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Infineon Technologies TC233L32F200FACLXUMA1
- Part No.:
- TC233L32F200FACLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
TC233L32F200FACLXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
TC233L32F200FACLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a single TC1.6E CPU core operating up to 200 MHz, 2 MB program flash (PFLASH), 128 KB data flash (DFLASH) for EEPROM emulation, and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM timer subsystem. It targets automotive ADAS domain controllers requiring ASIL-D compliance support.
For engineers reviewing the TC233L32F200FACLXUMA1 datasheet, TC233L32F200FACLXUMA1 pinout, TC233L32F200FACLXUMA1 application, or TC233L32F200FACLXUMA1 equivalent, key selection criteria include lockstep CPU architecture, ECC-protected memory hierarchy, hardware safety monitors (SMU, MTU, IOM), and real-time communication stack readiness (CAN FD, FlexRay, Ethernet).
Technical Context
The TC233L32F200FACLXUMA1 implements a safety-critical TriCore™ TC1.6E scalar CPU with binary compatibility to TC1.6P, lockstepped shadow core, and on-chip debug support at OCDS Level 1. Its memory subsystem includes 2 MB PFLASH, 128 KB DFLASH, 512 KB EMEM, and ECC protection across all embedded SRAM and NVM.
Real-time peripheral integration includes two MultiCAN+ modules (6 total CAN nodes, 128 message objects), one FlexRay E-Ray module (2 channels, V2.1), IEEE 802.3-compliant Ethernet MAC with MII/RMII PHY interface, and GTM for autonomous I/O timing-enabling deterministic sensor fusion and gateway routing in automotive ECUs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E scalar core with lockstepped shadow core for ASIL-D fault detection |
| Max Clock Frequency | 200 MHz across full industrial temperature range (–40°C to +125°C) |
| Flash Memory | 2 MB PFLASH + 128 KB DFLASH (EEPROM-emulation capable, ECC-protected) |
| RAM | 184 KB DSPR + 8 KB PSPR + 8 KB ICACHE + 512 KB EMEM, all ECC-protected |
| Communication Interfaces | 2 × MultiCAN+ (6 CAN nodes), 1 × FlexRay (2 channels), 1 × Ethernet MAC (MII/RMII), 4 × QSPI, 2 × ASCLIN |
| Safety Features | SMU, MTU (MBIST/ECC initialization), IOM, OCDS Level 1 debug, HSM optional |
| Package | PG-TQFP-100-23 (100-pin thermally enhanced LQFP) |
Pinout & Package
TC233L32F200FACLXUMA1 is housed in a PG-TQFP-100-23 package: 100-pin, 14 mm × 14 mm, 0.5 mm pitch, thermally enhanced LQFP with exposed thermal pad. Pin functions are defined per port group (P0–P15), supporting multiplexed digital I/O, analog inputs (VADC), clock inputs (OSC, PLLREF), JTAG/DAP, and dedicated peripheral pins (CANH/L, ETH_RXD/TXD, FRAY_TX/RX).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0 / ASCLIN0_TX | Asynchronous serial transmit output | Drives LIN/CAN bootloader or diagnostic UART signals; supports up to 50 MBaud |
| P1.2 / CAN0_TX | CAN controller transmit output | Direct connection to external CAN transceiver (e.g., TJA1042); supports CAN FD framing |
| P3.4 / ETH_RXD0 | Ethernet receive data bit 0 | MII-mode input synchronized to ETH_RX_CLK; part of 4-bit RX data bus for 10/100 Mbps |
| P7.10 / FRAY0_TX | FlexRay channel 0 transmit output | Differential signal pair (with FRAY0_TXN) for deterministic time-triggered network communication |
| P12.3 / VADC0_IN0 | Analog input channel 0 | Connects to external sensor (e.g., pressure, temperature); supports 0–5.5 V input range with 12-bit resolution |
| TCK / JTAG_TCK | JTAG test clock input | IEEE 1149.1 boundary-scan clock for production testing and debug access |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Primary TC1.6E core and shadow core execute identical instructions with cycle-accurate comparison for permanent fault detection |
| ECC-Protected Memory Hierarchy | All PFLASH, DFLASH, DSPR, PSPR, EMEM, and BROM include single-bit error correction and double-bit error detection |
| Hardware Safety Monitoring | SMU aggregates alarms from MTU, IOM, and peripheral watchdogs; triggers safe state entry via configurable interrupt or reset |
| GTM Timer Subsystem | Autonomous signal processing unit with time-triggered I/O, PWM generation, position capture, and complex event filtering-reducing CPU load in motor control |
| MultiCAN+ with FIFO Buffering | 128 message objects distributed across 6 CAN nodes; hardware FIFOs enable zero-CPU-load message queuing and gateway forwarding |
Applications
| ADAS Sensor Fusion Hub | Automotive Gateway ECU |
|---|---|
Use Scenario: Aggregating radar, camera, and ultrasonic sensor data in L2+ ADAS systems for object tracking and path prediction. IC Role / Device Role / Timing Role: Central deterministic scheduler executing sensor preprocessing algorithms, GTM-managed time-stamping, and CAN/Ethernet packet routing. Use Value: Lockstep CPU and ECC memory ensure functional safety integrity (ASIL-D), while GTM offloads time-critical I/O tasks from main core. |
Use Scenario: Bridging CAN FD, FlexRay, and Ethernet domains in vehicle central gateway for OTA updates and cross-domain diagnostics. IC Role / Device Role / Timing Role: Real-time protocol translator using MultiCAN+ FIFOs, E-Ray time-triggered scheduling, and ETH MAC for high-bandwidth firmware delivery. Use Value: Hardware-accelerated message filtering and gateway forwarding eliminate software bottlenecks, enabling sub-100 µs inter-bus latency. |
| Electric Powertrain Inverter Control | Brake-by-Wire Actuator Controller |
Use Scenario: Closed-loop motor control in traction inverters with field-oriented control (FOC) and overcurrent protection. IC Role / Device Role / Timing Role: CCU6 and GTM generate precise PWM waveforms; VADC samples current/voltage at ≤1 µs intervals; SMU enforces safe shutdown on fault. Use Value: Deterministic GTM timing and hardware fault response (<5 µs) meet ISO 26262 ASIL-D torque control requirements. |
Use Scenario: Redundant actuation control for electro-hydraulic brake systems requiring dual-channel monitoring and fail-operational behavior. IC Role / Device Role / Timing Role: Dual-lockstep CPU cores run independent control loops; IOM validates I/O pin states; MTU performs periodic memory self-tests. Use Value: On-chip redundancy and hardware safety monitors eliminate need for external safety MCU, reducing BOM cost and PCB area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234L32F200FACLXUMA1 | Same package and pinout; adds second CPU core (dual-core TriCore), 4 MB PFLASH, and additional GTM resources | Required for higher compute workloads (e.g., sensor fusion + AI inference) where dual-core parallelism is mandatory | Select when >200 MHz single-core throughput is insufficient and ASIL-D partitioning across cores is needed |
| S32K344WAT0VLQY | NXP S32K3 series ARM Cortex-M7/M7 dual-core; 4 MB flash, 1.5 MB RAM; no FlexRay, but adds PCIe and more CAN FD channels | Better suited for non-FlexRay-centric architectures (e.g., zonal E/E with high-speed CAN FD backbone) | Choose if FlexRay is not required and ARM ecosystem tooling (S32DS, AUTOSAR MCAL) is preferred |
Compared with TC234L32F200FACLXUMA1, this part offers lower cost and power for single-core ADAS gateways; versus S32K344, it provides native FlexRay and TriCore deterministic timing-but lacks PCIe and ARM software maturity.
Availability
TC233L32F200FACLXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, central gateway ECUs, electric powertrain inverters, and brake-by-wire actuators requiring stable component supply under AEC-Q100 Grade 1 qualification.
Supply support for TC233L32F200FACLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC23x family-designed specifically for automotive safety-critical applications demanding ASIL-D compliance, real-time determinism, and multi-protocol connectivity (CAN FD, FlexRay, Ethernet).
FAQ
What is the maximum junction temperature rating for TC233L32F200FACLXUMA1?
The device is qualified to AEC-Q100 Grade 1, specifying operation from –40°C to +125°C ambient. With its PG-TQFP-100-23 package and thermal pad, the maximum allowable junction temperature is 150°C under continuous operation, validated per JEDEC JESD51-2A with 4-layer board layout and 1-in² copper pour.
Does TC233L32F200FACLXUMA1 support CAN FD physical layer directly?
No-it integrates MultiCAN+ controllers with CAN FD protocol logic (bit rate switching, extended data length), but requires an external CAN FD transceiver (e.g., TJA1044, TCAN1042) for physical layer signaling. The CANH/CANL pins are digital-level outputs compliant with ISO 11898-1.
Is hardware security module (HSM) included in this variant?
No-TC233L32F200FACLXUMA1 does not integrate the optional Hardware Security Module (HSM). HSM is only available on selected TC23x variants denoted by "H" suffix (e.g., TC233Hxx). Secure boot and cryptographic acceleration must be implemented externally or via software libraries on main core.
What debug interfaces are supported, and are they accessible during runtime?
It supports both four-wire JTAG (IEEE 1149.1) and ARM-compatible DAP (Device Access Port) for OCDS Level 1 debug. Both interfaces remain fully operational during normal execution, enabling real-time trace, breakpoint insertion, and memory inspection without halting safety-critical tasks.
TC233L32F200FACLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC233L32F200FACLXUMA1 FAQ
1.How can I place an order for TC233L32F200FACLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC233L32F200FACLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC233L32F200FACLXUMA1 reliable?
The price and inventory of TC233L32F200FACLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC233L32F200FACLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC233L32F200FACLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC233L32F200FACLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC233L32F200FACLXUMA1?
TC233L32F200FACLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC233L32F200FACLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC233L32F200FACLXUMA1?
For technical support, including TC233L32F200FACLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC233L32F200FACLXUMA1 requirements.
6.How does Aetrix verify that TC233L32F200FACLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC233L32F200FACLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC233L32F200FACLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC233L32F200FACLXUMA1?
All TC233L32F200FACLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC233L32F200FACLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC233L32F200FACLXUMA1 part is unused and in its original packaging.
Return procedure for TC233L32F200FACLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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