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Infineon Technologies TC224L16F133NACKXUMA1
- Part No.:
- TC224L16F133NACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC224L16F133NACKXUMA1.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
TC224L16F133NACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating at 133 MHz, 1 MB program flash, 96 KB data flash for EEPROM emulation, and integrated MultiCAN+ (3 nodes, 128 message objects). It targets automotive safety-critical control units requiring ASIL-D compliance.
For engineers reviewing the TC224L16F133NACKXUMA1 datasheet, TC224L16F133NACKXUMA1 pinout, TC224L16F133NACKXUMA1 application, or TC224L16F133NACKXUMA1 equivalent, key selection criteria include its dual-core lockstep architecture, ECC-protected memories, GTM-based timing autonomy, and CAN FD support in a PG-TQFP-144 package.
Technical Context
This MCU implements a safety-certified dual-core architecture: one TC1.6E scalar CPU and a dedicated checker core executing identical instructions in lockstep, with hardware comparison and error signaling. The system includes an ECC-protected 64-bit SRI crossbar, SMU for alarm management, and MTU for memory initialization and MBIST.
The peripheral set is optimized for real-time automotive control: MultiCAN+ supports concurrent CAN FD frames across three independent nodes; GTM provides autonomous PWM generation, capture, and signal conditioning without CPU intervention; VADC features two independent 12-channel clusters with 0–5.5 V input range and configurable sampling rates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E + lockstepped shadow core for ASIL-D fault detection |
| Max Clock Frequency | 133 MHz across full industrial temperature range (−40 °C to +125 °C) |
| Memory | 1 MB ECC-protected PFLASH, 96 KB DFLASH (EEPROM emulation), 88 KB DSPR + 8 KB PSPR SRAM |
| CAN Interface | MultiCAN+ module with 3 CAN FD nodes, 128 message objects, FIFO buffering, and gateway capability |
| ADC | VADC with 2 independent kernels, 12+12 channels total, 0–5.5 V input range, hardware-triggered conversion |
| Timer System | GTM (TIM/TOM/DTM), CCU6 (capture/compare), GPT120, and STM - enabling complex I/O timing without CPU load |
| Debug & Test | OCDS Level 1 debug support, IEEE 1149.1 JTAG or DAP interface, built-in MTU for memory self-test |
Pinout & Package
TC224L16F133NACKXUMA1 is housed in a PG-TQFP-144-27 package (144-pin thin quad flat pack, 20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per Section 2.3 of the TC224 datasheet, supporting multiple I/O modes including GPIO, CAN, QSPI, ASCLIN, SENT, and ADC inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_3V3 | 3.3 V I/O supply | Power domain for digital I/O banks; requires local decoupling near pins |
| VDDA_5V0 | 5.0 V analog supply | Supplies VADC reference and analog front-end; isolated from digital domains |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Supports 1–20 MHz crystals for precise clock source; internal PLL multiplies to 133 MHz |
| CAN0_TX / CAN0_RX | Channel 0 CAN FD transceiver interface | Differential pair for high-speed CAN FD communication up to 5 Mbit/s |
| QSPI0_CS0 / QSPI0_SCLK / QSPI0_IO0–3 | Quad SPI master interface | Enables direct XIP or fast boot from external flash via 4-line bidirectional data bus |
| ASCLIN0_TX / ASCLIN0_RX | Asynchronous serial LIN-capable channel | Hardware LIN v2.1 compliant; supports baud rates up to 20 kbaud for body electronics communication |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Safety Architecture | Real-time instruction-level comparison between TC1.6E and shadow core enables immediate fault detection and safe state entry |
| ECC-Protected Memory Subsystem | All on-chip flash and SRAM include single-bit correction/double-bit detection, meeting ISO 26262 ASIL-D requirements |
| Autonomous GTM Timing Engine | Offloads CPU for PWM generation, edge detection, and time-triggered I/O sequencing - critical for motor control and powertrain timing |
| MultiCAN+ with Gateway Mode | Enables bridging between CAN FD networks (e.g., powertrain ↔ chassis) using hardware FIFOs and message filtering without software overhead |
| VADC with Dual Independent Clusters | Allows simultaneous sampling of engine sensor signals (e.g., crank/cam position + throttle voltage) with synchronized trigger sources |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software with lockstep CPU, GTM-managed spark timing, and MultiCAN+ coordination with transmission ECU. Use Value: Deterministic 133 MHz execution and hardware-accelerated GTM timers ensure sub-microsecond jitter for ignition events under full load. |
Use Scenario: Torque assist calculation, motor phase control, and fault monitoring in column-assist EPS systems. IC Role / Device Role / Timing Role: Safety controller managing torque demand arbitration, FOC motor control via GTM PWM outputs, and CAN FD communication with vehicle network. Use Value: Integrated VADC with dual clusters enables synchronous sampling of motor current and position sensors, reducing phase error in field-oriented control. |
| Brake-by-Wire Actuator | Vehicle Domain Controller (Chassis) |
|
Use Scenario: Closed-loop hydraulic pressure control and redundancy validation in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-core lockstep MCU performing independent pressure loop calculations and cross-checking results via SMU alarms. Use Value: ECC-protected 1 MB PFLASH stores certified safety firmware; MTU ensures memory integrity during startup and runtime diagnostics. |
Use Scenario: Aggregating and routing sensor data (wheel speed, yaw, lateral acceleration) across CAN FD and Ethernet domains. IC Role / Device Role / Timing Role: Chassis domain gateway using MultiCAN+ for protocol translation and GTM for timestamp synchronization of distributed sensor events. Use Value: Hardware FIFO buffering and message object prioritization enable deterministic latency (<50 µs) for critical braking-related messages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234L16F133NACKXUMA1 | Higher integration: adds Ethernet MAC (100BASE-T1), additional GTM TOM channels, and extended DFLASH (128 KB) | Better suited for domain controllers requiring time-sensitive networking (TSN) and higher I/O density | Select when Ethernet connectivity or expanded GTM resources are required; otherwise, TC224 offers lower cost and footprint |
| S32K344UAT0VLQY | NXP S32K3 series with Arm Cortex-M7 + lockstep M7, 2 MB flash, 512 KB RAM, no GTM but enhanced ADC and HSE security | Stronger cybersecurity focus (HSE-A), better for OTA update and secure boot; weaker real-time I/O offload vs. GTM | Prefer for applications prioritizing ASIL-D security over deterministic I/O timing; not drop-in due to different toolchain and peripheral model |
Compared with TC224L16F133NACKXUMA1, TC234 offers more peripherals and bandwidth for evolving domain architectures, while S32K344 emphasizes security services at the expense of GTM-based hardware timing autonomy - making TC224 optimal for cost-sensitive, timing-critical powertrain modules.
Availability
TC224L16F133NACKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire actuators, and chassis domain controllers requiring stable component supply and long-term automotive lifecycle support.
Supply support for TC224L16F133NACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with R&D centers across Europe, Asia, and the Americas.
This device belongs to the AURIX™ TC2xx family - engineered specifically for ASIL-D automotive safety applications, combining TriCore™ processing, hardware safety mechanisms, and automotive-grade peripheral sets for powertrain and chassis control.
FAQ
What is the maximum ambient temperature rating for TC224L16F133NACKXUMA1?
The device is qualified for operation from −40 °C to +125 °C ambient temperature, verified per AEC-Q100 Grade 1 requirements. This rating applies to all specified electrical parameters, including 133 MHz CPU operation and MultiCAN+ communication, with appropriate PCB thermal design and airflow.
Does TC224L16F133NACKXUMA1 support CAN FD with bit rate switching?
Yes, the integrated MultiCAN+ module supports full CAN FD functionality including bit rate switching (arbitration phase up to 1 Mbit/s, data phase up to 5 Mbit/s), programmable TDC (Transmitter Delay Compensation), and flexible data length up to 64 bytes per frame.
How is flash programming performed during production or field updates?
Programming is supported via JTAG or DAP interface using Infineon's MemTool or iLLD drivers. Field updates use the on-chip bootloader (BROM) with secure signature verification; PFLASH supports erase/write cycles ≥10k, DFLASH ≥100k for EEPROM emulation.
Is external RAM required for typical ASIL-D applications?
No - the device integrates 88 KB DSPR and 8 KB PSPR SRAM, both ECC-protected and accessible at full CPU speed. These are sufficient for certified ASIL-D stacks (e.g., AUTOSAR OS, MCAL, safety monitor), eliminating need for external RAM in most powertrain implementations.
TC224L16F133NACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 133MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b SAR
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC224L16F133NACKXUMA1 FAQ
1.How can I place an order for TC224L16F133NACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC224L16F133NACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC224L16F133NACKXUMA1 reliable?
The price and inventory of TC224L16F133NACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC224L16F133NACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC224L16F133NACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC224L16F133NACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC224L16F133NACKXUMA1?
TC224L16F133NACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC224L16F133NACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC224L16F133NACKXUMA1?
For technical support, including TC224L16F133NACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC224L16F133NACKXUMA1 requirements.
6.How does Aetrix verify that TC224L16F133NACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC224L16F133NACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC224L16F133NACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC224L16F133NACKXUMA1?
All TC224L16F133NACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC224L16F133NACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC224L16F133NACKXUMA1 part is unused and in its original packaging.
Return procedure for TC224L16F133NACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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