Infineon Technologies TC234LP32F200NACKXUMA1
- Part No.:
- TC234LP32F200NACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC234LP32F200NACKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TC234LP32F200NACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring a lockstepped TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash with ECC, 128 KB data flash for EEPROM emulation, and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM timer subsystem - deployed in automotive ADAS domain controllers and safety-critical ECU designs.
For engineers reviewing the TC234LP32F200NACKXUMA1 datasheet, TC234LP32F200NACKXUMA1 pinout, TC234LP32F200NACKXUMA1 application, or TC234LP32F200NACKXUMA1 equivalent, key selection criteria include ASIL-D compliance support via SMU/MTU/IOM, dual-core lockstep execution, hardware security module (HSM) option, and deterministic real-time peripheral timing for time-triggered networking.
Technical Context
The TC234LP32F200NACKXUMA1 implements a safety-certified architecture with dual TriCore CPUs in lockstep mode, monitored by Safety Management Unit (SMU) and Memory Test Unit (MTU) for on-the-fly ECC error detection/correction across all embedded memories. Its clock system integrates System PLL (up to 200 MHz) and ERAY_PLL for independent FlexRay timing.
Peripheral subsystems are partitioned across dedicated buses: SRI crossbar enables concurrent access between CPU, DMA, and memories; SPB connects peripherals including VADC (4 kernels, 0–5.5 V input range), QSPI (50 Mbit/s master/slave), and ETH (IEEE 802.3 compliant with RMII/MII PHY interface).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore TC1.6E scalar core + lockstepped shadow core, binary-compatible with TC1.6P, enabling ASIL-D fault detection via comparison monitoring. |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40 °C to 125 °C), supported by integrated System PLL with jitter specification ≤ ±50 ppm. |
| Memory | 2 MB ECC-protected PFLASH, 128 KB DFLASH (EEPROM emulation), 512 KB EMEM, 32 KB LMU - all accessible via SRI with deterministic latency. |
| Communication Interfaces | Dual MultiCAN+ (6 CAN nodes, 128 message objects), FlexRay v2.1 (2 channels), IEEE 802.3 ETH (MII/RMII), 4× QSPI (50 Mbit/s), 2× ASCLIN (LIN v2.1/J2602 compliant). |
| Analog Peripherals | VADC with 4 independent kernels, 12-bit resolution, 0–5.5 V input range, hardware-supported oversampling and post-processing filtering. |
| Safety Features | SMU for alarm management, MTU for memory initialization/BIST/ECC, IOM for digital I/O monitoring, OCDS Level 1 debug support with JTAG/DAP. |
Pinout & Package
TC234LP32F200NACKXUMA1 uses PG-TQFP-144-27 package (144-pin thin quad flat pack, 0.5 mm pitch, exposed thermal pad). Pin functions are defined per port group (P0–P15), with multiplexed roles for GPIO, peripheral signals (e.g., CAN_TX0, ETH_RXD0), and power/ground domains (VDDP, VSSP, VDDIO, VSSIO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0 / ASCLIN0_TX | Asynchronous serial transmit output | Drives LIN/UART frames at up to 50 MBaud; supports automatic wake-up and sleep mode entry via hardware state machine. |
| P1.2 / CAN0_TX | CAN transceiver differential output | Direct interface to external CAN PHY; complies with ISO 11898-2; supports bit rates up to 1 Mbps with programmable sample point. |
| P3.0 / ETH_MDC | Ethernet management clock | Provides MDIO bus clock (2.5 MHz max) for PHY register configuration; synchronized to internal APB clock domain. |
| P12.4 / QSPI0_SCLK | Queued SPI serial clock output | Generates master clock up to 50 MHz; supports dual-data-rate (DDR) mode and configurable polarity/phase for flash memory interfacing. |
| VDDP1 / VDDP2 | Core power supply pins (1.3 V) | Supply inputs for CPU, cache, and logic; require low-ESR ceramic decoupling (≤100 nF each) within 5 mm of pin for stable 200 MHz operation. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Primary and shadow TC1.6E cores execute identical instructions; mismatch triggers SMU alarm and safe state transition - required for ISO 26262 ASIL-D compliance. |
| ECC-Protected Memory Subsystem | All PFLASH, DFLASH, SRAM (DSPR/PSPR/EMEM/LMU) include single-bit error correction and double-bit error detection - eliminates silent data corruption in safety-critical storage. |
| Hardware Security Module (HSM) | Optional on-chip cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure boot key verification - isolates sensitive operations from main CPU domain. |
| Generic Timer Module (GTM) | Programmable timer array with 32-bit timers, PWM generation, position capture, and event-triggered ADC sampling - offloads real-time I/O tasks from CPU. |
| FlexRay v2.1 Communication | Two-channel E-Ray controller with static/dynamic segment support, cycle-accurate timestamping, and built-in CRC protection - enables deterministic time-triggered networking in chassis ECUs. |
Applications
| ADAS Domain Controller | Brake-by-Wire ECU |
|---|---|
|
Use Scenario: Central processing unit in L2+ autonomous driving systems aggregating radar, camera, and ultrasonic sensor data via CAN FD and Ethernet. IC Role / Device Role / Timing Role: Real-time scheduler and safety monitor executing AUTOSAR OS with time-triggered task dispatch and SMU-managed fault containment. Use Value: Lockstep CPU and MTU enable continuous memory integrity checking while GTM handles sensor timestamp synchronization to <±50 ns accuracy. |
Use Scenario: Primary controller in electro-hydraulic brake systems requiring dual-redundant actuation paths and fail-operational behavior. IC Role / Device Role / Timing Role: Safety-critical executor of ISO 26262 ASIL-D software partitions, managing CAN communication with master cylinder valves and pedal travel sensors. Use Value: Dual MultiCAN+ modules provide isolated CAN networks for primary and backup control loops, with hardware message filtering reducing CPU load by >40%. |
| Electric Power Steering (EPS) | Vehicle Gateway Module |
|
Use Scenario: Torque assist computation and motor control in column-assist EPS systems with torque sensor feedback and 3-phase inverter drive. IC Role / Device Role / Timing Role: High-precision motion controller using CCU6 and GTM for PWM generation, SENT input decoding, and VADC-based current sensing. Use Value: Integrated VADC with hardware oversampling achieves 14-bit effective resolution for motor phase current measurement without external sigma-delta converters. |
Use Scenario: In-vehicle network bridge routing messages between CAN, LIN, FlexRay, and Ethernet domains in zonal architecture vehicles. IC Role / Device Role / Timing Role: Protocol translator and firewall enforcing message filtering rules across heterogeneous buses with deterministic latency guarantees. Use Value: FlexRay v2.1 and MultiCAN+ coexist on shared SRI bus, enabling simultaneous gateway operation and time-triggered diagnostics without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200NACVXUMA1 | Same die, but PG-VQFN-100 package (100-pin, 0.4 mm pitch); reduced peripheral count (no ETH, only 1 MultiCAN+, no FlexRay). | Suitable for cost-sensitive body control modules where Ethernet/FlexRay are unnecessary and space-constrained layouts favor QFN. | Select when footprint and BOM cost outweigh need for full AURIX TC234 feature set; verify pin compatibility for existing PCB layout reuse. |
| S32K344WAT0VLQY | NXP S32K3 series ARM Cortex-M7 core, 2x lockstep cores, 4 MB Flash, ASIL-D certified, but lacks FlexRay and GTM; uses different safety library ecosystem. | Targeted at next-gen chassis and powertrain applications requiring higher Flash density and ARM toolchain continuity, not legacy TriCore codebases. | Choose for greenfield designs prioritizing ARM ecosystem and future scalability over TriCore-specific IP (e.g., GTM, VADC advanced modes). |
Compared with TC234LP32F200NACKXUMA1, the TC234LP32F200NACVXUMA1 trades Ethernet/FlexRay for smaller QFN packaging and lower cost, while the S32K344 requires full software re-architecture but offers larger memory and ARM-native development flow.
Availability
TC234LP32F200NACKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, brake-by-wire ECUs, and electric power steering systems requiring stable component supply, long-term lifecycle assurance, and ASIL-D qualification documentation.
Supply support for TC234LP32F200NACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer headquartered in Munich, specializing in power semiconductors, automotive MCUs, and security ICs, with global R&D and manufacturing infrastructure.
This part belongs to the AURIX™ TC2xx family - engineered specifically for ISO 26262-compliant automotive safety applications, integrating lockstep cores, hardware safety monitors, and time-triggered communication peripherals to replace discrete safety mechanisms.
FAQ
Does TC234LP32F200NACKXUMA1 include an integrated Ethernet PHY?
No. The device contains only the IEEE 802.3-compliant Ethernet MAC layer with MII and RMII interfaces. An external PHY chip (e.g., LAN8742A) must be used for physical layer signaling, transformer coupling, and ESD protection. The RMII interface operates at 50 MHz with precise setup/hold timing requirements verified in the datasheet Section 3.21.4.
What is the maximum operating temperature for sustained 200 MHz CPU performance?
The TC234LP32F200NACKXUMA1 maintains full 200 MHz operation across its qualified industrial temperature range of −40 °C to +125 °C ambient, as confirmed in Section 3.4 "Operating Conditions" of the 2017-03 datasheet. Thermal derating is not required below 125 °C, provided PCB thermal vias and copper pour meet Infineon's recommended layout guidelines for PG-TQFP-144.
Is the Hardware Security Module (HSM) enabled by default on this variant?
No. The HSM is optional and disabled by default; it must be activated via fuse programming during production programming. The TC234LP32F200NACKXUMA1 datasheet confirms HSM presence but states that its cryptographic engines remain inert until secured boot keys are provisioned and HSM firmware is loaded into dedicated RAM - a process requiring Infineon's OPTIGA™ Trust M integration tools.
How many CAN message objects are supported, and are they shared across nodes?
The device implements two MultiCAN+ modules, each supporting three CAN nodes (total six) and 128 free assignable message objects. These objects are globally addressable and can be allocated dynamically across any node via the Message Object RAM (MOAR) configuration - enabling flexible gateway routing, FIFO buffering, and priority-based transmission without CPU polling.
TC234LP32F200NACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 1.43V, 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC234LP32F200NACKXUMA1 FAQ
1.How can I place an order for TC234LP32F200NACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC234LP32F200NACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC234LP32F200NACKXUMA1 reliable?
The price and inventory of TC234LP32F200NACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC234LP32F200NACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC234LP32F200NACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC234LP32F200NACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC234LP32F200NACKXUMA1?
TC234LP32F200NACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC234LP32F200NACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC234LP32F200NACKXUMA1?
For technical support, including TC234LP32F200NACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC234LP32F200NACKXUMA1 requirements.
6.How does Aetrix verify that TC234LP32F200NACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC234LP32F200NACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC234LP32F200NACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC234LP32F200NACKXUMA1?
All TC234LP32F200NACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC234LP32F200NACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC234LP32F200NACKXUMA1 part is unused and in its original packaging.
Return procedure for TC234LP32F200NACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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