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Infineon Technologies TC237L32F200SACKXUMA1
- Part No.:
- TC237L32F200SACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC237L32F200SACKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,583
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Product details
Overview
TC237L32F200SACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash, 128 KB data flash (EEPROM-emulated), and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM for autonomous I/O timing - deployed in automotive ADAS domain controllers and safety-critical gateway modules.
For engineers reviewing the TC237L32F200SACKXUMA1 datasheet, TC237L32F200SACKXUMA1 pinout, TC237L32F200SACKXUMA1 application, or TC237L32F200SACKXUMA1 equivalent, key selection criteria include ASCLIN/LIN support up to 50 MBaud, ECC-protected memory hierarchy, SMU-managed functional safety compliance (ISO 26262 ASIL-D capable), and hardware security module (HSM) availability on select variants.
Technical Context
The TC237L32F200SACKXUMA1 implements a dual-core lockstep architecture with primary TC1.6E scalar core and shadow core for fault detection, coupled with Safety Management Unit (SMU) and Memory Test Unit (MTU) supporting ISO 26262 ASIL-D system-level certification. Its bus structure integrates a 64-bit SRI crossbar and 32-bit SPB, enabling concurrent access to PFLASH, DFLASH, EMEM, and peripheral registers.
It features dedicated hardware accelerators including GTM for real-time signal conditioning, E-Ray controller with dual channels, and IEEE 802.3-compliant Ethernet MAC with MII/RMII PHY interface - all with ECC protection on data paths and configuration registers. Clocking relies on System PLL (up to 200 MHz) and ERAY_PLL, with backup oscillator support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore TC1.6E scalar core + lockstepped shadow core, binary-compatible with TC1.6P, enabling ASIL-D fault containment. |
| Max Operating Frequency | 200 MHz across full industrial temperature range (–40°C to +125°C), sustained via on-chip voltage regulators and thermal monitoring. |
| Memory | 2 MB ECC-protected PFLASH, 128 KB ECC-protected DFLASH (for EEPROM emulation), 512 KB EMEM, 32 KB LMU, plus boot ROM. |
| Communication Interfaces | Dual MultiCAN+ (6 CAN nodes, 128 message objects), 4x QSPI (50 Mbit/s), 2x ASCLIN (LIN v2.1/J2602), 1x FlexRay v2.1 (2-channel), 1x IEEE 802.3 Ethernet MAC (MII/RMII). |
| Analog Peripherals | VADC with 4 independent kernels, 0–5.5 V input range, supporting sensor acquisition in engine control and battery management. |
| Safety & Security | Integrated SMU, MTU, IOM, and optional Hardware Security Module (HSM); all memories and buses protected by ECC or parity. |
| Debug & Trace | OCDS Level 1 support, 4/5-wire JTAG (IEEE 1149.1) and DAP interfaces for real-time debugging and trace capture. |
Pinout & Package
TC237L32F200SACKXUMA1 is housed in a PG-LFBGA-292-6 package (292-ball fine-pitch ball grid array, 15 mm × 15 mm, 0.8 mm pitch), optimized for high-density automotive PCB layouts with thermal vias and power integrity design support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | 1.3 V Core Power Supply | Primary supply for CPU, cache, and logic; requires low-noise decoupling per Infineon layout guidelines. |
| VDDP_3P3 | 3.3 V I/O & Peripheral Power | Supplies GPIO, CAN transceivers, ASCLIN, QSPI, and Ethernet PHY interface pins. |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | Provides MDIO serial bus and MDC clock for external PHY configuration and status polling. |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Data | Differential pair for high-reliability time-triggered communication in chassis and ADAS networks. |
| CAN0_TX / CAN0_RX | CAN Node 0 Transceiver Interface | Connects to external CAN transceiver (e.g., TJA1042) for ISO 11898-2 compliant vehicle networking. |
| ASCLIN0_TX / ASCLIN0_RX | LIN Bus Interface | Supports LIN v2.1 physical layer signaling (up to 20 kbit/s) for body electronics and sensor clusters. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Primary TC1.6E core and shadow core continuously compare results; mismatch triggers SMU alarm and safe state entry. |
| ECC-Protected Memory Hierarchy | All PFLASH, DFLASH, SRAM (DSPR/PSPR/EMEM/LMU), and register files include single-bit error correction and double-bit error detection. |
| Hardware Safety Monitoring | SMU monitors clock frequency, reset sources, voltage rails, and watchdog timers; configurable failure response per ISO 26262 FMEDA requirements. |
| GTM Real-Time Signal Processing | Configurable timer units, pattern generators, and digital filters offload CPU for motor control, PWM generation, and encoder signal processing. |
| MultiCAN+ with Gateway Mode | 6 CAN nodes with shared message RAM and FIFO-based routing enable inter-network bridging (e.g., powertrain ↔ chassis CAN domains). |
Applications
| Automotive Domain Controller | Vehicle Gateway Module |
|---|---|
Use Scenario: Centralized processing unit managing camera, radar, and ultrasonic sensor fusion in L2+ ADAS systems. IC Role / Device Role / Timing Role: Primary compute node executing sensor preprocessing, path planning, and actuator command arbitration with deterministic latency. Use Value: GTM and lockstep CPU ensure sub-microsecond timing accuracy and fault resilience required for real-time sensor synchronization and fail-operational behavior. |
Use Scenario: High-speed communication hub connecting CAN FD, LIN, FlexRay, and Ethernet domains in modern E/E architectures. IC Role / Device Role / Timing Role: Protocol translator and bandwidth manager routing messages between powertrain, chassis, and infotainment networks. Use Value: Dual MultiCAN+, E-Ray, and Ethernet MAC enable concurrent multi-protocol handling without software bottlenecks or timing jitter. |
| Electric Powertrain Control | Battery Management System (BMS) Supervisor |
Use Scenario: Inverter control and motor torque management in 400V/800V traction systems with functional safety requirements. IC Role / Device Role / Timing Role: Real-time execution of field-oriented control (FOC) algorithms with precise PWM timing via CCU6 and GTM modules. Use Value: 200 MHz CPU + GTM offload enables <1 µs current-loop update cycles and ASIL-D compliant diagnostics on gate drivers and current sensors. |
Use Scenario: Master controller aggregating cell voltage, temperature, and isolation measurements across 12–24 series-connected modules. IC Role / Device Role / Timing Role: High-precision analog acquisition node interfacing with multiple VADC clusters and isolated SPI daisy chains. Use Value: 4-kernel VADC with 0–5.5 V range supports direct connection to resistive divider networks and thermistor arrays without external signal conditioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234L32F200SACKXUMA1 | Same die, reduced peripheral set: no Ethernet MAC, only one MultiCAN+ (3 nodes), no E-Ray, smaller PFLASH (1 MB). | Suitable for cost-sensitive body control modules where Ethernet/FlexRay are unnecessary. | Select when Ethernet and FlexRay are not required and BOM cost optimization is critical. |
| TC275T64F200NACKXUMA1 | Newer AURIX™ TC2xx generation; higher CPU frequency (300 MHz), larger PFLASH (4 MB), enhanced GTM, but different pinout and power sequencing. | Targets next-gen zonal architectures requiring higher compute density and expanded memory for OTA updates. | Choose for new designs needing scalability beyond TC23x lifecycle; not drop-in compatible. |
Compared with TC234L32F200SACKXUMA1, this part adds Ethernet and FlexRay for domain-centralized ADAS; versus TC275T64F200NACKXUMA1, it offers proven qualification and simpler migration from legacy TC23x platforms, albeit with lower peak performance.
Availability
TC237L32F200SACKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, vehicle gateway modules, electric powertrain control units, and battery management system supervisors requiring stable component supply and long-term industrial lifecycle support.
Supply support for TC237L32F200SACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC23x family - engineered specifically for ISO 26262-compliant automotive applications demanding ASIL-D functional safety, real-time determinism, and multi-protocol connectivity in domain control and gateway roles.
FAQ
What is the maximum ambient temperature rating for TC237L32F200SACKXUMA1?
The device is qualified for operation from –40°C to +125°C ambient temperature, with internal junction temperature limits enforced by on-die thermal sensors and SMU-monitored thermal throttling. This rating aligns with AEC-Q100 Grade 1 requirements for under-hood automotive applications.
Does TC237L32F200SACKXUMA1 include hardware cryptographic acceleration?
No - the base TC237L32F200SACKXUMA1 variant does not integrate a Hardware Security Module (HSM). However, certain ordering options (e.g., TC237L32F200SACKXUMA2) include an optional HSM supporting AES-128/256, SHA-256, and RSA-2048 for secure boot and key management.
Can the Ethernet MAC operate in both MII and RMII modes simultaneously?
No - the ETH peripheral supports either MII or RMII mode, selected at reset via pin strapping (ETH_MODE[1:0]) and locked during runtime. MII uses 19 signals for 10/100 Mbps; RMII reduces this to 7 signals with 50 MHz reference clock, trading pin count for PCB routing simplicity.
How many independent CAN FD channels does TC237L32F200SACKXUMA1 support?
It supports six classical CAN 2.0B channels (via two MultiCAN+ modules, each with three nodes), but no native CAN FD capability. CAN FD functionality requires external transceivers and software-layer protocol handling; the hardware does not implement CAN FD bit-rate switching or extended data length framing.
TC237L32F200SACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC237L32F200SACKXUMA1 FAQ
1.How can I place an order for TC237L32F200SACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC237L32F200SACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC237L32F200SACKXUMA1 reliable?
The price and inventory of TC237L32F200SACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC237L32F200SACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC237L32F200SACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC237L32F200SACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC237L32F200SACKXUMA1?
TC237L32F200SACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC237L32F200SACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC237L32F200SACKXUMA1?
For technical support, including TC237L32F200SACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC237L32F200SACKXUMA1 requirements.
6.How does Aetrix verify that TC237L32F200SACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC237L32F200SACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC237L32F200SACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC237L32F200SACKXUMA1?
All TC237L32F200SACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC237L32F200SACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC237L32F200SACKXUMA1 part is unused and in its original packaging.
Return procedure for TC237L32F200SACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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