Infineon Technologies TC233L32F200FABKXUMA1
- Part No.:
- TC233L32F200FABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
TC233L32F200FABKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:973
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Product details
Overview
TC233L32F200FABKXUMA1 from Infineon is a 32-bit AURIX™ TriCore™ microcontroller with dual-lockstep safety architecture, 200 MHz CPU frequency, 2 MB eFlash with ECC, 192 KB SRAM with ECC, and TQFP-100 package. It integrates 6x CAN (including CAN FD), 2x LIN, 4x QSPI, 24-channel 12-bit ADC, GTM timer, SENT interfaces, and programmable HSM for ASIL-D automotive safety systems.
For engineers reviewing the TC233L32F200FABKXUMA1 datasheet, TC233L32F200FABKXUMA1 pinout, TC233L32F200FABKXUMA1 application, or TC233L32F200FABKXUMA1 equivalent, key selection criteria include lockstep core configuration, CAN FD channel count, flash ECC coverage, GTM timing resolution, and TQFP-100 thermal performance in -40°C to +125°C environments.
Technical Context
The TC233L32F200FABKXUMA1 implements a dual-core TriCore™ architecture with one main core and one lockstep core operating at 200 MHz, featuring clock delay diversity for fault detection. It includes redundant timer subsystems (GTM, CCU6, GPT12), safe DMA, and access permission control to meet ISO 26262 ASIL-D requirements.
Its peripheral set supports high-integrity automotive networking: 6x CAN controllers with data-rate-enhanced CAN FD, 2x FlexRay, 4x QSPI for flash expansion, and 24x 12-bit SAR ADC channels with hardware oversampling. The integrated HSM complies with EVITA Medium specifications and supports AES-128, SHA-256, and RSA-2048 cryptographic operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ dual-lockstep (main + checker) at 200 MHz, enabling real-time fault detection per ISO 26262 ASIL-D. |
| Memory | 2 MB eFlash with ECC protection; 128 KB EEPROM-emulated data flash (125k write cycles); 192 KB SRAM with ECC. |
| Connectivity | 6x CAN (all support CAN FD), 2x LIN, 2x FlexRay, 4x QSPI, and 4x SENT sensor interfaces. |
| Analog Peripherals | 24-channel 12-bit SAR ADC with hardware oversampling and post-processing; GTM for precise timing and PWM generation. |
| Security | Programmable Hardware Security Module (HSM) compliant with EVITA Medium: AES-128, SHA-256, RSA-2048, secure boot. |
| Package & Temp | TQFP-100, lead-free, RoHS-compliant; qualified for -40°C to +125°C ambient operation (hot package option up to +150°C available). |
Pinout & Package
TQFP-100 package with 0.5 mm pitch, 14 × 14 mm body size, exposed thermal pad, and standard JEDEC moisture sensitivity level 3 (MSL3). Designed for reflow soldering and automotive-grade board-level reliability under thermal cycling stress.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Single 3.3 V supply domain with dedicated analog/digital power rails and on-chip voltage monitoring. |
| PORT0–PORT9 | General-purpose I/O banks | Configurable as GPIO, CAN/LIN/FlexRay transceiver pins, ADC inputs, or GTM signal sources with ESD protection >2 kV HBM. |
| XTAL1/XTAL2 | Crystal oscillator input/output | Supports 1–40 MHz external crystal; internal PLL generates 200 MHz system clock with jitter <±50 ps RMS. |
| TRST, TDI, TDO, TCK, TMS | JTAG debug interface | IEEE 1149.1-compliant boundary scan and OCDS (On-Chip Debug Support) for real-time trace and safety verification. |
| BOOT0, BOOT1 | Boot mode selection | Configures boot source (internal flash, QSPI, or CAN bootloader) during reset; supports secure boot validation via HSM. |
Key Features
| Feature | Design Value |
|---|---|
| Diverse lockstep core | Clock-delayed checker core enables deterministic fault detection within ≤1 µs latency for ASIL-D compliance without software overhead. |
| Safe DMA controller | Hardware-enforced memory access permissions and address range checking prevent buffer overruns and unauthorized peripheral access. |
| GTM timer module | Programmable multi-channel timer with sub-nanosecond resolution, supporting motor control PWM, encoder capture, and time-triggered communication. |
| HSM cryptographic engine | Dedicated RISC-based security processor with isolated memory, enabling secure key storage and OTA firmware authentication without CPU intervention. |
| Single 3.3 V supply | Eliminates need for external 1.2 V/1.5 V regulators; reduces BOM cost and PCB area while maintaining full ASIL-D functionality. |
Applications
| Electric Power Steering (EPS) | Brake Control Unit (BCU) |
|---|---|
Use Scenario: Real-time torque assist calculation and motor phase control under dynamic load and temperature variation. IC Role / Device Role / Timing Role: Primary safety controller executing AUTOSAR-compliant MCAL drivers with lockstep core supervision of motor current feedback loops. Use Value: GTM-generated 10 ns-resolution PWM and 24-channel ADC oversampling enable <±0.5° steering angle accuracy at 10 kHz control loop rate. | Use Scenario: Coordinated pressure modulation across four wheel brakes during ABS and ESC interventions. IC Role / Device Role / Timing Role: Dual-core ASIL-D host managing CAN FD communication with ECU network, hydraulic valve actuation timing, and fail-safe state transitions. Use Value: Redundant CCU6 and GTM timers guarantee <100 µs worst-case response to brake pedal input, meeting ISO 26262 ASIL-D timing constraints. |
| Advanced Driver Assistance Systems (ADAS) Radar ECU | Vehicle Gateway Module |
Use Scenario: Processing raw FMCW radar chirp data from MMIC receivers and generating object lists for fusion. IC Role / Device Role / Timing Role: High-performance DSP-capable TriCore™ executing FFT and CFAR algorithms while managing QSPI-connected radar memory and SENT-based temperature sensors. Use Value: 200 MHz core + 192 KB ECC SRAM enables real-time 77 GHz radar frame processing at 25 Hz with <5 ms end-to-end latency. | Use Scenario: Protocol translation and firewall enforcement between CAN FD, FlexRay, and Ethernet domains in zonal architectures. IC Role / Device Role / Timing Role: Safety-certified gateway controller routing diagnostic messages, OTA updates, and vehicle state data with HSM-verified integrity checks. Use Value: 6x CAN FD + 2x FlexRay + HSM enable secure, low-latency (<200 µs) cross-domain message forwarding with cryptographic signature validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234L32F200FABKXUMA1 | TQFP-144 package; adds 2x additional CAN FD channels and 4x more GPIO vs. TC233L. | Required when >6 CAN FD nodes or >100 GPIO needed in same footprint family. | Select for higher peripheral density without changing software architecture or safety case. |
| TC237L32F200FABKXUMA1 | LFBGA-292 package; includes additional GTM slices and enhanced HSM with asymmetric crypto acceleration. | Suitable for radar preprocessing or secure boot-intensive gateways requiring >200 MHz effective throughput. | Choose for space-constrained designs needing maximum compute density and extended HSM capabilities. |
Compared with TC234L and TC237L, the TC233L32F200FABKXUMA1 delivers optimal balance of ASIL-D safety features, CAN FD connectivity, and TQFP-100 manufacturability for mid-tier automotive ECUs-reducing PCB layer count and assembly cost while retaining full AUTOSAR compatibility and toolchain support.
Availability
TC233L32F200FABKXUMA1 is available at Aetrix Electronics and suitable for electric power steering, brake control units, ADAS radar ECUs, and vehicle gateway modules requiring stable component supply across automotive production lifecycles.
Supply support for TC233L32F200FABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and automotive qualification expertise since 1999.
The AURIX™ TC23xL product line targets ASIL-D automotive safety applications including chassis control, powertrain, and ADAS, delivering scalable lockstep MCU platforms with integrated HSM and CAN FD to simplify functional safety certification.
FAQ
What is the maximum junction temperature rating for TC233L32F200FABKXUMA1?
The device is qualified for operation up to +150°C junction temperature. Standard qualification covers -40°C to +125°C ambient; hot-package variants rated for Ta = +150°C are available on request and require specific ordering codes. Thermal derating curves and PCB layout guidelines for thermal pad soldering are provided in the TC23xL Hardware Design Guide Rev. 1.3.
Does TC233L32F200FABKXUMA1 support AUTOSAR OS and MCAL out of the box?
Yes-it is fully supported by Infineon's AURIX Development Studio v7.2+ and AUTOSAR 4.3-compliant MCAL libraries (v3.0.1+), including drivers for CAN FD, ADC, GTM, and HSM. Pre-certified ASIL-B safety packages and ISO 26262 work products for ASIL-D integration are available under NDA via Infineon's SafeTcore program.
How many CAN FD channels can operate simultaneously at 5 Mbit/s?
All six CAN FD controllers support simultaneous 5 Mbit/s data phase operation when configured with appropriate bus termination and transceivers (e.g., TLE9278). Each channel has independent bit timing registers and dedicated message RAM, enabling concurrent high-speed diagnostics, actuator control, and sensor streaming without arbitration delay.
Is external flash required to use the HSM for secure boot?
No-secure boot executes entirely from internal 2 MB eFlash with ECC. The HSM verifies digital signatures of boot images stored in protected flash sectors using public keys provisioned during manufacturing. External flash may be used for application code storage but is not involved in the root-of-trust chain or HSM cryptographic operations.
TC233L32F200FABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC233L32F200FABKXUMA1 FAQ
1.How can I place an order for TC233L32F200FABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC233L32F200FABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC233L32F200FABKXUMA1 reliable?
The price and inventory of TC233L32F200FABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC233L32F200FABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC233L32F200FABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC233L32F200FABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC233L32F200FABKXUMA1?
TC233L32F200FABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC233L32F200FABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC233L32F200FABKXUMA1?
For technical support, including TC233L32F200FABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC233L32F200FABKXUMA1 requirements.
6.How does Aetrix verify that TC233L32F200FABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC233L32F200FABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC233L32F200FABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC233L32F200FABKXUMA1?
All TC233L32F200FABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC233L32F200FABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC233L32F200FABKXUMA1 part is unused and in its original packaging.
Return procedure for TC233L32F200FABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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