My Inquiry
My Account
Infineon Technologies TC213L8F133FACKXUMA1
- Part No.:
- TC213L8F133FACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
TC213L8F133FACKXUMA1.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:988
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC213L8F133FACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating at up to 133 MHz, 1 MB program flash, 96 KB data flash for EEPROM emulation, and integrated MultiCAN+ (3 nodes, 128 message objects). It supports ASIL-D functional safety and targets automotive powertrain and chassis control units requiring deterministic real-time response and fault containment.
For engineers reviewing the TC213L8F133FACKXUMA1 datasheet, TC213L8F133FACKXUMA1 pinout, TC213L8F133FACKXUMA1 application, or TC213L8F133FACKXUMA1 equivalent, this part delivers verified ECC-protected memory, hardware I/O monitoring, GTM-based signal conditioning, and CAN FD-capable communication - all validated for ISO 26262-compliant safety-critical embedded systems.
Technical Context
The TC213L8F133FACKXUMA1 implements a dual-core lockstep architecture: one TC1.6E scalar CPU and its shadow checker core, synchronized at instruction level for continuous fault detection. Its Safety Management Unit (SMU) monitors clock, reset, voltage, and memory integrity via dedicated safety channels.
It integrates a 64-bit Cross Bar Interconnect (SRI) enabling concurrent access between CPU, DMA, GTM, and memories, while the on-chip EVR provides regulated 1.3 V core supply and 3.3 V I/O supply - both monitored by independent voltage supervisors and supported by configurable power-up sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E + lockstepped checker core; binary-compatible with TC1.6P, enabling reuse of legacy toolchains and safety-certified software stacks. |
| Max Clock Frequency | 133 MHz across full industrial temperature range (–40 °C to +125 °C); enables deterministic execution of complex control algorithms within tight timing budgets. |
| Flash Memory | 1 MB PFLASH with ECC protection and 96 KB DFLASH supporting EEPROM emulation; allows safe over-the-air firmware updates and parameter storage without external nonvolatile memory. |
| CAN Interface | MultiCAN+ module with 3 CAN FD nodes and 128 configurable message objects; supports gateway routing, FIFO buffering, and time-triggered communication for distributed vehicle networks. |
| Analog-to-Digital Converter | VADC with two independent kernels, 12+12 input channels, 0–5.5 V input range; enables simultaneous sampling of engine sensors (e.g., throttle position, knock, pressure) with hardware post-processing. |
| Safety Certification | ASIL-D compliant per ISO 26262; includes SMU, MTU (memory test unit), IOM (I/O monitor), and OCDS Level 1 debug support - all required for production deployment in safety-critical ECUs. |
| Package | PG-TQFP-100-23; 100-pin thermally enhanced thin quad flat pack with 0.5 mm pitch, optimized for automotive PCB assembly and thermal dissipation in engine bay environments. |
Pinout & Package
TC213L8F133FACKXUMA1 is housed in a PG-TQFP-100-23 package: 100-pin, 0.5 mm pitch, 14 mm × 14 mm body, exposed thermal pad, RoHS-compliant lead-free finish. Designed for high-reliability automotive PCBs with controlled impedance routing and thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3 | Core Power Supply | 1.3 V regulated supply input for CPU and logic; requires local 10 µF ceramic decoupling and must be sequenced before VDDIO. |
| VDDIO_3.3 | I/O Power Supply | 3.3 V supply for all digital I/O banks; supports 5 V-tolerant inputs on designated pins when configured as inputs only. |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Differential input/output for external 20 MHz crystal; feeds system PLL and enables precise clock generation for CAN FD bit timing and ADC sampling. |
| TRSTN | JTAG Test Reset | Active-low asynchronous reset for JTAG TAP controller; used during boundary scan and debug initialization, independent of chip reset. |
| ERAY0_TX / ERAY0_RX | FlexRay Channel 0 | Dedicated differential transceiver pins for FlexRay communication; not present on TC213 - reserved but unconnected per datasheet Table 2.2.1. |
| ASC0_TX / ASC0_RX | ASCLIN UART Channel 0 | Asynchronous serial interface supporting LIN 2.1 and J2602 protocols; used for diagnostic communication with vehicle gateways and sensor modules. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Real-time instruction-level comparison between TC1.6E and shadow core detects transient faults with <1 µs latency, satisfying ASIL-D diagnostic coverage requirements. |
| ECC-Protected Memories | All SRAM (DSPR/PSPR), Flash (PFLASH/DFLASH), and peripheral register banks include single-bit error correction and double-bit error detection - eliminating silent data corruption. |
| Generic Timer Module (GTM) | Autonomous timer subsystem with TOM (timer output), DTM (digital timer), and TIM (input capture) units; offloads PWM generation, encoder counting, and pulse-width measurement from CPU. |
| Hardware I/O Monitor (IOM) | Configurable digital I/O health checker that verifies pin state transitions, stuck-at faults, and timing violations - critical for validating actuator driver interfaces. |
| MultiCAN+ with CAN FD | Three independent CAN FD controllers sharing one message RAM; supports mixed classical CAN and CAN FD frames on same bus, enabling scalable ECU communication without protocol gateways. |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion control using crankshaft/camshaft position, air mass, and oxygen sensor inputs. IC Role / Device Role / Timing Role: Primary safety-certified controller executing closed-loop fuel injection and ignition timing with sub-microsecond jitter tolerance. Use Value: GTM handles crank signal edge detection and spark timing generation autonomously, freeing CPU cycles for model-based torque calculation and diagnostics. |
Use Scenario: Torque assist coordination between driver input and motor current feedback under varying road loads. IC Role / Device Role / Timing Role: ASIL-D safety controller managing motor phase current sensing, FOC execution, and torque limitation with fail-safe torque ramp-down. Use Value: Dual VADC clusters sample 6-phase current simultaneously with hardware averaging, enabling precise field-oriented control without CPU intervention. |
| Brake-by-Wire System | Vehicle Gateway Module |
Use Scenario: Redundant hydraulic pressure control with cross-channel validation and emergency fallback to mechanical backup. IC Role / Device Role / Timing Role: Primary controller in dual-ECU architecture performing brake pedal position interpretation, pressure modulation, and HIL-tested fail-operational logic. Use Value: SMU and MTU continuously validate memory, clock, and I/O integrity; lockstep CPU ensures no undetected computation errors affect braking commands. |
Use Scenario: Protocol translation between CAN FD, LIN, and Ethernet domains in zonal architecture vehicles. IC Role / Device Role / Timing Role: High-throughput gateway processor routing diagnostic messages, OTA update packets, and sensor fusion data across network boundaries. Use Value: Four QSPI channels interface external flash for secure boot images; MultiCAN+ handles 128 message objects with hardware FIFOs to prevent buffer overflow during peak bus load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC214L8F133FACKXUMA1 | 144-pin PG-TQFP variant with additional 16 I/O pins, extra GTM TOM channel, and extended DFLASH (128 KB); identical CPU, flash, and safety features. | Required where higher I/O count or additional timer resources are needed for multi-sensor integration or expanded actuator control. | Select when board layout accommodates larger package and application demands >100 GPIO or >2 GTM TOM units. |
| TC223L8F133FACKXUMA1 | Same pinout and memory map, but adds second lockstep CPU pair (dual-core lockstep), enhanced SMU, and extended diagnostic coverage for ASIL-D decomposition. | Suitable for systems requiring dual independent safety channels (e.g., redundant brake control) or higher diagnostic coverage metrics. | Choose when functional safety architecture mandates dual independent processing paths or certified diagnostic coverage >99% DC. |
Compared with TC213L8F133FACKXUMA1, TC214 offers more I/O and memory headroom in a larger package, while TC223 delivers higher safety assurance through dual lockstep cores - making TC213 optimal for cost-sensitive, single-channel ASIL-D applications like mid-tier engine management.
Availability
TC213L8F133FACKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, and brake-by-wire systems requiring stable component supply, long lifecycle commitment, and full AEC-Q100 Grade 1 qualification.
Supply support for TC213L8F133FACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and automotive-grade wafer fabs.
This device belongs to the AURIX™ TC2xx family - engineered specifically for ISO 26262-compliant automotive control applications, emphasizing functional safety, real-time determinism, and robustness in harsh ECU environments.
FAQ
What is the maximum ambient temperature rating for TC213L8F133FACKXUMA1?
The TC213L8F133FACKXUMA1 is qualified for operation from –40 °C to +125 °C ambient temperature per AEC-Q100 Grade 1 specification. This rating applies to the full 133 MHz performance envelope and all integrated peripherals including VADC, GTM, and MultiCAN+, with thermal derating not required within this range.
Does TC213L8F133FACKXUMA1 support CAN FD with ISO 11898-1:2015 physical layer compliance?
Yes - the MultiCAN+ module supports CAN FD up to 5 Mbit/s data phase and complies with ISO 11898-1:2015. It includes programmable bit timing, automatic protocol switching between Classical CAN and CAN FD, and hardware CRC calculation with flexible DLC handling - all verified in Infineon's AURIX™ CAN FD conformance test suite.
How is the 96 KB Data Flash (DFLASH) used for EEPROM emulation?
The DFLASH implements Infineon's EEPROM Emulation Driver (EED) library, which manages wear leveling, atomic write operations, and background garbage collection across 96 KB of ECC-protected flash sectors. It provides byte-addressable read/write access with typical endurance of 100,000 cycles and data retention >15 years at 125 °C - validated per AEC-Q100 stress tests.
Is external debugging supported via JTAG or SWD?
TC213L8F133FACKXUMA1 supports IEEE 1149.1 JTAG (4-wire) and ARM CoreSight DAP (2-wire SWD) interfaces for full OCDS Level 1 debug access. Both enable non-intrusive breakpoints, memory inspection, and real-time trace via Infineon's DAS-1 debugger and compatible third-party tools like Lauterbach TRACE32.
TC213L8F133FACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 133MHz
- Connectivity:
- CANbus, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 56K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC213L8F133FACKXUMA1 FAQ
1.How can I place an order for TC213L8F133FACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC213L8F133FACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC213L8F133FACKXUMA1 reliable?
The price and inventory of TC213L8F133FACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC213L8F133FACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC213L8F133FACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC213L8F133FACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC213L8F133FACKXUMA1?
TC213L8F133FACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC213L8F133FACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC213L8F133FACKXUMA1?
For technical support, including TC213L8F133FACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC213L8F133FACKXUMA1 requirements.
6.How does Aetrix verify that TC213L8F133FACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC213L8F133FACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC213L8F133FACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC213L8F133FACKXUMA1?
All TC213L8F133FACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC213L8F133FACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC213L8F133FACKXUMA1 part is unused and in its original packaging.
Return procedure for TC213L8F133FACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC213L8F133FACKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
