Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies TC237L32F200SACLXUMA1

Part No.:
TC237L32F200SACLXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
292-LFBGA
Datasheet:
AetrixTC237L32F200SACLXUMA1.pdf
Description:
IC MCU 32BIT 2MB FLASH 292LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,881

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TC237L32F200SACLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring a lockstepped TC1.6E CPU core operating up to 200 MHz, 2 MB program flash with ECC, 128 KB data flash for EEPROM emulation, and integrated IEEE 802.3 Ethernet MAC with RMII/MII interfaces. It targets automotive ADAS domain controllers requiring functional safety (ISO 26262 ASIL-D capable), real-time deterministic execution, and multi-protocol connectivity.

For engineers reviewing the TC237L32F200SACLXUMA1 datasheet, TC237L32F200SACLXUMA1 pinout, TC237L32F200SACLXUMA1 application, or TC237L32F200SACLXUMA1 equivalent, key selection criteria include dual-core lockstep configuration, on-chip HSM support, E-Ray v2.1 compliance, GTM-based I/O timing autonomy, and integrated Ethernet PHY interface readiness.

Technical Context

The TC237L32F200SACLXUMA1 implements a safety-critical dual-core architecture where the primary TC1.6E core executes application code while its shadow core performs lockstep comparison in real time, enabling detection of transient faults per ISO 26262 requirements. Its System PLL supports configurable clock tree distribution to CPU, peripherals, and bus subsystems.

It integrates a 64-bit SRI crossbar interconnect enabling concurrent access between CPU, DMA, GTM, and memory blocks, alongside an SPB peripheral bus for low-latency register access. The embedded voltage regulator (EVR) provides internal 1.3 V and 3.3 V domains with monitoring and reset generation on undervoltage conditions.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreTriCore™ TC1.6E scalar core with lockstepped shadow core for ASIL-D fault detection
Max Clock Frequency200 MHz across full industrial temperature range (–40 °C to +125 °C)
Flash Memory2 MB PFLASH with ECC protection; 128 KB DFLASH supporting EEPROM emulation
RAM184 KB DSPR + 8 KB PSPR + 8 KB ICACHE + 512 KB EMEM + 32 KB LMU
Peripherals2× MultiCAN+ (3 nodes each), 4× QSPI, 2× ASCLIN, 1× E-Ray v2.1, 1× ETH (MII/RMII), 1× GTM, 4× SENT
Safety FeaturesSMU, MTU (MBIST/ECC initialization), IOM, OCDS Level 1 debug, HSM option
PackagePG-LFBGA-292-6 with 0.8 mm pitch, 15 × 15 mm body, lead-free and RoHS compliant

Pinout & Package

TC237L32F200SACLXUMA1 uses the PG-LFBGA-292-6 package - a 292-pin fine-pitch ball grid array with 0.8 mm pitch, 15 mm × 15 mm footprint, and thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood applications.

Pin/TerminalCircuit RoleDesign Meaning
VDDP_1P3Core Power Supply1.3 V supply input for CPU, cache, and logic; requires local decoupling near balls A1–A3, B1–B3
VDDP_3P3I/O & Peripheral Power3.3 V supply for GPIO, CAN, ASCLIN, QSPI; supports 3.0–3.6 V operation with ±5 % tolerance
ETH_TXD0–ETH_TXD3Ethernet Transmit Data4-bit parallel MII transmit path; RMII mode uses only TXD0/TX_EN; routed with controlled impedance (50 Ω ±10 %)
ERAY_TxD_A / ERAY_RxD_AE-Ray Channel A TransceiverDifferential pair for FlexRay v2.1 communication; requires external 82 Ω termination and common-mode choke
TRSTNJTAG Debug ResetActive-low asynchronous reset for JTAG TAP controller; pulled high internally during power-up
BOOT_MODE[1:0]Boot ConfigurationTwo-pin strap defining boot source: 00=ROM, 01=PFLASH, 10=DFLASH, 11=reserved; sampled at POR

Key Features

FeatureDesign Value
Lockstep Dual-Core ExecutionReal-time instruction-by-instruction comparison between main and shadow TC1.6E cores enables immediate fault detection and safe state entry
Integrated Ethernet MACIEEE 802.3-compliant MAC with MII/RMII support, integrated DMA descriptors, and checksum offload reduces host CPU load by >30 % in gateway applications
GTM Timing EngineProgrammable digital signal processing unit with 12 timers, 16 capture/compare units, and 32 pattern generators enables autonomous PWM, encoder, and sensor signal conditioning without CPU intervention
ECC-Protected Memory SubsystemAll SRAM, Flash, and register files include single-bit error correction and double-bit error detection (SECDED), meeting ASIL-D memory integrity requirements
HSM Option SupportHardware Security Module available on select variants for secure boot, cryptographic acceleration (AES-128/256, SHA-256), and key management isolation from main CPU

Applications

Automotive ADAS Domain ControllerVehicle Gateway Module

Use Scenario: Centralized sensor fusion unit aggregating camera, radar, and ultrasonic inputs for lane-keeping and automatic emergency braking.

IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software partitions with lockstep verification and time-triggered scheduling via GTM.

Use Value: Deterministic 200 MHz execution with hardware-enforced separation ensures <10 µs worst-case interrupt latency and guaranteed response to safety-critical events.

Use Scenario: In-vehicle network bridge routing messages between CAN FD, LIN, FlexRay, and Ethernet domains in next-gen E/E architectures.

IC Role / Device Role / Timing Role: Protocol translation engine using MultiCAN+, E-Ray, and ETH peripherals with zero-copy DMA transfers and hardware timestamping.

Use Value: Integrated 2 MB PFLASH stores multiple firmware images; DFLASH emulates EEPROM for configuration storage with >100 k write cycles and 20-year data retention.

Electric Powertrain Control UnitCommercial Vehicle Telematics Hub

Use Scenario: Real-time motor control and battery management system coordinating inverter gate drivers and cell monitoring ICs.

IC Role / Device Role / Timing Role: High-precision timing controller leveraging GTM's 1 ns resolution PWM generation and SENT interface for analog sensor digitization.

Use Value: On-chip 12-bit VADC with 4 independent kernels supports simultaneous sampling of current, voltage, and temperature with <±1 LSB INL across –40 °C to +125 °C.

Use Scenario: Fleet connectivity module integrating GPS, cellular modem, and vehicle diagnostics for remote monitoring and OTA updates.

IC Role / Device Role / Timing Role: Secure host processor managing TLS handshake, firmware signature verification, and encrypted OTA payload decryption via optional HSM.

Use Value: Hardware-accelerated AES-256 and SHA-256 reduce OTA update verification time from seconds to sub-100 ms, minimizing vehicle downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TC234L32F200SACLLMA1Same core, same flash/RAM, but PG-TQFP-144 package (144 pins); no Ethernet MAC or E-Ray; reduced peripheral countSuitable for cost-sensitive body control modules where Ethernet/FlexRay not requiredSelect when board space constraints favor TQFP and safety requirements are ASIL-B/C only
TC375LPD128F200SACXTMA1Next-generation AURIX™ TC3xx family; 300 MHz TC1.8P core; 4 MB PFLASH; adds PCIe, USB, and higher-speed Ethernet (100BASE-T1)Targeted at zonal architecture controllers needing higher bandwidth and future-proofing beyond 2025Select for new designs requiring >200 MHz performance, PCIe endpoint capability, or 100BASE-T1 PHY integration

Compared with TC234L32F200SACLLMA1, TC237L32F200SACLXUMA1 delivers full ASIL-D-ready Ethernet and FlexRay connectivity in LFBGA packaging, while TC375LPD128F200SACXTMA1 extends performance and protocol scope but requires PCB redesign and toolchain migration.

Availability

TC237L32F200SACLXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, vehicle gateway modules, electric powertrain control units, and commercial vehicle telematics hubs requiring stable component supply across extended lifecycle commitments.

Supply support for TC237L32F200SACLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, security ICs, and sensors, with global R&D and manufacturing infrastructure.

This device belongs to the AURIX™ TC23x family-designed specifically for automotive safety-critical applications demanding ASIL-D compliance, real-time determinism, and multi-protocol networking in harsh environments.

FAQ

What is the maximum ambient temperature rating for TC237L32F200SACLXUMA1?

The device is qualified for operation from –40 °C to +125 °C ambient temperature, validated per AEC-Q100 Grade 1 requirements. Junction temperature must remain below 150 °C under all operating conditions, with thermal design guidance provided in the package outline section (page 226) of the datasheet.

Does TC237L32F200SACLXUMA1 include hardware cryptographic acceleration?

No-the base TC237L32F200SACLXUMA1 variant does not integrate a Hardware Security Module (HSM). However, certain ordering options (e.g., TC237L32F200SACLXUMA2) include an optional HSM supporting AES-128/256, SHA-256, and RSA-2048 acceleration with secure key storage.

Can the Ethernet MAC operate in RMII mode without an external PHY?

No-the integrated Ethernet MAC requires an external PHY for physical layer signaling. RMII mode reduces pin count versus MII but still mandates external components including magnetics, 50 MHz reference clock, and PHY-level registers accessed via MDIO/MDC.

How many independent CAN FD channels does TC237L32F200SACLXUMA1 support?

It supports six CAN FD channels via two MultiCAN+ modules (each with three CAN nodes), with full CAN FD frame handling (up to 64-byte payloads), bit rates up to 5 Mbit/s, and hardware message filtering across 128 configurable message objects.

TC237L32F200SACLXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
292-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, FlexRay, LINbus, QSPI
Peripherals:
DMA, WDT
Number of I/O:
120
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC237L32F200SACLXUMA1 FAQ

1.How can I place an order for TC237L32F200SACLXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC237L32F200SACLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC237L32F200SACLXUMA1 reliable?

The price and inventory of TC237L32F200SACLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC237L32F200SACLXUMA1 is usually 5 days.

3.What payment methods are accepted for TC237L32F200SACLXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC237L32F200SACLXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC237L32F200SACLXUMA1?

TC237L32F200SACLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC237L32F200SACLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC237L32F200SACLXUMA1?

For technical support, including TC237L32F200SACLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC237L32F200SACLXUMA1 requirements.

6.How does Aetrix verify that TC237L32F200SACLXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC237L32F200SACLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC237L32F200SACLXUMA1 meets industry standards.

7.What is the process for return or replacement of TC237L32F200SACLXUMA1?

All TC237L32F200SACLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC237L32F200SACLXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC237L32F200SACLXUMA1 part is unused and in its original packaging.

Return procedure for TC237L32F200SACLXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC237L32F200SACLXUMA1 Tags

  • TC237L32F200SACLXUMA1
  • TC237L32F200SACLXUMA1 PDF
  • TC237L32F200SACLXUMA1 Datasheet
  • TC237L32F200SACLXUMA1 Specifications
  • TC237L32F200SACLXUMA1 Images
  • Infineon Technologies
  • Infineon Technologies TC237L32F200SACLXUMA1
  • Buy TC237L32F200SACLXUMA1
  • TC237L32F200SACLXUMA1 Price
  • TC237L32F200SACLXUMA1 Distributor
  • TC237L32F200SACLXUMA1 Supplier
  • TC237L32F200SACLXUMA1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER