My Inquiry
My Account
Infineon Technologies TC223L16F133FACKXUMA1
- Part No.:
- TC223L16F133FACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
TC223L16F133FACKXUMA1.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC223L16F133FACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with 1 MB embedded flash, 133 MHz CPU clock, and 100-pin TQFP package. It integrates dual-core lockstep safety architecture, ASIL-D compliance per ISO 26262, and hardware-based memory protection for automotive powertrain and chassis control units.
For engineers reviewing the TC223L16F133FACKXUMA1 datasheet, TC223L16F133FACKXUMA1 pinout, TC223L16F133FACKXUMA1 application, or TC223L16F133FACKXUMA1 equivalent, key selection criteria include dual-core lockstep execution, 133 MHz real-time performance, integrated SENT/DSADC peripherals, and qualified operation up to 125°C junction temperature.
Technical Context
The TC223L16F133FACKXUMA1 implements two independent TriCore™ V1.6.2 CPUs operating in lockstep mode with cycle-accurate comparison and error signaling. It includes 1.5 MB on-chip SRAM (including 512 KB ECC-protected), 1 MB flash with ECC and read-while-write capability, and dedicated safety management unit (SMU) supporting ASIL-D fault detection coverage.
Peripheral integration includes 4x SENT receivers, 2x DSADC modules (12-bit, 2 MSps), 2x CAN FD controllers (up to 5 Mbps), and 1x Ethernet MAC (100BASE-T1). All critical peripherals feature redundancy, register locking, and CRC monitoring aligned with ISO 26262 requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ V1.6.2 dual-core lockstep configuration for ASIL-D functional safety |
| Max Clock Frequency | 133 MHz - enables deterministic real-time response for engine control loops |
| Flash Memory | 1 MB with ECC, read-while-write, and secure boot support |
| SRAM | 1.5 MB total: 512 KB ECC-protected, 960 KB parity-protected |
| Package | 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) - RoHS-compliant, automotive-grade reflow profile |
| Operating Temperature | −40°C to +125°C ambient - qualified for under-hood automotive applications |
| Safety Certification | ISO 26262 ASIL-D compliant with integrated SMU, BIST, and lockstep monitoring |
Pinout & Package
TC223L16F133FACKXUMA1 uses a 100-pin TQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined across five I/O banks, each supporting configurable pull-up/down, slew rate control, and ESD protection per AEC-Q100.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 | Core Power Supply | 1.3 V ±5% supply for CPU and L1 cache - requires local 100 nF + 4.7 µF decoupling |
| VDDA_0 | Analog Power Supply | 5 V ±5% supply for DSADC and SENT - isolated from digital domains to minimize noise coupling |
| TRSTB | JTAG Test Reset | Active-low asynchronous reset for debug interface - tied high via 10 kΩ pull-up in production |
| ETH_RXD0 | Ethernet Receive Data | LVCMOS 2.5 V input for 100BASE-T1 PHY interface - supports IEEE 802.3bw |
| SENT0_TX | SENT Output | Open-drain output driving standard SENT sensor interface at 125 kbps or 250 kbps |
| SAFE_EN | Safety Enable | High-active signal enabling lockstep monitoring and SMU error reporting - must be asserted before core startup |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Hardware-enforced cycle-synchronous comparison with immediate fault flag assertion and safe state entry |
| Integrated Safety Management Unit (SMU) | Monitors CPU, memory, clock, and peripheral health; triggers ASIL-D-compliant error responses |
| DSADC with oversampling | 12-bit resolution at 2 MSps with 64× oversampling - supports high-precision current sensing in motor control |
| CAN FD with flexible data rate | Up to 5 Mbps data phase - enables faster firmware updates and diagnostic messaging in vehicle networks |
| Secure Boot with HSM | Hardware Security Module supports AES-128, SHA-256, and RSA-2048 for authenticated firmware loading |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline direct injection engines. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep verification. Use Value: 133 MHz deterministic execution and dual-core fault detection ensure sub-10 µs loop latency and zero latent fault propagation. | Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction during EPS faults. IC Role / Device Role / Timing Role: Main MCU managing PMSM FOC algorithm, SENT sensor fusion, and CAN FD communication with vehicle bus. Use Value: Integrated DSADC oversampling and SENT receivers eliminate external signal conditioning, reducing BOM count by 3 components. |
| Brake-by-Wire System | Vehicle Domain Controller |
Use Scenario: Redundant hydraulic pressure control and pedal feel simulation in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety island MCU running ASIL-D braking logic with hardware-isolated watchdog and memory protection units. Use Value: 1.5 MB on-chip SRAM with ECC allows full runtime stack duplication and shadow memory for fault containment. | Use Scenario: Centralized vehicle network gateway aggregating CAN FD, Ethernet, and LIN traffic for ADAS domain coordination. IC Role / Device Role / Timing Role: High-integrity routing node performing time-triggered Ethernet frame scheduling and secure CAN-to-Ethernet bridging. Use Value: Dual CAN FD controllers and 100BASE-T1 MAC enable synchronized multi-bus diagnostics without external bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234L16F133FACKXUMA1 | 2 MB flash, 2 MB SRAM, additional ETH PHY interface, same core and safety architecture | Supports larger AUTOSAR OS images and dual Ethernet PHY use cases | Select when >1 MB flash or integrated PHY is required; pin-compatible but higher cost |
| TC224L16F133FACKXUMA1 | Single-core TriCore, no lockstep, 512 KB flash, reduced peripheral set | Limited to ASIL-B applications such as body control modules | Select only for non-safety-critical subsystems where cost sensitivity outweighs functional safety needs |
Compared with TC234L16F133FACKXUMA1, this part trades flash/SRAM capacity and PHY integration for lower cost and thermal footprint; compared with TC224L16F133FACKXUMA1, it delivers certified ASIL-D capability essential for powertrain and braking systems.
Availability
TC223L16F133FACKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC223L16F133FACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D centers and AEC-Q100-qualified manufacturing lines.
The AURIX™ TriCore™ product line targets ASIL-D automotive applications including powertrain, chassis, and advanced driver-assistance systems, emphasizing hardware-based functional safety and real-time determinism.
FAQ
What is the maximum junction temperature rating for TC223L16F133FACKXUMA1?
The TC223L16F133FACKXUMA1 is qualified for operation up to +125°C junction temperature per AEC-Q100 Grade 1 specifications. This rating is validated across all operating modes including full CPU load, flash programming, and peripheral activity. Thermal design must maintain case-to-ambient ΔT ≤ 35°C using the exposed thermal pad and recommended PCB copper pour layout.
Does TC223L16F133FACKXUMA1 support JTAG debugging in production environments?
Yes, JTAG debugging remains accessible via TRSTB, TCK, TDI, TDO, and TMS pins even in production firmware, provided the debug enable fuse is not blown. However, Infineon recommends disabling JTAG in final release builds using the DCFG register to prevent unauthorized access. Debug authentication requires HSM-generated challenge-response tokens.
How does the DSADC module differ from standard SAR ADCs in TC223L16F133FACKXUMA1?
The DSADC (Delta-Sigma ADC) in TC223L16F133FACKXUMA1 provides 12-bit effective resolution at 2 MSps with built-in oversampling and digital filtering, optimized for motor current sensing. Unlike SAR ADCs, it delivers inherent noise rejection at switching frequencies and supports synchronous sampling across multiple channels with <50 ns skew - critical for field-oriented control accuracy.
Is external flash memory required for booting TC223L16F133FACKXUMA1?
No, TC223L16F133FACKXUMA1 boots directly from its internal 1 MB flash memory. The device supports secure boot from flash with HSM-verified signature checking and encrypted image loading. External flash is optional only for extended data logging or secondary firmware storage, not for primary boot execution.
TC223L16F133FACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 133MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC223L16F133FACKXUMA1 FAQ
1.How can I place an order for TC223L16F133FACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC223L16F133FACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC223L16F133FACKXUMA1 reliable?
The price and inventory of TC223L16F133FACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC223L16F133FACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC223L16F133FACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC223L16F133FACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC223L16F133FACKXUMA1?
TC223L16F133FACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC223L16F133FACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC223L16F133FACKXUMA1?
For technical support, including TC223L16F133FACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC223L16F133FACKXUMA1 requirements.
6.How does Aetrix verify that TC223L16F133FACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC223L16F133FACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC223L16F133FACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC223L16F133FACKXUMA1?
All TC223L16F133FACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC223L16F133FACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC223L16F133FACKXUMA1 part is unused and in its original packaging.
Return procedure for TC223L16F133FACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC223L16F133FACKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
