My Inquiry
My Account
Infineon Technologies TC234L32F200FABKXUMA1
- Part No.:
- TC234L32F200FABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC234L32F200FABKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,713
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC234L32F200FABKXUMA1 from Infineon is a 200 MHz TriCore™ automotive microcontroller with dual-lockstep CPU architecture, 2 MB flash (ECC-protected), 192 KB SRAM (ECC-protected), and integrated Hardware Security Module (HSM) compliant with EVITA Medium. It supports ASIL-D safety systems and targets engine control units, battery management systems, and ADAS domain controllers.
For engineers reviewing the TC234L32F200FABKXUMA1 datasheet, TC234L32F200FABKXUMA1 pinout, TC234L32F200FABKXUMA1 application, or TC234L32F200FABKXUMA1 equivalent, key selection criteria include lockstep core timing delay, CAN FD channel count (6x), GTM timer resolution, SENT interface count (4x), and HSM programmability for secure boot and key management.
Technical Context
The device implements a dual-core TriCore™ architecture with one main core and one lockstep core operating at 200 MHz, featuring clock delay diversity to detect transient faults. Its GTM provides hardware-accelerated timing, PWM generation, and signal conditioning independent of CPU load.
It integrates six MultiCAN+ controllers supporting CAN FD up to 5 Mbit/s, four SENT interfaces for high-precision sensor data acquisition, and a programmable HSM supporting AES-128/256, SHA-256, and RSA-2048 for secure firmware updates and runtime attestation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ dual-lockstep @ 200 MHz - enables ASIL-D fault detection via temporal and structural diversity |
| Flash Memory | 2 MB eFlash with ECC - supports safe code storage and over-the-air update rollback with error correction |
| RAM | 192 KB SRAM with ECC - ensures data integrity in real-time control buffers and stack operations |
| ADC | 24× 12-bit SAR ADC - delivers 1.2 µs conversion time for engine position, temperature, and current sensing |
| CAN FD Channels | 6 × CAN FD (up to 5 Mbit/s) - enables high-bandwidth communication between ECU clusters and sensor fusion nodes |
| SENT Interfaces | 4 × SENT - supports direct connection to pressure, throttle, and exhaust gas sensors with 12-bit resolution |
| HSM | Programmable Hardware Security Module - implements EVITA Medium security primitives without CPU overhead |
Pinout & Package
TQFP-144 package with 0.5 mm pitch, thermally enhanced exposed pad, rated for -40 °C to +125 °C ambient operation (hot package option available).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Analog power supply | 3.3 V supply for ADC, SENT, and GTM analog subsystems; requires local 100 nF decoupling |
| VDD | Digital core supply | 3.3 V single-supply input for TriCore™ cores, peripherals, and memory; shared with VDDP in most layouts |
| OSCIN/OSCOUT | Crystal oscillator interface | Supports 1–40 MHz external crystal for PLL reference; internal oscillator not qualified for ASIL-D |
| TSB | Test and debug port | OCDS-compliant trace and debug interface; required for AUTOSAR BSW calibration and safety verification |
| ESR0–ESR7 | Ethernet switch reset outputs | Not applicable - TC234L has no Ethernet switch; these pins are reserved/no-connect on this variant |
| TXD0–RXD0 | CAN FD Channel 0 transceiver I/O | Differential pair for CAN FD physical layer; requires external high-speed CAN transceiver (e.g., TJA1044) |
Key Features
| Feature | Design Value |
|---|---|
| Diverse lockstep core with clock delay | Enables detection of timing faults and transient bit flips without software intervention, reducing ASIL-D diagnostic coverage effort |
| Generic Timer Module (GTM) | Offloads timing-critical tasks (e.g., motor commutation, PWM dead-time insertion) from CPU, improving deterministic response under load |
| Safe DMA controller | Performs memory transfers with address range checking and ECC scrubbing, preventing corrupted buffer access in safety-critical routines |
| Redundant timer modules (GTM + CCU6 + GPT12) | Provides cross-checked timing sources for watchdog supervision and fail-safe shutdown sequencing in powertrain applications |
| Access permission system (APS) | Enforces memory protection unit (MPU) policies across AUTOSAR OS partitions, isolating ASIL-B and ASIL-D software components |
Applications
| Engine Control Unit (ECU) | Battery Management System (BMS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D software partitions with lockstep core validation. Use Value: Dual-lockstep execution and GTM-based spark timing ensure sub-microsecond jitter control during cylinder firing events. | Use Scenario: Cell voltage monitoring, thermal runaway prediction, and isolation fault detection in 400–800 V traction batteries. IC Role / Device Role / Timing Role: Central safety manager interfacing with isolated ADCs and SENT-based temperature sensors via redundant paths. Use Value: 24× 12-bit ADC channels with ECC RAM enable simultaneous sampling of 96+ cell voltages within <50 µs window. |
| ADAS Domain Controller | Electric Power Steering (EPS) |
Use Scenario: Sensor fusion aggregation from radar, camera, and ultrasonic modules for L2+ automated driving functions. IC Role / Device Role / Timing Role: High-integrity gateway and preprocessing node with 6× CAN FD and 4× SENT for time-synchronized sensor ingestion. Use Value: CAN FD bandwidth (5 Mbit/s) supports synchronized timestamping of multi-sensor data streams with <1 µs skew. | Use Scenario: Torque assist calculation, motor phase control, and steering angle feedback in steer-by-wire architectures. IC Role / Device Role / Timing Role: Safety-certified torque path controller with dual-lockstep core and functional safety monitor loop. Use Value: GTM-generated PWM with <10 ns dead-time control prevents shoot-through in 3-phase inverter drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC233L32F200FABKXUMA1 | Same core, frequency, and memory but TQFP-100 package (44 fewer pins); lacks 2× CAN FD channels and 8× ADC inputs | Suitable for compact ECUs with reduced peripheral count (e.g., HVAC control), not for full-domain controllers | Select when board space is constrained and CAN FD count ≤ 4, ADC channels ≤ 16 |
| TC237L32F200FABKXUMA1 | LFBGA-292 package; adds 2× FlexRay, 2× LIN, and 4× QSPI; same core/memory/peripherals but higher I/O density | Required for chassis domain controllers needing FlexRay synchronization or multi-master QSPI flash expansion | Select when FlexRay bus integration or >144 GPIOs are mandatory for system architecture |
Compared with TC233L and TC237L, the TC234L32F200FABKXUMA1 offers optimal balance of CAN FD bandwidth, ADC channel count, and TQFP-144 manufacturability for mid-tier powertrain and ADAS gateways-without FlexRay overhead or TQFP-100 I/O limitation.
Availability
TC234L32F200FABKXUMA1 is available at Aetrix Electronics and suitable for engine control units, battery management systems, and ADAS domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC234L32F200FABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security ICs, with global R&D centers and automotive qualification expertise.
The AURIX™ TC23xL product line delivers scalable ASIL-D capable microcontrollers for powertrain, chassis, and electrification systems, designed to unify safety case development across vehicle domains.
FAQ
What is the maximum ambient temperature rating for TC234L32F200FABKXUMA1?
The standard operating temperature range is –40 °C to +125 °C. A hot-package variant rated for Ta = +150 °C is available on request and documented in Infineon's TC23xL Product Brief revision 7600-EU-EC-P. Thermal derating curves and PCB layout guidelines for high-temp operation are provided in Application Note AN234-01.
Does TC234L32F200FABKXUMA1 support AUTOSAR 4.3 or later?
Yes - the device is certified for AUTOSAR 4.2 and fully compatible with AUTOSAR 4.3 and 4.4 through Infineon's AURIX Development Studio (ADS) v7.2+ and EB tresos toolchain integration. All required MCAL drivers (CAN, ADC, GTM, DIO) are qualified per AUTOSAR SWS 4.3 specifications.
Can the HSM be used for secure boot without external cryptographic co-processors?
Yes - the programmable HSM includes dedicated AES-128/256, SHA-256, and RSA-2048 engines, enabling full secure boot chain verification (ROM bootloader → flash loader → application) without external components. Key provisioning uses JTAG-disabled fuse-based OTP memory.
Is GTM configuration supported in standard AUTOSAR BSW?
No - GTM is accessed via vendor-specific MCAL drivers (e.g., Infineon GTM MCAL v3.0.2). AUTOSAR BSW does not abstract GTM functionality; users must integrate GTM-generated code (via GTM Configuration Tool) into RTE-compliant SW-Cs using custom COM and DCM interfaces.
TC234L32F200FABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC234L32F200FABKXUMA1 FAQ
1.How can I place an order for TC234L32F200FABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC234L32F200FABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC234L32F200FABKXUMA1 reliable?
The price and inventory of TC234L32F200FABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC234L32F200FABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC234L32F200FABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC234L32F200FABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC234L32F200FABKXUMA1?
TC234L32F200FABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC234L32F200FABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC234L32F200FABKXUMA1?
For technical support, including TC234L32F200FABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC234L32F200FABKXUMA1 requirements.
6.How does Aetrix verify that TC234L32F200FABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC234L32F200FABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC234L32F200FABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC234L32F200FABKXUMA1?
All TC234L32F200FABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC234L32F200FABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC234L32F200FABKXUMA1 part is unused and in its original packaging.
Return procedure for TC234L32F200FABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC234L32F200FABKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
