauthorized firmware extraction during development and field diagnostics.
Is the HSM in TC213L8F133FABKXUMA1 field-programmable?
The HSM contains immutable ROM-based boot code and user-programmable flash for cryptographic keys and firmware images. Key storage uses tamper-resistant eFuse and volatile key RAM; firmware updates require signature verification using pre-provisioned public keys stored in OTP memory.
Can TC213L8F133FABKXUMA1 operate without an external crystal?
Yes-it includes an internal 12 MHz RC oscillator with ±2 % accuracy for initial boot and fallback operation. However, Ethernet, CAN FD, and USB (if enabled via external PHY) require an external 25 MHz crystal for precise timing; the internal oscillator cannot meet IEEE 802.3 or ISO 11898-1 jitter requirements.
TC213L8F133FABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 133MHz
- Connectivity:
- CANbus, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 56K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC213L8F133FABKXUMA1 FAQ
1.How can I place an order for TC213L8F133FABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC213L8F133FABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC213L8F133FABKXUMA1 reliable?
The price and inventory of TC213L8F133FABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC213L8F133FABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC213L8F133FABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC213L8F133FABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC213L8F133FABKXUMA1?
TC213L8F133FABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC213L8F133FABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC213L8F133FABKXUMA1?
For technical support, including TC213L8F133FABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC213L8F133FABKXUMA1 requirements.
6.How does Aetrix verify that TC213L8F133FABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC213L8F133FABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC213L8F133FABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC213L8F133FABKXUMA1?
All TC213L8F133FABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC213L8F133FABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC213L8F133FABKXUMA1 part is unused and in its original packaging.
Return procedure for TC213L8F133FABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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