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Infineon Technologies TC233L32F200NACKXUMA1
- Part No.:
- TC233L32F200NACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
TC233L32F200NACKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,777
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Product details
Overview
TC233L32F200NACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a single TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash, 128 KB data flash (EEPROM-emulated), and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), and FlexRay v2.1. It targets automotive ADAS and safety-critical ECU applications requiring ASIL-D compliance support.
For engineers reviewing the TC233L32F200NACKXUMA1 datasheet, TC233L32F200NACKXUMA1 pinout, TC233L32F200NACKXUMA1 application, or TC233L32F200NACKXUMA1 equivalent, key selection criteria include its lockstepped CPU architecture, ECC-protected memory hierarchy, hardware safety monitoring (SMU/IOM/MTU), and integrated communication peripherals for deterministic real-time vehicle networking.
Technical Context
The TC233L32F200NACKXUMA1 implements a safety-oriented TriCore™ TC1.6E scalar CPU with binary compatibility to TC1.6P, lockstepped shadow core, and on-chip debug support per OCDS Level 1. Its memory subsystem includes 2 MB PFLASH and 128 KB DFLASH with full ECC protection, plus 512 KB EMEM and 32 KB LMU.
Communication is handled by two MultiCAN+ modules (6 total CAN nodes, 128 message objects), one FlexRay v2.1 module (2 channels), IEEE 802.3 Ethernet MAC with MII/RMII, four QSPI interfaces (50 Mbit/s), and two ASCLINs with LIN v2.1 support. The GTM provides autonomous I/O timing and signal conditioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E scalar core with lockstepped shadow core for ASIL-D fault detection |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40 °C to +125 °C) |
| Flash Memory | 2 MB program flash (PFLASH) with ECC, 128 KB data flash (DFLASH) for EEPROM emulation |
| RAM | 184 KB DSPR + 8 KB PSPR + 8 KB ICACHE + 512 KB EMEM + 32 KB LMU, all ECC-protected |
| Communication Peripherals | Dual MultiCAN+ (6 CAN nodes), FlexRay v2.1 (2 channels), IEEE 802.3 Ethernet MAC (MII/RMII), 4× QSPI, 2× ASCLIN |
| Safety Features | SMU, IOM, MTU, OCDS Level 1 debug, JTAG/DAP interface, and hardware memory test capability |
Pinout & Package
This device uses the PG-TQFP-100-23 package (100-pin thermally enhanced thin quad flat pack), with exposed thermal pad and 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_3V3 | 3.3 V I/O supply | Power domain for digital I/O banks, supports 3.3 V tolerant operation |
| VDDA_5V0 | 5.0 V analog supply | Supplies VADC reference and analog input circuitry; enables 0–5.5 V input range |
| ETH_RXD0–ETH_RXD3 | Ethernet receive data lines | MII interface pins; require external 50 Ω termination and controlled impedance routing |
| ERAY_TXD_A / ERAY_RXD_A | FlexRay channel A differential transceiver | Supports 10 Mbps differential signaling; requires external bus coupler and termination |
| ASC0_TX / ASC0_RX | ASCLIN 0 UART/LIN physical layer | Configurable for LIN v2.1 frame handling or asynchronous serial communication |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Enables real-time comparison of primary and shadow core outputs to detect transient faults per ISO 26262 ASIL-D requirements |
| ECC-Protected Memory Hierarchy | Full ECC coverage on all embedded SRAM, Flash, and peripheral register spaces prevents silent data corruption in safety-critical code/data |
| Hardware Safety Monitoring Unit (SMU) | Centralized alarm management for clock failure, temperature violation, voltage monitor timeout, and watchdog expiry |
| Integrated Ethernet MAC with MII/RMII | Offloads TCP/IP stack processing from CPU; supports time-triggered communication via IEEE 1588 timestamping (with external PHY) |
| GTM Timer Subsystem | Provides autonomous PWM generation, capture/compare, sigma-delta modulation, and complex I/O pattern sequencing without CPU intervention |
Applications
| Automotive Radar ECU | Electric Power Steering (EPS) Control |
|---|---|
Use Scenario: Real-time processing of FMCW radar baseband signals and sensor fusion with CAN/FlexRay feedback loops. IC Role / Device Role / Timing Role: Primary controller executing safety-managed signal processing algorithms and coordinating multi-protocol vehicle network communication. Use Value: Lockstep CPU and SMU enable ASIL-D compliance; GTM handles high-frequency PWM for radar chirp generation independent of CPU load. | Use Scenario: Closed-loop motor control with torque feedback, position sensing, and fail-safe torque limitation under dynamic steering loads. IC Role / Device Role / Timing Role: Central safety controller managing motor drive commands, CAN diagnostics, and redundant sensor validation. Use Value: Dual MultiCAN+ supports simultaneous CAN FD diagnostic bus and legacy CAN actuator bus; ECC memory ensures integrity of torque limit tables. |
| Brake-by-Wire System | Vehicle Gateway Module |
Use Scenario: Redundant hydraulic pressure control with cross-channel monitoring and emergency fallback logic during brake actuation. IC Role / Device Role / Timing Role: Safety-certified master controller executing ASIL-D braking algorithms and validating sensor inputs via hardware I/O Monitor (IOM). Use Value: Hardware IOM performs real-time digital I/O pin health checks; MTU enables periodic memory self-test without software overhead. | Use Scenario: Protocol translation between CAN FD, LIN, FlexRay, and Ethernet domains in zonal architecture vehicles. IC Role / Device Role / Timing Role: High-throughput gateway processor managing concurrent packet forwarding, filtering, and time-synchronized message scheduling. Use Value: 64-bit SRI crossbar enables parallel access to multiple peripherals; Ethernet MAC supports VLAN tagging and priority queuing for deterministic latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234L32F200NACKXUMA1 | Same package and pinout; adds second CPU core (dual-core TriCore), 256 KB more DFLASH, and additional QSPI channel | Required for asymmetric multiprocessing or higher bandwidth gateway tasks where dual-core isolation improves ASIL decomposition | Select when needing >200 MHz aggregate throughput or dual-core safety partitioning |
| TC222L32F133NACKXUMA1 | Single-core TC1.6E at 133 MHz; 1 MB PFLASH, 64 KB DFLASH; no Ethernet MAC or FlexRay; TQFP-100 package | Suitable for cost-sensitive ASIL-B/C body control modules without high-speed networking | Select when Ethernet/FlexRay are unnecessary and BOM cost reduction is prioritized over ASIL-D scalability |
Compared with TC234L32F200NACKXUMA1, this part trades dual-core capability and extra flash for lower power and simpler certification scope; compared with TC222L32F133NACKXUMA1, it delivers full ASIL-D networking capability at higher clock rate but with greater thermal and layout complexity.
Availability
TC233L32F200NACKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, electric power steering systems, brake-by-wire controllers, and vehicle gateway modules requiring stable component supply and long-term lifecycle support.
Supply support for TC233L32F200NACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the AURIX™ TC23x family-designed specifically for ASIL-D automotive safety applications including powertrain, chassis, and ADAS, featuring hardware-based functional safety mechanisms and multi-protocol real-time connectivity.
FAQ
What is the maximum ambient temperature rating for continuous operation?
The TC233L32F200NACKXUMA1 is rated for continuous operation from −40 °C to +125 °C ambient temperature, validated per AEC-Q100 Grade 1 qualification. Thermal derating begins above 105 °C case temperature, and junction temperature must remain below 150 °C under all operating conditions.
Does this MCU include an integrated hardware security module (HSM)?
No, the TC233L32F200NACKXUMA1 does not integrate a dedicated Hardware Security Module. HSM functionality is available only on select TC23x variants (e.g., TC237 with HSM option). This part relies on secure boot ROM, memory protection units, and external cryptographic co-processors for secure key management and firmware authentication.
Can the Ethernet MAC operate in RMII mode without an external PHY?
No. The Ethernet MAC in TC233L32F200NACKXUMA1 is a Media Access Controller only-it requires an external PHY chip (e.g., LAN8742A) for physical layer signaling, clock recovery, and MII/RMII interface compliance. The RMII interface uses 50 MHz reference clock, TXD[1:0], RXD[1:0], CRS_DV, and TX_EN signals.
How many CAN message objects are supported, and are they configurable per node?
The device integrates two MultiCAN+ modules, each supporting three CAN nodes (total six), with 128 free assignable message objects shared across all nodes. Each object is individually configurable for transmit/receive direction, ID masking, FIFO assignment, and interrupt generation-enabling flexible mailbox and FIFO-based data handling per node.
TC233L32F200NACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC233L32F200NACKXUMA1 FAQ
1.How can I place an order for TC233L32F200NACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC233L32F200NACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC233L32F200NACKXUMA1 reliable?
The price and inventory of TC233L32F200NACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC233L32F200NACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC233L32F200NACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC233L32F200NACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC233L32F200NACKXUMA1?
TC233L32F200NACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC233L32F200NACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC233L32F200NACKXUMA1?
For technical support, including TC233L32F200NACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC233L32F200NACKXUMA1 requirements.
6.How does Aetrix verify that TC233L32F200NACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC233L32F200NACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC233L32F200NACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC233L32F200NACKXUMA1?
All TC233L32F200NACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC233L32F200NACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC233L32F200NACKXUMA1 part is unused and in its original packaging.
Return procedure for TC233L32F200NACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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