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Infineon Technologies TC233LP32F200FABKXUMA1
- Part No.:
- TC233LP32F200FABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
TC233LP32F200FABKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:925
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Product details
Overview
TC233LP32F200FABKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a single TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash (PFLASH), 128 KB data flash (DFLASH) for EEPROM emulation, and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay™ v2.1, and GTM timer subsystem. It targets automotive ADAS domain controllers requiring ASIL-D compliance support.
For engineers reviewing the TC233LP32F200FABKXUMA1 datasheet, TC233LP32F200FABKXUMA1 pinout, TC233LP32F200FABKXUMA1 application, or TC233LP32F200FABKXUMA1 equivalent, key selection criteria include functional safety architecture (lockstep core, SMU, MTU), real-time I/O handling via GTM and SENT, and deterministic communication stack support across CAN, FlexRay, and Ethernet.
Technical Context
The TC233LP32F200FABKXUMA1 implements a safety-critical TriCore™ TC1.6E scalar CPU with lockstepped shadow core, ECC-protected memories (PFLASH, DFLASH, SRAM), and dedicated Safety Management Unit (SMU) for fault detection and response. Its clock system includes System PLL (up to 200 MHz) and ERAY_PLL for FlexRay timing synchronization.
Peripheral integration centers on deterministic real-time I/O: GTM provides autonomous signal conditioning and PWM generation; MultiCAN+ modules support 6 CAN nodes with 128 message objects and hardware FIFOs; VADC features four independent kernels with 0–5.5 V input range and configurable sampling rates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E (binary-compatible with TC1.6P), 200 MHz max operation across full industrial temperature range (−40°C to 125°C) |
| Flash Memory | 2 MB PFLASH + 128 KB DFLASH; both ECC-protected; DFLASH supports wear-leveling and EEPROM emulation |
| RAM | 184 KB DSPR + 8 KB PSPR + 8 KB ICACHE + 32 KB LMU + 512 KB EMEM; all ECC-protected |
| Communication Interfaces | Dual MultiCAN+ (6 CAN nodes), FlexRay™ v2.1 (2 channels), IEEE 802.3 Ethernet MAC (MII/RMII), 4× QSPI, 2× ASCLIN with LIN v2.1 |
| Analog Peripherals | VADC with 4 independent kernels, 0–5.5 V input range, up to 12-bit resolution, configurable conversion timing |
| Safety Features | Lockstep shadow core, SMU, MTU (MBIST/ECC initialization), IOM (I/O monitoring), OCDS Level 1 debug |
| Package | PG-TQFP-100-23 (100-pin thermally enhanced quad flat pack, 0.5 mm pitch) |
Pinout & Package
TC233LP32F200FABKXUMA1 is housed in a PG-TQFP-100-23 package: 100-pin, 14 × 14 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS-compliant, rated for −40°C to +125°C ambient operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_3V3 | 3.3 V I/O supply | Power domain for digital I/O ports, ASCLIN, QSPI, and CAN transceivers; requires local decoupling |
| VDDA_5V0 | 5.0 V analog supply | Supplies VADC reference and analog front-end; separate low-noise path required |
| ETH_TXD0–ETH_TXD3 | Ethernet transmit data | MII interface pins; require controlled impedance routing (50 Ω ±10%) and length matching |
| ERAY_TxD_A / ERAY_RxD_A | FlexRay channel A differential pair | High-speed differential signaling (10 Mbit/s); must be routed as matched-length 100 Ω differential pair |
| TRST, TCK, TMS, TDI, TDO | JTAG debug interface | IEEE 1149.1 compliant; supports boundary scan and CPU/DMA debugging at full speed |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU architecture | Enables ASIL-D compliance by detecting transient faults via redundant core comparison and automatic error signaling to SMU |
| GTM (Generic Timer Module) | Offloads CPU from time-critical tasks-supports motor control PWM, encoder capture, and complex signal filtering without software intervention |
| MultiCAN+ with 128 message objects | Eliminates CPU polling overhead; enables hardware-based CAN message filtering, prioritization, and FIFO buffering for gateway applications |
| HSM (Hardware Security Module) option | Provides AES-128/256, SHA-256, RSA-2048 acceleration and secure key storage-required for UDS secure boot and OTA firmware signing |
| VADC with 4 independent kernels | Allows concurrent sampling of multiple sensor inputs (e.g., engine temp, throttle position, brake pressure) with synchronized start triggers |
Applications
| ADAS Domain Controller | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Central processing unit in L2+ ADAS systems integrating camera, radar, and ultrasonic sensor fusion. IC Role / Device Role / Timing Role: Real-time decision engine executing sensor preprocessing, path planning, and actuator command arbitration with <100 µs latency guarantees. Use Value: GTM and MultiCAN+ enable deterministic I/O scheduling; Ethernet MAC supports high-bandwidth camera streaming; lockstep core satisfies ISO 26262 ASIL-D requirements. |
Use Scenario: Primary controller managing torque assist, steering angle feedback, and fault-tolerant motor drive in column-assist EPS systems. IC Role / Device Role / Timing Role: Safety-critical motor control unit coordinating CAN commands from vehicle network, ADC-sensed motor current/position, and GTM-generated PWM. Use Value: Dual-core lockstep ensures fail-safe torque reduction; VADC's 0–5.5 V range directly interfaces with Hall-effect sensors; SENT channels read torque sensor outputs. |
| Brake-by-Wire Control Unit | Vehicle Gateway Module |
|
Use Scenario: Redundant braking controller receiving pedal position, wheel speed, and stability system inputs to actuate electro-hydraulic modulators. IC Role / Device Role / Timing Role: ASIL-D-certified safety island performing cross-checks between primary and backup computation paths using SMU and MTU. Use Value: ECC-protected memories prevent silent data corruption; ERAY supports deterministic brake command distribution; BROM contains certified boot ROM for secure startup. |
Use Scenario: High-throughput network bridge translating messages between CAN FD, FlexRay, and Ethernet domains in zonal E/E architectures. IC Role / Device Role / Timing Role: Protocol-aware gateway processor routing diagnostic, OTA, and telematics traffic with hardware-accelerated filtering and timestamping. Use Value: 6 CAN message objects per MultiCAN+ module and 2 FlexRay channels allow concurrent multi-bus bridging; Ethernet MAC handles OTA update payloads at 100 Mbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200FABKXUMA1 | Same package and pinout; adds second CPU core (dual-core TC1.6E), 256 KB more DFLASH, and HSM enabled by default | Required for ASIL-B/D multi-core partitioning (e.g., separation of safety and non-safety software) | Select when dual-core isolation or certified HSM functionality is mandatory for security or safety certification |
| S32K144HAT0MLHT | ARM Cortex-M4F core, 112 MHz max, 1 MB flash, no FlexRay or GTM; supports CAN FD but lacks Ethernet MAC | Suitable for mid-tier body control modules-not for ADAS or brake-by-wire where deterministic timing and FlexRay/Ethernet are essential | Choose only for cost-sensitive, non-safety-critical applications lacking FlexRay/Ethernet requirements |
Compared with TC233LP32F200FABKXUMA1, TC234LP32F200FABKXUMA1 offers higher safety partitioning capability via dual cores and built-in HSM, while S32K144HAT0MLHT trades real-time I/O depth and safety infrastructure for lower cost and ARM ecosystem compatibility-neither matches TC233's combined FlexRay/Ethernet/GTM feature set.
Availability
TC233LP32F200FABKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric power steering systems, brake-by-wire units, and zonal vehicle gateways requiring stable component supply and long-term lifecycle assurance.
Supply support for TC233LP32F200FABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
The AURIX™ TC23x product line was designed specifically for ASIL-D automotive safety applications-including ADAS, powertrain, and chassis control-emphasizing lockstep processing, memory protection, and deterministic peripheral timing.
FAQ
What is the maximum operating frequency and temperature range for TC233LP32F200FABKXUMA1?
The TC233LP32F200FABKXUMA1 operates at up to 200 MHz across the full industrial temperature range of −40°C to +125°C. This rating is validated per Infineon's AC-Step qualification and applies to all core logic, flash, and major peripherals including GTM, VADC, and MultiCAN+, provided power supply and thermal design meet datasheet specifications.
Does TC233LP32F200FABKXUMA1 include hardware security features?
TC233LP32F200FABKXUMA1 does not integrate the Hardware Security Module (HSM) as standard-it is available only on TC234/TC237 variants. However, it supports secure boot via BootROM (BROM) with immutable cryptographic verification and provides OCDS Level 1 debug security with password-protected access to CPU and DMA resources.
Which communication protocols does TC233LP32F200FABKXUMA1 support natively?
The device natively supports CAN 2.0B (via two MultiCAN+ modules totaling six nodes), FlexRay™ v2.1 (two channels), IEEE 802.3 Ethernet (MII/RMII), LIN v2.1 (via ASCLIN), SPI (QSPI master/slave), and SENT (four channels). No external transceivers are needed for CAN/FlexRay physical layer-only for Ethernet PHY interfacing.
Is TC233LP32F200FABKXUMA1 pin-compatible with other TC23x family members?
No-TC233LP32F200FABKXUMA1 uses the PG-TQFP-100-23 package, while TC234 and TC237 variants use PG-LFBGA-292-6 or PG-TQFP-144-27 packages. Pin functions differ significantly across packages; migration requires PCB redesign and signal reassignment per the respective port function tables in the datasheet.
TC233LP32F200FABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC233LP32F200FABKXUMA1 FAQ
1.How can I place an order for TC233LP32F200FABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC233LP32F200FABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC233LP32F200FABKXUMA1 reliable?
The price and inventory of TC233LP32F200FABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC233LP32F200FABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC233LP32F200FABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC233LP32F200FABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC233LP32F200FABKXUMA1?
TC233LP32F200FABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC233LP32F200FABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC233LP32F200FABKXUMA1?
For technical support, including TC233LP32F200FABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC233LP32F200FABKXUMA1 requirements.
6.How does Aetrix verify that TC233LP32F200FABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC233LP32F200FABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC233LP32F200FABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC233LP32F200FABKXUMA1?
All TC233LP32F200FABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC233LP32F200FABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC233LP32F200FABKXUMA1 part is unused and in its original packaging.
Return procedure for TC233LP32F200FABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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