Infineon Technologies TC237L32F200SABKXUMA1

Overview

TC237L32F200SABKXUMA1 from Infineon is a 32-bit AURIX™ TriCore™ microcontroller with dual lockstep CPU architecture, 200 MHz core frequency, 2 MB eFlash with ECC, 192 KB SRAM with ECC, and LFBGA-292 package for ASIL-D automotive safety systems. It integrates 6x CAN (including CAN FD), 2x FlexRay, 4x QSPI, GTM timer, HSM, and 24-channel 12-bit ADC - deployed in electric powertrain control units.

For engineers reviewing the TC237L32F200SABKXUMA1 datasheet, TC237L32F200SABKXUMA1 pinout, TC237L32F200SABKXUMA1 application, or TC237L32F200SABKXUMA1 equivalent, key selection criteria include ASIL-D fault coverage, single 3.3 V supply operation, LFBGA-292 thermal performance up to +125°C, and hardware security module compliance with EVITA Medium.

Technical Context

This MCU implements a dual-core TriCore™ architecture with clock-delayed lockstep execution for real-time fault detection and recovery in safety-critical domains. It includes redundant timer subsystems (GTM, CCU6, GPT12), safe DMA channels, and an access permission system enforcing memory and peripheral isolation per ISO 26262.

The integrated Hardware Security Module supports AES-128/256, SHA-256, RSA-2048, and TRNG - enabling secure boot, key provisioning, and encrypted firmware updates. Its 6x CAN interfaces include CAN FD with data rates up to 5 Mbit/s, supporting high-bandwidth vehicle network communication.

Key Specifications

Pinout & Package

LFBGA-292 package with 0.8 mm pitch, 15 × 15 mm body size, and exposed thermal pad - optimized for thermal dissipation in under-hood automotive environments up to +125°C ambient.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ASIL-D automotive microcontroller applications.

Compared with TC234L32F200SACXUMA1, the TC237L32F200SABKXUMA1 offers superior thermal dissipation via LFBGA-292 and exposed pad - critical for sustained operation in high-power inverters. Versus TC237L32F200SABKXUMA2, it lacks hot-package qualification but delivers identical functionality at lower cost for standard +125°C applications.

Availability

TC237L32F200SABKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain gateways, and onboard charger safety managers requiring stable component supply across automotive production lifecycles.

Supply support for TC237L32F200SABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

The AURIX™ TC23xL product line targets ASIL-D automotive safety applications - designed to unify software architecture across scalable devices while delivering hardware-enforced fault tolerance and cryptographic security.

FAQ

What is the maximum ambient temperature rating for TC237L32F200SABKXUMA1?

The device is qualified for operation from −40 °C to +125 °C ambient temperature. Its LFBGA-292 package with exposed thermal pad supports reliable thermal performance in under-hood environments. Hot-package variants rated to +150 °C ambient are available as separate order codes (e.g., SABKXUMA2), but require explicit qualification confirmation.

Does TC237L32F200SABKXUMA1 support AUTOSAR OS and MCAL drivers?

Yes - it is fully supported by Infineon's AURIX Development Studio and AUTOSAR 4.x-compliant MCAL stack. The device's memory protection unit, safe DMA, and lockstep architecture meet AUTOSAR OS safety requirements for ASIL-D partitions. Pre-certified MCAL drivers for CAN FD, ADC, GTM, and HSM are provided by Infineon and Tier 1 tool vendors.

Is external RAM required for typical ASIL-D applications using this MCU?

No - the integrated 192 KB SRAM with ECC protection is sufficient for most ASIL-D applications, including motor control and brake-by-wire. External RAM is not needed unless application-specific data logging or large buffer requirements exceed internal capacity. The memory map reserves dedicated regions for safety-critical variables with hardware access enforcement.

How does the Hardware Security Module (HSM) interface with the main TriCore™ cores?

The HSM communicates via a dedicated AXI bus with hardware-enforced isolation. It operates autonomously with its own clock domain and memory, responding to secure service requests from the TriCore™ cores through mailbox registers. Cryptographic operations (AES, SHA, RSA) execute independently, returning results only after completion and integrity verification - preventing side-channel leakage or timing attacks.