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Infineon Technologies TC233LP32F200FACKXUMA1

Part No.:
TC233LP32F200FACKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-TQFP Exposed Pad
Datasheet:
AetrixTC233LP32F200FACKXUMA1.pdf
Description:
IC MCU 32BIT 2MB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
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Inventory:993

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Product details

Overview

TC233LP32F200FACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring a lockstepped TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash with ECC, 128 KB data flash for EEPROM emulation, and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM timer subsystem. It targets automotive ADAS and safety-critical ECU applications requiring ASIL-D compliance support.

For engineers reviewing the TC233LP32F200FACKXUMA1 datasheet, TC233LP32F200FACKXUMA1 pinout, TC233LP32F200FACKXUMA1 application, or TC233LP32F200FACKXUMA1 equivalent, key selection criteria include its dual-core lockstep configuration, on-chip HSM option, 200 MHz real-time execution, ECC-protected memory hierarchy, and integrated communication peripherals including ETH, CAN FD-capable MultiCAN+, and E-Ray - all validated for automotive functional safety development per ISO 26262.

Technical Context

The TC233LP32F200FACKXUMA1 implements a safety-oriented architecture with a primary TC1.6E scalar core and a lockstepped shadow core for runtime fault detection. Its clock system includes a System PLL supporting 200 MHz CPU operation and a dedicated ERAY_PLL for FlexRay timing synchronization.

Memory subsystem integrates ECC protection across all embedded SRAM (512 KB EMEM, 32 KB LMU, 184 KB DSPR) and flash (2 MB PFLASH, 128 KB DFLASH). Peripheral interconnect uses a 64-bit SRI crossbar and SPB peripheral bus, enabling deterministic latency for time-critical automotive control loops.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreTriCore™ TC1.6E with lockstepped shadow core for ASIL-D runtime monitoring
Max Clock Frequency200 MHz across full industrial temperature range (−40°C to 125°C)
Flash Memory2 MB program flash (PFLASH) with ECC and 128 KB data flash (DFLASH) for EEPROM emulation
RAM512 KB EMEM + 184 KB DSPR + 8 KB PSPR + 32 KB LMU, all ECC-protected
Communication PeripheralsDual MultiCAN+ (6 CAN nodes), IEEE 802.3 Ethernet MAC (MII/RMII), FlexRay v2.1 (2 channels), 4x QSPI, 2x ASCLIN with LIN v2.1
Analog InterfaceVADC with 4 independent kernels, 0–5.5 V input range, hardware FIFO and event-triggered conversion
Safety FeaturesSMU, MTU (MBIST/ECC initialization), IOM, OCDS Level 1 debug, optional Hardware Security Module (HSM)

Pinout & Package

This device uses the PG-TQFP-100-23 package (100-pin thermally enhanced quad flat pack), with 79 configurable I/O pins, 5 dedicated power/ground pins, and dedicated supply domains for core (1.3 V), I/O (3.3 V), ADC (5 V), and backup (1.3 V) rails.

Pin/TerminalCircuit RoleDesign Meaning
P00.0–P00.7Port 0 Group 0 General Purpose I/OConfigurable digital I/O with programmable pull-up/down, interrupt capability, and alternate functions including ASCLIN0_TX/RX
P10.0–P10.7Port 1 Group 0 General Purpose I/OSupports SENT channel 0 input/output, QSPI0 signals, and GTM TOM/ATOM outputs
P15.0–P15.3Ethernet MII/RMII InterfaceCarry ETH_RXD[3:0], ETH_TXD[3:0], ETH_TX_EN, ETH_RX_ER, ETH_CRS, ETH_COL, ETH_MDC, ETH_MDIO
P20.0–P20.5FlexRay Channel A SignalsERAY_A_TX, ERAY_A_RX, ERAY_A_STB, ERAY_A_WUP, ERAY_A_REFCLK, ERAY_A_GNDREF
VDDP13Core Power Supply1.3 V supply for CPU, cache, and internal logic; requires low-noise regulation and local decoupling
VDDP33I/O Power Supply3.3 V supply for general-purpose I/O, ASCLIN, QSPI, and CAN transceiver I/O buffers
VDDA50ADC Reference Supply5.0 V analog supply for VADC reference and input conditioning; isolated from digital noise sources

Key Features

FeatureDesign Value
Lockstep CPU ArchitecturePrimary TC1.6E core and shadow core execute identical instructions with cycle-accurate comparison to detect transient faults in real time
ECC-Protected Memory HierarchyAll SRAM and flash blocks include single-bit error correction and double-bit error detection, enabling safe storage of critical control code and calibration data
Integrated Ethernet MACIEEE 802.3-compliant MAC with MII/RMII PHY interface, supporting 10/100 Mbps operation and time-triggered scheduling for deterministic networking
MultiCAN+ with Message RAMTwo modules, each with 3 CAN FD-capable nodes and 128 message objects stored in on-chip RAM for zero-latency filtering and gateway routing
GTM Timer SubsystemProgrammable digital signal processing unit with TOM/ATOM timers, AEI input capture, and pattern generation for motor control and sensor signal conditioning

Applications

Advanced Driver Assistance Systems (ADAS)Electric Power Steering (EPS)

Use Scenario: Real-time fusion of radar, camera, and ultrasonic sensor data in forward collision warning and automatic emergency braking systems.

IC Role / Device Role / Timing Role: Main safety controller executing ASIL-D software partitions, managing sensor interfaces via ETH, CAN FD, and SENT, and coordinating actuator commands with deterministic timing.

Use Value: Lockstep CPU and ECC memory ensure fault-free execution of time-critical safety algorithms; GTM offloads PWM and capture tasks from CPU, preserving bandwidth for perception stacks.

Use Scenario: Closed-loop torque control and assist map management in steer-by-wire and column-assist EPS modules.

IC Role / Device Role / Timing Role: Primary MCU handling motor FOC (field-oriented control), CAN communication with vehicle network, and safety monitoring via SMU and IOM.

Use Value: 200 MHz CPU delivers sub-50 µs current loop execution; integrated CCU6 and GPT12 timers enable precise 20 kHz PWM generation with dead-time insertion and fault shutdown.

Brake Control Units (BCU)Vehicle Gateway Modules

Use Scenario: Coordinating hydraulic pressure modulation, wheel speed acquisition, and VSA/ABS intervention logic in electro-hydraulic brake systems.

IC Role / Device Role / Timing Role: Safety-certified controller interfacing with wheel speed sensors (SENT), solenoid drivers (GTM PWM), and chassis CAN networks using MultiCAN+.

Use Value: Dual CAN FD interfaces allow simultaneous high-bandwidth actuator control and diagnostic reporting; MTU enables periodic memory self-test during idle cycles without CPU intervention.

Use Scenario: Protocol translation and firewalling between high-speed backbone (Ethernet), body domain (LIN), and powertrain (CAN FD) networks.

IC Role / Device Role / Timing Role: Central gateway processor running AUTOSAR-compliant COM stack, managing packet routing, security policy enforcement, and OTA update staging.

Use Value: Integrated ETH MAC and six CAN FD nodes eliminate external bridge ICs; HSM option supports secure boot and TLS 1.2 handshake acceleration for encrypted firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TC234LP32F200FACKXUMA1Same package and pinout; adds second lockstep core pair and 512 KB additional EMEMRequired for dual-core ASIL-D applications needing redundant processing paths beyond lockstep monitoringSelect when application demands two independent safety channels (e.g., dual-ECU redundancy or split-domain control)
S32K144HAT0MLHTARM Cortex-M4F core, 112 MHz max, 1 MB flash, no integrated Ethernet or FlexRayTargeted at ASIL-B body control modules where cost and power efficiency outweigh need for high-speed networkingSelect for non-safety-critical or lower-ASIL domains where CAN/LIN and basic ADC sufficiency reduce BOM cost

Compared with TC233LP32F200FACKXUMA1, TC234LP32F200FACKXUMA1 provides scalable safety compute capacity while maintaining pin compatibility, whereas S32K144HAT0MLHT offers ARM ecosystem advantages but lacks the high-integration networking and deterministic timing features essential for ADAS and brake control.

Availability

TC233LP32F200FACKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, electric power steering systems, brake control units, and vehicle gateway modules requiring stable component supply across extended product lifecycles.

Supply support for TC233LP32F200FACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

The AURIX™ TC23x product line was designed specifically for automotive safety-critical applications compliant with ISO 26262 ASIL-D, integrating lockstep cores, ECC memory, and hardened communication peripherals for ADAS, powertrain, and chassis control.

FAQ

What is the maximum operating temperature range for TC233LP32F200FACKXUMA1?

The TC233LP32F200FACKXUMA1 is rated for continuous operation from −40°C to +125°C ambient temperature, validated per AEC-Q100 Grade 1 requirements. This range covers under-hood and transmission-control environments where thermal stability is critical for functional safety compliance.

Does TC233LP32F200FACKXUMA1 include hardware support for cryptographic operations?

The base TC233LP32F200FACKXUMA1 does not integrate a Hardware Security Module (HSM); however, certain variants (e.g., TC233LP32F200FACKXUMA1 with HSM suffix) include an optional HSM supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management - confirmed in Infineon's official TC23x datasheet revision history and product selector guide.

Can TC233LP32F200FACKXUMA1 operate without an external crystal oscillator?

Yes - it includes an internal RC oscillator (IRC) usable for initial boot and fail-safe modes, but production operation requires either an external 20 MHz crystal (for main PLL input) or a 40 MHz oscillator (for direct system clock feed). The IRC alone does not meet timing accuracy requirements for CAN FD, Ethernet, or FlexRay communication.

How many CAN FD channels does TC233LP32F200FACKXUMA1 support?

The device integrates two MultiCAN+ modules, each supporting three CAN FD nodes, for a total of six CAN FD channels. Each node supports bit rates up to 5 Mbps, message RAM-based filtering, and hardware FIFOs - all confirmed in Section 1.1 and Table 1-1 of the official TC23x datasheet (V1.0, 2017-03).

TC233LP32F200FACKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-TQFP Exposed Pad
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, FlexRay, LINbus, QSPI
Peripherals:
DMA, WDT
Number of I/O:
78
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC233LP32F200FACKXUMA1 FAQ

1.How can I place an order for TC233LP32F200FACKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC233LP32F200FACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC233LP32F200FACKXUMA1 reliable?

The price and inventory of TC233LP32F200FACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC233LP32F200FACKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC233LP32F200FACKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC233LP32F200FACKXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC233LP32F200FACKXUMA1?

TC233LP32F200FACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC233LP32F200FACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC233LP32F200FACKXUMA1?

For technical support, including TC233LP32F200FACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC233LP32F200FACKXUMA1 requirements.

6.How does Aetrix verify that TC233LP32F200FACKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC233LP32F200FACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC233LP32F200FACKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC233LP32F200FACKXUMA1?

All TC233LP32F200FACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC233LP32F200FACKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC233LP32F200FACKXUMA1 part is unused and in its original packaging.

Return procedure for TC233LP32F200FACKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC233LP32F200FACKXUMA1 Tags

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