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Infineon Technologies TC234L32F200FACKXUMA1
- Part No.:
- TC234L32F200FACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC234L32F200FACKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,976
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Product details
Overview
TC234L32F200FACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating up to 200 MHz, 2 MB program flash, 128 KB data flash (EEPROM-emulated), and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM for autonomous I/O timing - deployed in automotive ADAS domain controllers.
For engineers reviewing the TC234L32F200FACKXUMA1 datasheet, TC234L32F200FACKXUMA1 pinout, TC234L32F200FACKXUMA1 application, or TC234L32F200FACKXUMA1 equivalent, key selection criteria include ASCLIN/LIN support up to 50 MBaud, QSPI master/slave at 50 Mbit/s, VADC input range (0–5.5 V), ERAY_PLL jitter performance, and SMU-managed safety monitor alarms.
Technical Context
The TC234L32F200FACKXUMA1 implements a dual-core lockstep architecture with primary TC1.6E scalar CPU and shadow core for ISO 26262 ASIL-D compliance; its SRI crossbar enables concurrent 64-bit access between CPU, DMA, and memories including ECC-protected PFLASH/DFLASH and 512 KB EMEM.
Peripherals are partitioned across SPB and dedicated interfaces: ETH supports IEEE 802.3 with MDC/MDIO management, E-Ray uses dedicated ERAY_PLL with <1 ps RMS jitter, and GTM provides hardware-timed SENT, PWM, and capture/compare functions without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore TC1.6E scalar core + lockstepped shadow core, binary-compatible with TC1.6P, enabling ASIL-D fault detection |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40°C to 125°C), sustained via on-chip PLL with spread-spectrum option |
| Flash Memory | 2 MB PFLASH with ECC protection and 128 KB DFLASH supporting EEPROM emulation with >100k write cycles |
| ADC Resolution | VADC cluster with 4 independent kernels, 12-bit resolution, 0–5.5 V input range referenced to ADC supply voltage |
| Ethernet Interface | IEEE 802.3-compliant MAC with MII and RMII PHY interfaces, supporting 10/100 Mbps full-duplex operation |
| FlexRay Support | E-Ray module with 2 channels, compliant with FlexRay v2.1, driven by dedicated ERAY_PLL with <1 ps RMS jitter |
| Safety Features | SMU monitors CPU, memory, and peripheral faults; MTU performs on-the-fly ECC correction and MBIST during startup |
Pinout & Package
TC234L32F200FACKXUMA1 is housed in a PG-TQFP-144-27 package (144-pin thin quad flat pack, 0.5 mm pitch, exposed thermal pad). Pin assignments follow the TC23x-ADAS variant layout defined in Section 2.2 of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_3V3 | 3.3 V I/O power supply | Supplies all digital I/O banks; requires external decoupling per datasheet layout guidelines |
| VDDA_5V0 | 5.0 V analog supply | Feeds VADC reference and analog front-end; isolated from digital domains to minimize noise coupling |
| ETH_TXD0–ETH_TXD3 | Ethernet transmit data lines (MII) | Drive 10/100 Mbps MII signals; require controlled impedance routing (50 Ω ±10%) |
| ERAY_TxD_A / ERAY_RxD_A | FlexRay Channel A differential pair | Connect to external bus driver; internal termination enabled only when configured for passive wake-up mode |
| ASCLIN0_TX / ASCLIN0_RX | LIN physical layer interface | Supports LIN v1.3/v2.0/v2.1/J2602; internal pull-ups configurable; slew rate limited for EMC compliance |
| QSPI0_SCLK / QSPI0_IO0–IO3 | Quad SPI master clock and bidirectional data lines | Enable 50 Mbit/s quad I/O transfers; IO0–IO3 support dual/quad read/write with configurable drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Module (HSM) | Optional embedded HSM supports AES-128/256, SHA-256, RSA-2048, and secure boot key management |
| Memory Test Unit (MTU) | Performs ECC initialization, background error correction, and March C MBIST during reset and runtime |
| Generic Timer Module (GTM) | Offloads CPU for SENT sensor decoding, PWM generation, and time-triggered I/O sequencing with sub-microsecond resolution |
| Dual MultiCAN+ (6 nodes) | Each node supports 128 message objects with FIFO buffering and gateway routing between CAN buses |
| On-chip Debug (OCDS Level 1) | Enables real-time trace of CPU, DMA, and bus transactions via JTAG or DAP interface without halting execution |
Applications
| Radar Signal Processing Unit | Automotive Gateway Controller |
|---|---|
Use Scenario: Real-time processing of FMCW radar echo data in 77 GHz ADAS systems with deterministic latency requirements. IC Role / Device Role / Timing Role: Primary compute engine executing FFT and CFAR algorithms; GTM synchronizes ADC sampling and radar chirp timing. Use Value: Lockstep CPU ensures functional safety compliance while 200 MHz clock and 512 KB EMEM enable sub-100 µs frame processing. | Use Scenario: Aggregating and routing messages between CAN FD, LIN, FlexRay, and Ethernet networks in vehicle central domain architecture. IC Role / Device Role / Timing Role: Central protocol translator with hardware-accelerated CAN-to-Ethernet bridging and time-synchronized E-Ray frame scheduling. Use Value: Dual MultiCAN+ (6 nodes) and E-Ray v2.1 support concurrent high-bandwidth communication without CPU overhead. |
| Electric Powertrain Inverter Control | Advanced Driver Assistance System (ADAS) ECU |
Use Scenario: Closed-loop motor control for traction inverters using field-oriented control (FOC) with fast current loop response. IC Role / Device Role / Timing Role: Real-time controller generating PWM outputs via CCU6 modules; VADC measures phase currents with 12-bit precision and 0–5.5 V range. Use Value: 200 MHz CPU and GTM-based dead-time insertion ensure <1 µs PWM update latency critical for SiC MOSFET switching. | Use Scenario: Sensor fusion platform integrating camera, radar, and ultrasonic inputs for automated emergency braking (AEB) and lane-keeping assist (LKA). IC Role / Device Role / Timing Role: Safety-certified host processor running AUTOSAR OS with SMU-monitored watchdogs and ECC-protected memory partitions. Use Value: ASIL-D ready architecture with BROM-verified boot and HSM-secured OTA update handling meets ISO 26262 Part 6 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234L32F200FACKXUMA2 | Same die, identical electrical specs, but shipped with updated mask set revision (v1.1 vs v1.0) and enhanced ESD robustness on ETH pins | No functional change; qualified for same automotive platforms requiring extended latch-up immunity | Select when new design starts or when legacy board re-spin accommodates minor package marking update |
| TC237L32F200FACKXUMA1 | Adds third CPU core (TC1.6E), 4 MB PFLASH, and second Ethernet MAC; larger PG-LFBGA-292 package | Required for multi-domain ECUs needing concurrent ADAS + infotainment compute; not pin-compatible | Choose only if additional core isolation, memory headroom, or dual ETH are mandatory - otherwise over-specifies cost and footprint |
Compared with TC234L32F200FACKXUMA1, the MA2 variant offers improved robustness without architectural change, while the TC237 variant adds scalability at the cost of package size and power - making the TC234 optimal for cost-sensitive, single-domain ADAS controllers requiring ASIL-D certification.
Availability
TC234L32F200FACKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric powertrain inverters, radar signal processing units, and central gateway modules requiring stable component supply across long production lifecycles.
Supply support for TC234L32F200FACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
The AURIX™ TC23x product line targets ISO 26262-compliant automotive applications - specifically designed for safety-critical ADAS, powertrain, and chassis control systems requiring lockstep processing and hardware-assisted diagnostics.
FAQ
What is the maximum operating temperature range for TC234L32F200FACKXUMA1?
The device is rated for −40°C to +125°C ambient temperature, validated per AEC-Q100 Grade 1 qualification. Junction temperature must remain ≤150°C under worst-case power dissipation; thermal design must account for 144-pin TQFP package's θJA of 32°C/W with recommended PCB copper area and thermal vias.
Does TC234L32F200FACKXUMA1 support CAN FD?
No - it integrates MultiCAN+ modules compliant with CAN 2.0B only (up to 1 Mbps), not CAN FD. The CAN nodes lack ISO 11898-1:2015 FD framing support, variable bit rate, or flexible data-length fields. For CAN FD, consider Infineon's TC3xx family or external transceivers with protocol translation firmware.
Is the Hardware Security Module (HSM) enabled by default on this part number?
No - HSM is optional and disabled in TC234L32F200FACKXUMA1's mask ROM configuration. It can be activated via fuse programming during manufacturing, but standard shipments ship with HSM inactive. Activation requires Infineon's HSM provisioning tools and cryptographic key injection under NDA-controlled process.
Can the Ethernet MAC operate in both MII and RMII modes simultaneously?
No - MII and RMII are mutually exclusive PHY interface modes selected at reset via BOOT pins. Only one interface is active per boot cycle; switching requires hardware reconfiguration and full system reset. RMII reduces pin count (6 vs 18) but limits to 10/100 Mbps half/full-duplex, while MII supports all IEEE 802.3 features including carrier extension.
TC234L32F200FACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC234L32F200FACKXUMA1 FAQ
1.How can I place an order for TC234L32F200FACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC234L32F200FACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC234L32F200FACKXUMA1 reliable?
The price and inventory of TC234L32F200FACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC234L32F200FACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC234L32F200FACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC234L32F200FACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC234L32F200FACKXUMA1?
TC234L32F200FACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC234L32F200FACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC234L32F200FACKXUMA1?
For technical support, including TC234L32F200FACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC234L32F200FACKXUMA1 requirements.
6.How does Aetrix verify that TC234L32F200FACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC234L32F200FACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC234L32F200FACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC234L32F200FACKXUMA1?
All TC234L32F200FACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC234L32F200FACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC234L32F200FACKXUMA1 part is unused and in its original packaging.
Return procedure for TC234L32F200FACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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