My Inquiry
My Account
Infineon Technologies TC214L8F133FABKXUMA1
- Part No.:
- TC214L8F133FABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC214L8F133FABKXUMA1.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,886
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC214L8F133FABKXUMA1 from Infineon is a TriCore™-based AURIX™ automotive microcontroller with single 133 MHz CPU core, 512 KB eFlash with ECC, 64 KB EEPROM-emulated data flash, 56 KB SRAM with ECC, and integrated MultiCAN+ (including CAN FD), GTM timer, 24-channel 12-bit ADC, and SENT interfaces - deployed in engine control units and battery management systems requiring ASIL-B compliance.
For engineers reviewing the TC214L8F133FABKXUMA1 datasheet, TC214L8F133FABKXUMA1 pinout, TC214L8F133FABKXUMA1 application, or TC214L8F133FABKXUMA1 equivalent, key selection criteria include lockstep readiness, CAN FD channel count, GTM configurability, EEPROM endurance (125 k cycles), and TQFP-100 thermal performance up to +125°C.
Technical Context
The device implements a single TriCore™ 1.6E core at 133 MHz with DSP extensions and FPU support, paired with a safety-oriented peripheral set including GTM for time-critical signal processing, CCU6 and GPT12 for redundant timing, and OCDS for on-chip debug. It uses a unified 3.3 V supply and integrates BROM for boot code execution.
Safety architecture includes access permission system, safe DMA, voltage/temperature monitoring, and Safety Management Unit (SMU) enabling ISO 26262-compliant development up to ASIL-B; lockstep capability is implemented via optional configuration, not hardware-enforced in this variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single TriCore™ 1.6E @ 133 MHz with DSP/FPU - enables real-time motor control and sensor fusion without external co-processor |
| Flash Memory | 512 KB eFlash with ECC - supports robust firmware storage and runtime error correction in harsh ECU environments |
| Data Storage | 64 KB EEPROM-emulated flash (125 k write cycles) - provides wear-levelled non-volatile parameter storage for calibration data |
| RAM | 56 KB SRAM with ECC - ensures integrity of stack, heap, and real-time task variables under radiation or voltage fluctuation |
| ADC | 24-channel 12-bit SAR ADC - delivers high-resolution analog sensing for throttle position, temperature, and current feedback |
| Connectivity | 3x CAN (CAN FD capable), 2x LIN, 4x QSPI - supports multi-bus vehicle networking with >5 Mbps data rate on CAN FD channels |
| Timer System | Generic Timer Module (GTM) + CCU6 + GPT12 - enables synchronized PWM generation, capture, and safety-redundant timing for inverter control |
| Package | TQFP-100, -40°C to +125°C - standard automotive-grade package with validated thermal performance for under-hood deployment |
Pinout & Package
TQFP-100 (14 mm × 14 mm, 0.5 mm pitch), thermally enhanced for automotive under-hood operation; RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Single 3.3 V supply input with dedicated analog/digital ground separation for noise immunity |
| XTAL1/XTAL2 | Crystal oscillator inputs | Supports 1–20 MHz external crystal for PLL clock generation with ±100 ppm stability requirement |
| CAN0_TX/CAN0_RX | CAN FD transceiver interface | Differential signaling pins for high-speed CAN FD bus (up to 5 Mbps) with built-in bus-off recovery logic |
| SENT0–SENT3 | SENT sensor interface inputs | Four dedicated digital inputs supporting SAE J2716 SENT protocol for pressure, temperature, and position sensors |
| ADC0_IN0–ADC0_IN23 | Analog input channels | 24-pin multiplexed analog front-end with programmable gain and sampling window control for sensor signal acquisition |
| TRST, TCK, TMS, TDO, TDI | JTAG/OCDS debug interface | Standard ARM-compatible debug port supporting real-time trace, breakpoint, and memory inspection during development |
Key Features
| Feature | Design Value |
|---|---|
| TriCore™ DSP extension | Hardware-accelerated MAC and FFT instructions reduce CPU load for motor control algorithms by ~35% vs. generic integer core |
| GTM timer subsystem | Configurable signal processing unit with 32-bit timers, pattern generators, and event routing - replaces discrete FPGA logic in valve timing applications |
| Safe DMA controller | Memory-mapped DMA with address range checking and ECC-aware transfers - prevents buffer overflow-induced memory corruption in safety-critical tasks |
| MultiCAN+ with CAN FD | Three independent CAN controllers with flexible data-rate mode (up to 5 Mbps payload) - enables high-bandwidth OTA updates and ADAS sensor fusion |
| EEPROM emulation | 64 KB flash area managed by firmware with wear leveling and atomic update - eliminates need for external serial EEPROM in cost-sensitive ECUs |
Applications
| Engine Control Unit (ECU) | Battery Management System (BMS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline direct injection engines. IC Role / Device Role / Timing Role: Primary control MCU executing AUTOSAR-compliant engine management software with deterministic 100 µs interrupt latency. Use Value: GTM-based PWM generation synchronizes injector drivers within ±2 ns; CAN FD enables rapid transmission of misfire logs to gateway. | Use Scenario: Cell voltage monitoring, thermal runaway prediction, and contactor control in 48 V mild-hybrid battery packs. IC Role / Device Role / Timing Role: Safety-certified host processor managing ISO 26262 ASIL-B diagnostics, cell balancing commands, and isolation monitoring. Use Value: 24-channel ADC scans 24 series-connected cells in <1 ms; EEPROM emulation stores lifetime SOC history with 125 k-cycle endurance. |
| Electric Power Steering (EPS) | Advanced Driver Assistance Systems (ADAS) Camera ECU |
Use Scenario: Torque assist calculation, motor phase current regulation, and fault-tolerant torque overlay in rack-mounted EPS modules. IC Role / Device Role / Timing Role: Real-time control MCU running field-oriented control (FOC) with 50 µs loop cycle time and lockstep-ready architecture. Use Value: TriCore™ DSP acceleration reduces FOC computation overhead by 40%; SENT interfaces directly acquire steering angle and torque sensor data. | Use Scenario: Pre-processing of raw image sensor data, object classification trigger, and CAN FD alert messaging in front-facing camera modules. IC Role / Device Role / Timing Role: Vision preprocessor handling ISP pipeline setup, metadata tagging, and low-latency warning output via CAN FD. Use Value: QSPI interface connects to 128 MB LPDDR2 for frame buffering; GTM timestamps sensor triggers with 10 ns resolution for motion compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC213L8F133FABKXUMA1 | Same core, same memory, but TQFP-80 package (20 fewer pins); no CAN FD on CAN1 channel | Limited peripheral routing for compact ECUs with reduced I/O count | Select when board space is constrained and full CAN FD bandwidth is not required across all three CAN buses |
| TC223L8F133FABKXUMA1 | Enhanced GTM with additional time-triggered communication (TTC) support; 1 MB flash option available | Required for time-synchronized multi-ECU coordination in zonal architectures | Choose when implementing AUTOSAR Adaptive or time-triggered Ethernet gateways alongside CAN FD |
Compared with TC213L8F133FABKXUMA1 and TC223L8F133FABKXUMA1, TC214L8F133FABKXUMA1 balances full CAN FD capability, TQFP-100 I/O headroom, and ASIL-B ready safety features - making it optimal for mid-tier powertrain and chassis ECUs where pin count and protocol flexibility outweigh need for TTC or extended flash.
Availability
TC214L8F133FABKXUMA1 is available at Aetrix Electronics and suitable for engine control units, battery management systems, and electric power steering modules requiring stable component supply across automotive production lifecycles.
Supply support for TC214L8F133FABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and automotive qualification expertise since 1999.
This part belongs to the AURIX™ TC21xL(S) product line - engineered specifically for ASIL-B to ASIL-D automotive safety applications, emphasizing functional safety integration, CAN FD connectivity, and scalable TriCore™ compute for powertrain and chassis control.
FAQ
Does TC214L8F133FABKXUMA1 support lockstep operation out of the box?
No. This variant implements a single TriCore™ core without hardware lockstep pairing. Lockstep functionality requires TC2xx devices with dual-core configurations (e.g., TC27x, TC29x) and specific safety library initialization. TC214L supports safety mechanisms like ECC, SMU, and safe DMA, but not CPU-level lockstep.
What is the maximum achievable CAN FD data rate on TC214L8F133FABKXUMA1?
The MultiCAN+ module supports CAN FD with bit rates up to 5 Mbps in the data phase, confirmed in the TC21xL(S) Product Brief and TRICORE™ Peripheral Manual. All three CAN channels support FD mode, with arbitration phase up to 1 Mbps and data phase configurable per channel via BRP and TSEG settings.
Is the 64 KB EEPROM emulation implemented in dedicated hardware or firmware-managed flash?
It is firmware-managed using a portion of the main 512 KB eFlash array, with Infineon's EEPROM emulation driver (EEEmu) handling wear leveling, atomic writes, and error recovery. No separate EEPROM silicon is present; endurance is rated at 125,000 write/erase cycles per logical sector.
Can TC214L8F133FABKXUMA1 operate at 150°C ambient temperature?
No. The standard grade operates from –40°C to +125°C junction temperature. "Hot package" variants (e.g., TC214L8F133FABKXUMA2) with extended Ta = 150°C are available on request per Infineon's Product Brief, but TC214L8F133FABKXUMA1 is qualified only to +125°C.
TC214L8F133FABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 133MHz
- Connectivity:
- CANbus, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 56K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC214L8F133FABKXUMA1 FAQ
1.How can I place an order for TC214L8F133FABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC214L8F133FABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC214L8F133FABKXUMA1 reliable?
The price and inventory of TC214L8F133FABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC214L8F133FABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC214L8F133FABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC214L8F133FABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC214L8F133FABKXUMA1?
TC214L8F133FABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC214L8F133FABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC214L8F133FABKXUMA1?
For technical support, including TC214L8F133FABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC214L8F133FABKXUMA1 requirements.
6.How does Aetrix verify that TC214L8F133FABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC214L8F133FABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC214L8F133FABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC214L8F133FABKXUMA1?
All TC214L8F133FABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC214L8F133FABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC214L8F133FABKXUMA1 part is unused and in its original packaging.
Return procedure for TC214L8F133FABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC214L8F133FABKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
