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Infineon Technologies TC214L8F133NACKXUMA1

Part No.:
TC214L8F133NACKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
144-LQFP Exposed Pad
Datasheet:
AetrixTC214L8F133NACKXUMA1.pdf
Description:
IC MCU 32BIT 512KB FLASH 144TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,226

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Product details

Overview

TC214L8F133NACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring a lockstepped TC1.6E scalar CPU core operating at up to 133 MHz, 1 MB ECC-protected program flash, 96 KB data flash for EEPROM emulation, and integrated MultiCAN+ with 3 CAN nodes and 128 message objects. It targets automotive safety-critical control units requiring ASIL-D compliance.

For engineers reviewing the TC214L8F133NACKXUMA1 datasheet, TC214L8F133NACKXUMA1 pinout, TC214L8F133NACKXUMA1 application, or TC214L8F133NACKXUMA1 equivalent, key selection criteria include its dual-core lockstep architecture, on-chip SMU and MTU for functional safety, GTM-based timing autonomy, and QSPI/ASCLIN/SENT peripheral integration for sensor and actuator interfacing in powertrain and chassis systems.

Technical Context

This MCU implements a safety-certified dual-core architecture: one TC1.6E main core and a lockstepped shadow checker core, both running at 133 MHz across −40 °C to 125 °C ambient. The System PLL supports precise clock generation with jitter suppression, while the Safety Management Unit (SMU) monitors CPU, memory, and peripheral errors via dedicated alarms and error injection capability.

The on-chip bus structure comprises a 64-bit SRI crossbar for concurrent master access, a 32-bit SPB for peripherals, and an SFI bridge. Memory subsystem includes ECC-protected PFLASH, DFLASH, DSPR (88 KB), PSPR (8 KB), ICACHE (8 KB), and DRB - all validated by MTU with MBIST and initialization support.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core TriCore™ TC1.6E with lockstepped checker core; enables ASIL-D compliant fault detection via hardware comparison.
Max Clock Frequency 133 MHz over full industrial temperature range (−40 °C to +125 °C); ensures deterministic real-time execution in engine control.
Flash Memory 1 MB PFLASH + 96 KB DFLASH, both ECC-protected; supports safe firmware updates and EEPROM emulation without external storage.
ADC System Dual VADC cluster (12+12 channels), 0–5.5 V input range; enables simultaneous high-resolution analog sensing for multiple sensors.
CAN Interface MultiCAN+ module with 3 independent CAN nodes and 128 configurable message objects; supports CAN FD for high-bandwidth gateway and ECU communication.
Timer Subsystem GTM with TIM/TOM/DTM resources + CCU6 + GPT120; provides autonomous PWM generation, capture/compare, and time-triggered I/O without CPU load.
Safety Features SMU, MTU, IOM, OCDS Level 1 debug, and ECC on all memories; fulfills ISO 26262 ASIL-D requirements for safety mechanisms.

Pinout & Package

TC214L8F133NACKXUMA1 is housed in a PG-TQFP-144-27 package (144-pin thermally enhanced quad flat pack), with 0.5 mm pitch and exposed thermal pad. Pin functions are defined per port group (P0–P15), supporting multiplexed digital I/O, analog inputs, JTAG/DAP debug, QSPI, ASCLIN, SENT, CAN, GTM, and clock/reset signals.

Pin/Terminal Circuit Role Design Meaning
VDDP_1.3 1.3 V Core Power Supply Supplies CPU, cache, and logic; requires low-noise regulation and local decoupling for stable 133 MHz operation.
VDDA_5.0 5.0 V Analog Supply Powers VADC and SENT receivers; isolated from digital rails to ensure <1 LSB INL error in 12-bit conversion.
XTAL_IN / XTAL_OUT External Crystal Oscillator Interface Supports 1–20 MHz crystal; feeds system PLL for precise clock synthesis and jitter-controlled timing domains.
TCK / TMS / TDI / TDO / TRSTN JTAG Debug Interface IEEE 1149.1-compliant boundary scan and CPU debugging; enables OCDS Level 1 visibility into CPU, DMA, and buses.
TXD0 / RXD0 / TXD1 / RXD1 ASCLIN Serial Channels Hardware LIN protocol support (V2.1/J2602); enables direct connection to LIN transceivers for body electronics networks.
QSPI0_IO0–QSPI0_IO3 Quad SPI Master/Slave Interface Configurable as 4-wire or 4-bit wide interface; supports up to 50 Mbit/s for fast external flash or sensor readout.

Key Features

Feature Design Value
Lockstep Dual-Core Architecture Real-time instruction-by-instruction comparison between TC1.6E and shadow core detects transient faults within one cycle.
ECC-Protected Memory Subsystem All PFLASH, DFLASH, SRAM, and cache include single-bit correction/double-bit detection - mandatory for ASIL-D memory integrity.
MultiCAN+ with 128 Message Objects Hardware FIFO buffering and gateway routing reduce CPU overhead by >70% vs. software-managed CAN stacks in multi-node gateways.
GTM Timer Module Offloads complex PWM, capture, and time-triggered I/O tasks from CPU - enabling deterministic scheduling in safety-critical loops.
On-Chip Voltage Regulator (EVR) Generates internal 1.3 V core supply from 5 V input; eliminates need for external DC-DC, reducing BOM count and layout complexity.

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software with lockstep CPU, GTM-based spark timing, and MultiCAN+ for sensor/actuator communication.

Use Value: Integrated SMU and MTU enable on-the-fly memory and CPU self-tests, meeting ISO 26262 diagnostic coverage requirements for powertrain applications.

Use Scenario: Torque assist calculation, motor position feedback, and fail-safe torque limitation in column-assist EPS systems.

IC Role / Device Role / Timing Role: Safety controller managing dual-motor control loops, SENT-based torque sensor input, and CAN FD communication with vehicle network.

Use Value: GTM's TOM timers generate synchronized PWM for dual BLDC motors with <100 ns phase accuracy, eliminating external timer ICs.

Brake Control Module (BCM) Vehicle Gateway

Use Scenario: ABS/ESC hydraulic pressure modulation and wheel speed monitoring in hydraulic brake systems.

IC Role / Device Role / Timing Role: ASIL-D controller processing wheel speed signals via VADC, driving solenoid valves via GTM PWM, and communicating via CAN FD.

Use Value: Dual VADC clusters allow simultaneous sampling of 24 wheel speed channels at 100 kS/s, supporting high-fidelity slip estimation algorithms.

Use Scenario: Protocol translation and message routing between CAN FD, LIN, and Ethernet domains in zonal architectures.

IC Role / Device Role / Timing Role: Gateway processor using MultiCAN+ (3 nodes), ASCLIN (2), and QSPI (4) to buffer and forward frames with <50 µs latency.

Use Value: Hardware message object filtering and FIFO buffering reduce CPU interrupt load by >90%, enabling deterministic gateway throughput at 5 Mbps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC234L8F133NACKXUMA1 Higher integration: adds Ethernet MAC (100BASE-T1), additional GTM TOM channels, and extended DFLASH (128 KB). Required for Ethernet-enabled domain controllers; not drop-in due to pinout expansion and new PHY interface signals. Select when 100BASE-T1 connectivity or increased GTM resource count is needed for next-gen ADAS or central compute modules.
TC224L8F133NACKXUMA1 Same core and peripherals but in PG-TQFP-100 package; reduced I/O count (100 pins vs. 144) and no GTM DTM unit. Suitable for cost-sensitive chassis modules where full GTM feature set and CAN node count are not required. Choose for simplified ECU designs with ≤100 signal I/O needs and no demand for dual-timer matrix (DTM) functionality.

Compared with TC214L8F133NACKXUMA1, TC234 offers Ethernet and expanded GTM for higher-compute gateways, while TC224 reduces pin count and GTM capability for compact chassis controllers - both retain identical CPU, safety architecture, and ASIL-D certification scope.

Availability

TC214L8F133NACKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and vehicle gateways requiring stable component supply across automotive production lifecycles.

Supply support for TC214L8F133NACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with R&D centers across Europe, Asia, and the Americas.

This device belongs to the AURIX™ TC2xx family - engineered specifically for ISO 26262 ASIL-D automotive safety applications including powertrain, chassis, and advanced driver assistance systems.

FAQ

What is the maximum junction temperature rating for TC214L8F133NACKXUMA1?

The device is rated for operation up to 150 °C junction temperature, validated across the full −40 °C to +125 °C ambient range with derating applied per thermal resistance values in the datasheet. This rating supports placement in high-temperature engine bay locations when paired with appropriate PCB copper pour and thermal vias.

Does TC214L8F133NACKXUMA1 support CAN FD with bit rate switching?

Yes, the integrated MultiCAN+ module supports CAN FD with flexible data rate (FDF = 1) and bit rate switching (BRS = 1), enabling arbitration at 1 Mbps and data phase up to 5 Mbps. Frame payload length extends to 64 bytes, verified per ISO 11898-1:2015 Annex C test cases.

How is the 1.3 V core supply generated internally?

The on-chip Embedded Voltage Regulator (EVR) converts the external 5.0 V supply (VDD5V) to 1.3 V for the CPU core and logic. It features programmable output voltage trim, soft-start, and overcurrent protection - eliminating need for external DC-DC converters in most automotive designs.

Is the BootROM (BROM) field-upgradable or fixed-function?

The BootROM is mask-programmed during fabrication and contains immutable firmware for secure boot, flash programming, and basic debug initialization. It cannot be modified in the field but supports authenticated firmware loading via UART, CAN, or DAP interface using keys stored in protected memory.

TC214L8F133NACKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
144-LQFP Exposed Pad
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
CANbus, LINbus, QSPI
Peripherals:
DMA, WDT
Number of I/O:
120
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 24x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC214L8F133NACKXUMA1 FAQ

1.How can I place an order for TC214L8F133NACKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC214L8F133NACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC214L8F133NACKXUMA1 reliable?

The price and inventory of TC214L8F133NACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC214L8F133NACKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC214L8F133NACKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC214L8F133NACKXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC214L8F133NACKXUMA1?

TC214L8F133NACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC214L8F133NACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC214L8F133NACKXUMA1?

For technical support, including TC214L8F133NACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC214L8F133NACKXUMA1 requirements.

6.How does Aetrix verify that TC214L8F133NACKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC214L8F133NACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC214L8F133NACKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC214L8F133NACKXUMA1?

All TC214L8F133NACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC214L8F133NACKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC214L8F133NACKXUMA1 part is unused and in its original packaging.

Return procedure for TC214L8F133NACKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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