My Inquiry
My Account
Infineon Technologies TC233L32F200FACKXUMA1
- Part No.:
- TC233L32F200FACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
TC233L32F200FACKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,896
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC233L32F200FACKXUMA1 from Infineon is a single-core AURIX™ TriCore™ microcontroller (200 MHz) with 2 MB Flash (ECC), 192 KB RAM (ECC), 24-channel 12-bit SAR ADC, 6x CAN FD, 1x FlexRay, and GTM timer module - deployed in ASIL-D automotive safety-critical systems such as airbag controllers and electric power steering.
For engineers reviewing the TC233L32F200FACKXUMA1 datasheet, TC233L32F200FACKXUMA1 pinout, TC233L32F200FACKXUMA1 application, or TC233L32F200FACKXUMA1 equivalent, key selection criteria include ASIL-D compliance, lockstep core architecture, CAN FD interface count, flash ECC coverage, and TQFP-100 thermal rating (−40°C to +125°C).
Technical Context
The device implements a single TriCore™ v1.6E CPU with hardware DSP extensions and floating-point unit, operating at 200 MHz under a single 3.3 V supply. It integrates a Safety Management Unit (SMU), diverse lockstep monitoring with clock delay, and redundant timer modules (GTM, CCU6, GPT12) for ISO 26262 ASIL-D compliance.
Peripherals include six CAN FD controllers (data rate enhanced), two LIN 2.0 interfaces, four QSPI channels, one FlexRay transceiver, SENT sensor interfaces, and a programmable Hardware Security Module (HSM) supporting secure boot and cryptographic acceleration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single TriCore™ v1.6E @ 200 MHz with FPU and DSP instructions - enables deterministic real-time control and signal processing in safety-critical loops. |
| Flash Memory | 2 MB with full ECC protection - ensures integrity of firmware and safety-critical code against bit flips in automotive environments. |
| RAM | 192 KB SRAM with ECC - supports ASIL-D runtime data storage with error detection and correction. |
| ADC | 24-channel 12-bit SAR ADC - provides high-resolution analog sensing for motor current, voltage, and temperature monitoring. |
| CAN FD Interfaces | 6 independent CAN FD nodes - enables high-bandwidth communication with legacy CAN and next-gen ECUs in domain controllers. |
| Temperature Range | −40°C to +125°C ambient - qualified for under-hood and transmission-control applications without derating. |
| Package | PG-TQFP-100 (14 mm × 14 mm, 0.5 mm pitch) - surface-mount compatible with industrial reflow profiles and automotive board reliability standards. |
Pinout & Package
TC233L32F200FACKXUMA1 is housed in a 100-pin PG-TQFP package with exposed thermal pad, rated for −40°C to +125°C operation and compliant with JEDEC MS-026. Pin functions are defined per Infineon's TC233L datasheet revision 1.4 (2022).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP / VDDN | Core power supply pins | 3.3 V ±5% input for CPU, GTM, and peripheral domains - requires local decoupling per Infineon layout guidelines. |
| OSCIN / OSCOUT | External crystal oscillator interface | Supports 1–20 MHz crystal or external clock source for system timing and watchdog synchronization. |
| TRST / TCK / TMS / TDI / TDO | JTAG debug interface | IEEE 1149.1-compliant boundary scan and multicore debugging via dedicated emulation device (ED) support. |
| CAN0_TX / CAN0_RX | CAN FD channel 0 differential I/O | High-speed (up to 5 Mbps) fault-tolerant bus interface with integrated TX/RX drivers and loopback test mode. |
| SENT0 / SENT1 | SENT sensor input channels | Supports SAE J2716-compliant digital sensor data acquisition from pressure, temperature, and position sensors. |
Key Features
| Feature | Design Value |
|---|---|
| Diverse Lockstep Core | Single TriCore™ core paired with monitor core using clock delay - detects transient faults without software overhead, enabling ASIL-D compliance. |
| Generic Timer Module (GTM) | Programmable multi-channel timer subsystem with time-triggered execution - replaces discrete PWM/timer ICs in motor control and EPS systems. |
| Hardware Security Module (HSM) | Programmable cryptographic engine supporting AES-128/256, SHA-256, RSA-2048, and secure boot - meets EVITA Medium requirements. |
| FlexRay Interface | Full-duplex 10 Mbps FlexRay controller with static/dynamic segment support - enables time-triggered communication in chassis and ADAS networks. |
| Wake-up Timer | Low-power autonomous timer with RTC integration - allows wake-from-sleep on precise intervals without CPU intervention, reducing system standby current. |
Applications
| Airbag Control Unit | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time crash detection and pyrotechnic deployment sequencing in passenger vehicles. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D certified algorithms with lockstep core validation and GTM-based sensor sampling. Use Value: Meets FMVSS 208 and UN-R94 requirements via hardware-enforced fault containment and <100 µs interrupt latency. | Use Scenario: Torque assist calculation and motor phase commutation in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Real-time motor control MCU with 24-channel ADC for current sensing and GTM for precise PWM generation. Use Value: Enables <±0.5° torque angle accuracy and <5 ms response time under ISO 26262 ASIL-C decomposition. |
| Vehicle Domain Controller | Industrial PLC Gateway |
Use Scenario: Centralized vehicle network management integrating CAN FD, FlexRay, and LIN for ADAS and infotainment domains. IC Role / Device Role / Timing Role: High-throughput communication hub with 6x CAN FD, 1x FlexRay, and HSM-secured OTA update handling. Use Value: Supports 2+ Mbps aggregate bandwidth and secure firmware updates without ECU reboot. | Use Scenario: Fieldbus-to-Ethernet gateway in industrial automation systems requiring SIL-3 functional safety. IC Role / Device Role / Timing Role: Safety-certified protocol translator with dual-core lockstep execution and redundant I/O access permission checks. Use Value: Achieves IEC 61508 SIL-3 certification with no external safety monitor required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234L32F200FACKXUMA1 | Triple-core TriCore™ (200 MHz each), 2 MB Flash, 256 KB RAM - adds lockstep redundancy across cores. | Required for ASIL-D systems needing dual-lockstep or split-lockstep architectures (e.g., brake-by-wire). | Select when higher computational throughput or inter-core safety partitioning is mandatory. |
| S32K344WAT0VLQY | NXP S32K3 600 MHz Arm Cortex-M7, 4 MB Flash, 1.5 MB RAM, 4x CAN FD - lacks GTM but offers higher integer performance. | Better suited for complex AUTOSAR Adaptive applications with Linux co-hosting; not certified for ASIL-D lockstep. | Choose for non-lockstep ASIL-B/C designs prioritizing software flexibility over hardware fault tolerance. |
Compared with TC233L32F200FACKXUMA1, TC234L32F200FACKXUMA1 delivers higher safety assurance through triple-core lockstep, while S32K344WAT0VLQY trades hardware safety for software ecosystem breadth - making TC233L optimal for cost-sensitive ASIL-D single-core deployments.
Availability
TC233L32F200FACKXUMA1 is available at Aetrix Electronics and suitable for automotive airbag systems, electric power steering modules, and industrial PLC gateways requiring stable component supply, long-term lifecycle commitment, and ASIL-D traceability.
Supply support for TC233L32F200FACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
This part belongs to the AURIX™ TC2xx 1st-generation family, designed specifically for ISO 26262 ASIL-D and IEC 61508 SIL-3 safety-critical automotive and industrial control applications.
FAQ
What is the maximum junction temperature rating for TC233L32F200FACKXUMA1?
The device is qualified for operation up to 150°C junction temperature, with ambient operating range specified from −40°C to +125°C. Thermal design must maintain TJ ≤ 150°C under worst-case power dissipation (max 1.8 W typical), verified using Infineon's thermal resistance values (RθJA = 32 K/W, RθJC = 5.2 K/W) and PCB copper area guidelines.
Does TC233L32F200FACKXUMA1 support AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR 4.3-compliant MCAL drivers (including Can, Lin, Gpt, Adc, Port) and OS configuration tools for TC233L. The device supports both Classic AUTOSAR and partial Adaptive AUTOSAR via SafeTcore safety libraries, with integration validated on EB tresos and Vector DaVinci toolchains.
Is external flash memory required for booting TC233L32F200FACKXUMA1?
No - the device boots directly from its internal 2 MB on-chip flash with ECC protection. Boot modes (ROM, flash, or external SPI) are selected via hardware pins (BOOT0/BOOT1). Internal flash supports secure boot with HSM-verified signature checking and encrypted image loading without external memory dependency.
How is functional safety certification documented for this part?
Infineon provides ISO 26262 ASIL-D ready documentation including FMEDA reports, safety manual (Rev. 2.1), hardware safety assessment, and diagnostic coverage analysis. Certification evidence is delivered with the AURIX™ Safety Package (ASP), covering all safety mechanisms (lockstep, ECC, SMU, watchdogs) and their coverage metrics per ISO 26262-5 Annex D.
TC233L32F200FACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC233L32F200FACKXUMA1 FAQ
1.How can I place an order for TC233L32F200FACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC233L32F200FACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC233L32F200FACKXUMA1 reliable?
The price and inventory of TC233L32F200FACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC233L32F200FACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC233L32F200FACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC233L32F200FACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC233L32F200FACKXUMA1?
TC233L32F200FACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC233L32F200FACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC233L32F200FACKXUMA1?
For technical support, including TC233L32F200FACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC233L32F200FACKXUMA1 requirements.
6.How does Aetrix verify that TC233L32F200FACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC233L32F200FACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC233L32F200FACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC233L32F200FACKXUMA1?
All TC233L32F200FACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC233L32F200FACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC233L32F200FACKXUMA1 part is unused and in its original packaging.
Return procedure for TC233L32F200FACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC233L32F200FACKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
