Infineon Technologies TC233LP32F200NACLXUMA1
- Part No.:
- TC233LP32F200NACLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
TC233LP32F200NACLXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,162
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC233LP32F200NACLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a single TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash, 128 KB data flash (EEPROM-emulated), and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM timer subsystem - designed for automotive ADAS and domain controller applications requiring ASIL-D compliance support.
For engineers reviewing the TC233LP32F200NACLXUMA1 datasheet, TC233LP32F200NACLXUMA1 pinout, TC233LP32F200NACLXUMA1 application, or TC233LP32F200NACLXUMA1 equivalent, key selection criteria include functional safety architecture (lockstep core, SMU, MTU, ECC-protected memories), real-time peripheral integration (ERAY, ETH, QSPI, SENT), and PG-TQFP-100 package compatibility with automotive ECU board layouts.
Technical Context
This MCU implements a safety-critical automotive control architecture: the primary TC1.6E core runs at 200 MHz with lockstepped shadow core for fault detection, while the Safety Management Unit (SMU) monitors system-level alarms and coordinates responses to detected errors. All on-chip SRAM and NVM are protected by ECC, and memory initialization is handled by the Memory Test Unit (MTU).
The peripheral set is optimized for vehicle networking and sensor fusion: two MultiCAN+ modules provide 6 CAN FD-capable channels with 128 message objects; one FlexRay module supports dual-channel deterministic communication; and the Generic Timer Module (GTM) delivers autonomous I/O timing, filtering, and PWM generation without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E scalar core, binary-compatible with TC1.6P, enables reuse of legacy toolchains and software assets. |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40°C to +125°C), enabling deterministic real-time response in safety-critical loops. |
| Flash Memory | 2 MB PFLASH with ECC protection and 128 KB DFLASH supporting EEPROM emulation - sufficient for AUTOSAR OS, BSW, and application code with field-upgrade capability. |
| Networking Peripherals | Dual MultiCAN+ (6 CAN nodes), FlexRay v2.1 (2 channels), IEEE 802.3 Ethernet MAC (MII/RMII) - supports multi-bus gateway and domain controller topologies. |
| Safety Features | Lockstep shadow core, SMU, MTU, ECC on all memories, hardware I/O monitor (IOM), OCDS Level 1 debug - meets ISO 26262 ASIL-D requirements for fault detection and mitigation. |
| Package | PG-TQFP-100-23 (100-pin thermally enhanced thin quad flat pack), 0.5 mm pitch, suitable for automotive PCB assembly with thermal pad grounding. |
Pinout & Package
TC233LP32F200NACLXUMA1 uses the PG-TQFP-100-23 package: 100-pin, 0.5 mm pitch, exposed thermal pad, RoHS-compliant, qualified per AEC-Q100 Grade 1 (−40°C to +125°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_3V3 | 3.3 V I/O supply | Power domain for digital I/O banks, must be decoupled with 100 nF ceramic capacitor near each pin group. |
| VDDA_5V0 | 5.0 V analog supply | Supplies VADC reference and SENT receivers; requires low-noise regulation and separate PCB plane. |
| ETH_RXD0–ETH_RXD3 | Ethernet receive data | MII interface pins; require controlled impedance (50 Ω) routing and length matching within ±500 mils. |
| ERAY_TXD_A / ERAY_RXD_A | FlexRay channel A differential pair | Must be routed as 100 Ω differential pair with <10 ps skew; termination resistors placed at bus end, not MCU side. |
| ASC0_TX / ASC0_RX | LIN/UART serial interface | Supports LIN v2.1 physical layer; ASC0_TX drives LIN bus via external LIN transceiver (e.g., TLE7259-3GE). |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Primary TC1.6E core and shadow core execute identical instructions in parallel; mismatch triggers SMU alarm and safe state entry - foundational for ASIL-D decomposition. |
| MultiCAN+ with FIFO Buffering | Each of two MultiCAN+ modules supports 3 CAN FD nodes and 128 message objects; hardware FIFOs reduce CPU load during burst CAN traffic (e.g., radar fusion). |
| GTM Timer Subsystem | Autonomous signal processing unit with time-triggered I/O, complex PWM generation, and digital filtering - offloads timing-critical tasks from main CPU. |
| Hardware Security Module (HSM) | Optional secure co-processor supporting AES-128/256, SHA-256, RSA-2048, and secure boot - enables secure OTA updates and key management without software stack exposure. |
| VADC with 4 Independent Kernels | Four concurrent ADC clusters with configurable input ranges (0–5.5 V), enabling simultaneous sampling of battery voltage, motor phase currents, and temperature sensors in EV powertrain control. |
Applications
| Radar Domain Controller | Electric Powertrain Gateway |
|---|---|
Use Scenario: Centralized processing unit aggregating raw data from 4D imaging radar sensors via Gigabit Ethernet or high-speed CAN FD. IC Role / Device Role / Timing Role: Real-time data preprocessing, packetization, and routing using ETH MAC and MultiCAN+; GTM handles precise timestamping of radar frame triggers. Use Value: Enables deterministic latency (<5 µs jitter) for time-synchronized sensor fusion, meeting ISO 26262 timing constraints for L2+ ADAS systems. | Use Scenario: Gateway between battery management system (BMS), inverter control unit (ICU), and vehicle central controller in BEV platforms. IC Role / Device Role / Timing Role: Protocol translation (CAN FD ↔ FlexRay ↔ Ethernet); secure firmware update orchestration via HSM-verified OTA pipeline. Use Value: Reduces inter-ECU wiring harness complexity and supports functional safety isolation between high-voltage and low-voltage domains. |
| Brake-by-Wire Control Unit | Steer-by-Wire Actuator Interface |
Use Scenario: Dual-redundant actuator controller receiving commands from central ADAS ECU over FlexRay and CAN FD, driving electro-hydraulic brake modulators. IC Role / Device Role / Timing Role: Lockstep CPU executes safety-critical braking algorithms; SMU monitors execution integrity and initiates fail-safe pressure hold via dedicated SENT outputs. Use Value: Achieves ASIL-D diagnostic coverage (>99%) for brake command validation and hardware-level fault containment. | Use Scenario: Low-latency interface between steering angle sensor (SENT), torque sensor (analog), and electric power steering (EPS) motor driver (PWM via GTM). IC Role / Device Role / Timing Role: GTM generates synchronized 3-phase PWM with dead-time insertion; VADC samples analog torque feedback at 1 MS/s with hardware averaging. Use Value: Eliminates CPU polling overhead, enabling sub-100 µs closed-loop torque control cycle - critical for road feel fidelity and stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200NACLXUMA1 | Same package and core, but adds second lockstep CPU core and extended safety features (e.g., additional SMU monitors, enhanced MTU coverage). | Required for higher ASIL-D decomposition where dual-core redundancy is mandated (e.g., full steer-by-wire). | Select when dual-lockstep core certification evidence is required beyond single-core lockstep. |
| S32K344WAT0MLHT | NXP S32K3 series with Arm Cortex-M7, 320 MHz, 4 MB flash, but lacks native FlexRay and has different safety architecture (no lockstep core, relies on software-based diagnostics). | Better suited for non-FlexRay-centric architectures (e.g., zonal controllers using Ethernet-only backbones). | Choose if Arm ecosystem tooling and higher clock speed outweigh need for FlexRay and hardware lockstep. |
Compared with TC234LP32F200NACLXUMA1, this part offers cost-optimized ASIL-D capability with single lockstep core; versus S32K344, it provides native FlexRay and stronger hardware-enforced safety mechanisms, making it preferable for legacy automotive networks requiring deterministic timing.
Availability
TC233LP32F200NACLXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, brake-by-wire ECUs, electric powertrain gateways, and steer-by-wire actuator interfaces requiring stable component supply under AEC-Q100 Grade 1 qualification.
Supply support for TC233LP32F200NACLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing facilities.
This device belongs to the AURIX™ TC23x family - engineered specifically for automotive safety-critical applications demanding ISO 26262 ASIL-D compliance, deterministic real-time performance, and multi-protocol vehicle networking integration.
FAQ
What is the maximum operating temperature range for TC233LP32F200NACLXUMA1?
The device is qualified per AEC-Q100 Grade 1, supporting continuous operation from −40°C to +125°C ambient temperature. Junction temperature limits are defined in the datasheet Section 3.4 (Operating Conditions), with derating applied above 105°C ambient depending on PCB thermal design and power dissipation.
Does TC233LP32F200NACLXUMA1 include hardware cryptographic acceleration?
No - the base TC233 variant does not integrate a Hardware Security Module (HSM). HSM is available only on select TC23x derivatives (e.g., TC237LPxx variants). Secure boot and key storage must be implemented externally or via software libraries running on the main core with appropriate memory protection.
Can the Ethernet MAC operate in both MII and RMII modes simultaneously?
No - the ETH peripheral supports either MII or RMII mode, selected at reset via configuration pins (ETH_MODE[1:0]). Mode switching requires reset assertion; dynamic runtime reconfiguration is not supported. RMII reduces pin count (6 vs. 18 pins) but limits throughput to 100 Mbps full-duplex.
How many CAN message objects are available in total on this MCU?
The device integrates two MultiCAN+ modules, each supporting 3 CAN nodes and 128 free assignable message objects. Total capacity is 256 message objects, distributed across both modules. Message object allocation is fully programmable via register writes and supports hardware FIFO buffering per node.
TC233LP32F200NACLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC233LP32F200NACLXUMA1 FAQ
1.How can I place an order for TC233LP32F200NACLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC233LP32F200NACLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC233LP32F200NACLXUMA1 reliable?
The price and inventory of TC233LP32F200NACLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC233LP32F200NACLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC233LP32F200NACLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC233LP32F200NACLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC233LP32F200NACLXUMA1?
TC233LP32F200NACLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC233LP32F200NACLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC233LP32F200NACLXUMA1?
For technical support, including TC233LP32F200NACLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC233LP32F200NACLXUMA1 requirements.
6.How does Aetrix verify that TC233LP32F200NACLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC233LP32F200NACLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC233LP32F200NACLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC233LP32F200NACLXUMA1?
All TC233LP32F200NACLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC233LP32F200NACLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC233LP32F200NACLXUMA1 part is unused and in its original packaging.
Return procedure for TC233LP32F200NACLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC233LP32F200NACLXUMA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
