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Infineon Technologies TC234L32F200NACKXUMA1
- Part No.:
- TC234L32F200NACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC234L32F200NACKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:999
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Product details
Overview
TC234L32F200NACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating up to 200 MHz, 2 MB program flash, 128 KB data flash (EEPROM-emulated), and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM for autonomous I/O timing - deployed in automotive ADAS domain controllers and safety-critical ECU platforms.
For engineers reviewing the TC234L32F200NACKXUMA1 datasheet, TC234L32F200NACKXUMA1 pinout, TC234L32F200NACKXUMA1 application, or TC234L32F200NACKXUMA1 equivalent, key selection criteria include ASCLIN/LIN support up to 50 MBaud, ECC-protected memory hierarchy, SMU-assisted ISO 26262 ASIL-D compliance readiness, and hardware security module (HSM) availability on select variants.
Technical Context
The TC234L32F200NACKXUMA1 implements a safety-oriented architecture with dual-core lockstep execution, ECC protection across all on-chip SRAM and flash, and dedicated Safety Management Unit (SMU) for real-time fault detection and response. Its bus structure integrates a 64-bit SRI crossbar for concurrent CPU, DMA, and peripheral access, alongside SPB and SFI bridges for deterministic peripheral latency.
It features a multi-protocol communication stack: two MultiCAN+ modules (3 CAN nodes each), one FlexRay E-Ray module (2 channels), IEEE 802.3-compliant Ethernet MAC with MII/RMII PHY interface, four QSPI channels (50 Mbit/s), and two ASCLINs with hardware LIN protocol acceleration (v1.3–v2.1, J2602). The GTM provides offload-capable digital signal processing for PWM, capture, and time-triggered I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E scalar core, binary-compatible with TC1.6P, lockstepped shadow core for ASIL-D functional safety |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40°C to +125°C) |
| Memory | 2 MB PFLASH (ECC-protected), 128 KB DFLASH (EEPROM emulation), 512 KB EMEM, 32 KB LMU, boot ROM |
| Communication | Dual MultiCAN+ (6 CAN nodes total), FlexRay v2.1 (2 channels), IEEE 802.3 Ethernet MAC (MII/RMII), 4× QSPI, 2× ASCLIN with LIN hardware support |
| Analog Interface | VADC with 4 independent kernels, 0–5.5 V input range, configurable resolution and sampling rate |
| Safety Features | SMU, MTU (memory test unit), IOM (I/O monitor), OCDS Level 1 debug, HSM option on selected variants |
| Package | PG-TQFP-144-27 (144-pin thermally enhanced quad flat pack, 0.5 mm pitch) |
Pinout & Package
TC234L32F200NACKXUMA1 is housed in a PG-TQFP-144-27 package: 144-pin, 0.5 mm pitch, thermally enhanced quad flat pack with exposed thermal pad, RoHS-compliant, rated for −40°C to +125°C ambient operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3 | Core Power Supply | 1.3 V supply for CPU core and internal logic; requires low-noise regulation and local decoupling |
| VDDP_3.3 | I/O & Peripheral Power | 3.3 V supply for GPIO, CAN transceivers, ASCLIN, QSPI, and Ethernet PHY interface |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC signals for PHY register configuration and status polling |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Data | Differential transmit/receive pair for FlexRay v2.1 communication; requires 110 Ω termination |
| CAN0_TX / CAN0_RX | CAN Node 0 Transceiver Interface | Direct connection to external CAN transceiver (e.g., TJA1042); supports ISO 11898-2 high-speed CAN |
| ASCLIN0_TX / ASCLIN0_RX | LIN Bus Physical Layer Interface | Single-wire UART-based interface supporting LIN v1.3/v2.0/v2.1/J2602 with hardware baud rate generation |
| QSPI0_SCLK / QSPI0_IO0–3 | Quad SPI Master/Slave Interface | Configurable as master or slave; supports 50 Mbit/s clock, memory-mapped or FIFO-based transfers |
| JTAG_TCK / JTAG_TDO / JTAG_TDI / JTAG_TMS | IEEE 1149.1 Debug Interface | Four-wire boundary-scan interface for programming, debugging, and structural testing |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Execution | Primary TC1.6E core paired with identical shadow core for real-time comparison and fault detection per ISO 26262 ASIL-D requirements |
| ECC-Protected Memory Subsystem | All embedded flash (PFLASH/DFLASH) and SRAM (DSPR/PSPR/EMEM/LMU) feature single-bit error correction and double-bit error detection |
| Hardware Security Module (HSM) | Optional cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure key storage - available on HSM-enabled variants |
| Generic Timer Module (GTM) | Programmable timer subsystem with TOM, ATOM, and SENT units enabling autonomous PWM generation, edge capture, and sensor signal decoding without CPU intervention |
| Safety Management Unit (SMU) | Centralized monitoring of clock, reset, voltage, temperature, and memory errors with configurable alarm routing and safe state activation |
Applications
| Automotive ADAS Domain Controller | Electric Power Steering (EPS) ECU |
|---|---|
Use Scenario: Central processing unit in multi-sensor fusion ADAS systems integrating radar, camera, and ultrasonic inputs. IC Role / Device Role / Timing Role: Main controller executing sensor preprocessing, path planning, and actuator command arbitration with deterministic timing via GTM and Ethernet synchronization. Use Value: Enables sub-100 µs interrupt latency and hardware-accelerated SENT decoding for real-time torque feedback from steering angle sensors. | Use Scenario: Real-time motor control and fault management in steer-by-wire and column-assist EPS systems. IC Role / Device Role / Timing Role: Safety-critical MCU managing dual motor drives, CAN gateway functions, and ASIL-D diagnostics using lockstep core and SMU. Use Value: Supports dual-CAN redundancy (MultiCAN+) and hardware LIN for EPS motor position sensors, meeting ISO 26262 ASIL-D requirements without software overhead. |
| Brake-by-Wire Control Unit | Vehicle Gateway Module |
Use Scenario: Primary controller in electro-hydraulic brake (EHB) systems requiring fail-operational behavior and redundant communication paths. IC Role / Device Role / Timing Role: Dual-core lockstep MCU handling brake pressure control loops, FlexRay-based actuator commands, and Ethernet-based OTA update coordination. Use Value: FlexRay v2.1 channel provides deterministic 10 ms cycle time with guaranteed bandwidth; ECC memory ensures integrity during transient voltage events. | Use Scenario: High-bandwidth vehicle network bridge connecting CAN FD, LIN, FlexRay, and Ethernet domains in zonal architectures. IC Role / Device Role / Timing Role: Protocol translation hub with hardware-accelerated CAN-to-Ethernet bridging, QSPI-connected external flash for firmware staging, and HSM-secured OTA decryption. Use Value: Four QSPI interfaces enable concurrent access to multiple external memories; dual MultiCAN+ supports 6 independent CAN FD buses at 5 Mbit/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200NACKXUMA1 | Same die, identical pinout and peripherals, but with reduced qualification grade (industrial vs automotive AEC-Q100 Grade 1) | Not qualified for under-hood automotive use; limited to cabin or non-safety-critical industrial control | Select only when AEC-Q100 Grade 0/1 qualification and extended temperature operation are not required |
| TC275T64F200NACKXUMA1 | Next-generation AURIX™ TC27x with triple TriCore™ cores, 4 MB PFLASH, enhanced GTM, and upgraded Ethernet (100BASE-T1 support) | Supports higher integration density and advanced driver assistance features requiring multi-core parallelism and time-sensitive networking | Choose for new designs targeting ASIL-D scalability, Ethernet TSN, or >200 MHz real-time performance headroom |
Compared with TC234L32F200NACKXUMA1, the TC234LP32F200NACKXUMA1 lacks automotive qualification and thermal robustness, while the TC275T64F200NACKXUMA1 adds multi-core determinism and 100BASE-T1 Ethernet - making the original optimal for cost-constrained, ASIL-D-compliant ADAS ECUs needing proven field reliability.
Availability
TC234L32F200NACKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric power steering ECUs, brake-by-wire systems, and vehicle gateway modules requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.
Supply support for TC234L32F200NACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, security ICs, and RF solutions, headquartered in Munich with global R&D and manufacturing operations.
The AURIX™ family - including TC234L32F200NACKXUMA1 - was designed specifically for automotive safety-critical applications demanding ASIL-D compliance, real-time determinism, and multi-protocol connectivity in engine control, chassis, and ADAS systems.
FAQ
What is the maximum operating temperature range for TC234L32F200NACKXUMA1?
The TC234L32F200NACKXUMA1 is qualified per AEC-Q100 Grade 1, supporting continuous operation from −40°C to +125°C ambient temperature. This rating applies to the full device - including CPU, flash, peripherals, and I/O - and is validated across voltage and frequency corners per Infineon's automotive qualification protocol.
Does TC234L32F200NACKXUMA1 include an integrated Ethernet PHY?
No, TC234L32F200NACKXUMA1 integrates only the IEEE 802.3-compliant Ethernet MAC layer with MII and RMII interfaces. An external PHY (e.g., LAN8720A or KSZ8081RNA) is required for physical layer signaling, and must be connected via the dedicated ETH_MDC/MDIO, TXD/RXD, and CRS_DV pins.
Is hardware LIN support built into the ASCLIN peripherals?
Yes, both ASCLIN0 and ASCLIN1 include dedicated LIN protocol hardware acceleration supporting LIN specification versions 1.3, 2.0, 2.1, and SAE J2602. This includes automatic sync field detection, checksum calculation (classic/enhanced), and frame timeout handling - eliminating CPU overhead for LIN slave/master node implementation.
Can the TC234L32F200NACKXUMA1 execute code directly from external QSPI flash?
No, the TC234L32F200NACKXUMA1 does not support XIP (execute-in-place) from QSPI flash. Code execution is restricted to internal PFLASH, DSPR, PSPR, or EMEM. QSPI interfaces are used exclusively for data transfer, firmware updates, or offloading non-critical assets - with code copied to internal RAM before execution if required.
TC234L32F200NACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC234L32F200NACKXUMA1 FAQ
1.How can I place an order for TC234L32F200NACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC234L32F200NACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC234L32F200NACKXUMA1 reliable?
The price and inventory of TC234L32F200NACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC234L32F200NACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC234L32F200NACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC234L32F200NACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC234L32F200NACKXUMA1?
TC234L32F200NACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC234L32F200NACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC234L32F200NACKXUMA1?
For technical support, including TC234L32F200NACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC234L32F200NACKXUMA1 requirements.
6.How does Aetrix verify that TC234L32F200NACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC234L32F200NACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC234L32F200NACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC234L32F200NACKXUMA1?
All TC234L32F200NACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC234L32F200NACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC234L32F200NACKXUMA1 part is unused and in its original packaging.
Return procedure for TC234L32F200NACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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