My Inquiry
My Account
Infineon Technologies TC237LP32F200NACKXUMA1
- Part No.:
- TC237LP32F200NACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC237LP32F200NACKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC237LP32F200NACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash (PFLASH), 128 KB data flash (DFLASH) for EEPROM emulation, and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1 (ERAY), and GTM timer subsystem - deployed in automotive ADAS domain controllers and safety-critical ECU designs.
For engineers reviewing the TC237LP32F200NACKXUMA1 datasheet, TC237LP32F200NACKXUMA1 pinout, TC237LP32F200NACKXUMA1 application, or TC237LP32F200NACKXUMA1 equivalent, key selection considerations include ASCLIN/LIN support up to 50 MBaud, ECC-protected memory hierarchy, SMU-assisted ISO 26262 ASIL-D compliance readiness, and PG-LFBGA-292 package thermal performance under extended automotive temperature range (–40 °C to +125 °C).
Technical Context
The TC237LP32F200NACKXUMA1 implements a dual-core lockstep architecture where the shadow core continuously verifies the primary TC1.6E scalar CPU's instruction execution, enabling real-time fault detection per ISO 26262 requirements. Its SRI 64-bit crossbar interconnect enables concurrent access among CPU, DMA, GTM, and memory blocks without arbitration bottlenecks.
It integrates a Safety Management Unit (SMU) that monitors clock, reset, voltage, and memory test unit (MTU) status, triggering configurable error responses including safe state entry. The on-chip EVR supplies regulated 1.3 V and 3.3 V domains, while the System PLL and ERAY_PLL provide independent, jitter-controlled clock trees for functional and communication subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E with lockstepped shadow core; enables ASIL-D compliant software execution via hardware-level redundancy checking. |
| Max Clock Frequency | 200 MHz across full industrial temperature range (–40 °C to +125 °C); sustains deterministic real-time response in safety-critical control loops. |
| Memory | 2 MB PFLASH + 128 KB DFLASH (EEPROM-emulated); all embedded memories feature SEC-DED ECC for runtime bit-error correction. |
| Communication | Dual MultiCAN+ (6 CAN nodes), FlexRay v2.1 (2 channels), IEEE 802.3 ETH (MII/RMII), 4× QSPI, 2× ASCLIN with LIN v2.1 support - enables multi-bus vehicle networking. |
| Analog Interface | VADC with 4 independent kernels, 0–5.5 V input range, and hardware FIFO; supports sensor signal acquisition with timestamping and pre-processing offload. |
| Safety Features | SMU, MTU (MBIST/ECC initialization), IOM (I/O monitoring), OCDS Level 1 debug - collectively support FMEDA and diagnostic coverage targets for ASIL-D systems. |
| Package | PG-LFBGA-292-6; 15 × 15 mm body, 0.8 mm pitch, qualified for automotive reflow profiles and thermal cycling per AEC-Q100 Grade 1. |
Pinout & Package
TC237LP32F200NACKXUMA1 is housed in a 292-pin PG-LFBGA-292-6 package with 0.8 mm pitch, designed for high-density automotive PCB layouts and thermally demanding environments. Pin functions are organized into dedicated port groups supporting multiplexed I/O, power/ground distribution, and high-speed differential signaling (e.g., ETH, FlexRay, CAN).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU, cache, and logic; requires low-noise regulation and local decoupling per EVR output spec. |
| VDDP_3P3 | I/O & Peripheral Power | 3.3 V supply for GPIO, ASCLIN, QSPI, and analog peripherals; supports 5 V-tolerant inputs on selected ports. |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data | MII-mode 4-bit parallel transmit bus; routed differentially with controlled impedance (50 Ω) for <100 Mbps operation. |
| ERAY_TxD_A / ERAY_RxD_A | FlexRay Channel A Transceiver Interface | Differential pair for FlexRay v2.1 physical layer; requires external bus driver and termination per ISO 17458-4. |
| ASC0_TX / ASC0_RX | ASCLIN Channel 0 Serial Interface | Full-duplex UART/LIN-capable pins; support programmable baud rates up to 50 MBaud with hardware LIN header detection. |
| TRST, TCK, TMS, TDI, TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary-scan and debug access; enables OCDS Level 1 visibility into CPU, DMA, and bus activity. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Primary and shadow TC1.6E cores execute identical instructions in parallel; mismatch triggers immediate SMU alarm and safe state transition. |
| ECC-Protected Memory Subsystem | All SRAM (DSPR/PSPR), PFLASH, DFLASH, and boot ROM implement SEC-DED ECC - corrects single-bit errors and detects double-bit faults in real time. |
| Generic Timer Module (GTM) | Hardware-accelerated timing, PWM generation, capture/compare, and sigma-delta modulation - offloads CPU from motor control and sensor signal conditioning tasks. |
| MultiCAN+ with 128 Message Objects | Configurable FIFO-based message buffering and gateway routing between CAN networks - reduces host CPU interrupt load in multi-domain ECUs. |
| Hardware Security Module (HSM) | Optional cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management - isolates security-critical operations from main application core. |
Applications
| ADAS Domain Controller | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Centralized processing of camera, radar, and ultrasonic sensor fusion data with real-time path planning and actuator command generation. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software partitions; GTM handles time-critical PWM for steering motor drivers; ETH and FlexRay enable high-bandwidth sensor and chassis network interfacing. Use Value: Lockstep CPU and ECC memory ensure >99% diagnostic coverage for fault detection; dual CAN/FlexRay support redundant communication paths required by ISO 26262. |
Use Scenario: Closed-loop torque control of brushless DC steering motors with position/speed feedback from resolver and Hall sensors. IC Role / Device Role / Timing Role: Real-time motor control unit running field-oriented control (FOC) algorithms; CCU6 and GTM generate synchronized PWM with <100 ns jitter; VADC acquires resolver signals with hardware filtering. Use Value: 200 MHz deterministic execution enables sub-50 µs current loop update; ECC-protected RAM prevents corruption of FOC coefficients during EMI events. |
| Brake-by-Wire Control Unit | Vehicle Gateway ECU |
|
Use Scenario: Redundant hydraulic pressure control with fail-operational capability across multiple brake actuators and pedal position sensing. IC Role / Device Role / Timing Role: Dual-lockstep safety controller managing ASIL-D braking logic; SMU monitors voltage, clock, and memory integrity; MultiCAN+ routes commands across brake, chassis, and powertrain networks. Use Value: Integrated SMU and MTU eliminate need for external watchdog ICs; 128-message CAN object FIFO enables zero-CPU-overhead gatewaying between CAN FD and legacy CAN buses. |
Use Scenario: Protocol translation and firewalling between high-speed Ethernet backbone (OTA, infotainment), CAN FD (powertrain), and legacy CAN (body electronics). IC Role / Device Role / Timing Role: Network bridge with hardware-accelerated packet filtering and routing; ETH MAC processes TCP/IP stacks; QSPI interfaces to external flash for OTA update storage. Use Value: Dedicated QSPI and ETH interfaces allow concurrent firmware download and in-vehicle network traffic - no bandwidth contention with safety-critical CAN messaging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200NACKXUMA1 | Same core, frequency, and peripheral set but in PG-TQFP-144 package (144 pins); reduced memory (1 MB PFLASH, 96 KB DFLASH); no Ethernet MAC. | Limited to mid-tier ADAS modules or non-networked safety ECUs where footprint and cost outweigh bandwidth needs. | Select when board space constraints favor TQFP or Ethernet is not required - avoids LFBGA assembly complexity. |
| S32K344WAT0VLQY | NXP S32K3 series ARM Cortex-M7 with lockstep option; 320 MHz max, 4 MB flash, CAN FD only (no FlexRay/Ethernet); ASIL-D certified per ISO 26262. | Targets next-gen zonal architectures requiring higher compute density but lacking legacy FlexRay dependency. | Choose for new designs prioritizing ARM ecosystem tooling and CAN FD-only networks - requires redesign of FlexRay/Ethernet interface layers. |
Compared with TC234LP32F200NACKXUMA1, this part adds Ethernet and FlexRay for high-integrity vehicle networking; versus S32K344, it retains native FlexRay v2.1 and TriCore toolchain continuity critical for legacy ADAS platform migration.
Availability
TC237LP32F200NACKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric power steering units, brake-by-wire systems, and vehicle gateway ECUs requiring stable component supply across extended product lifecycles.
Supply support for TC237LP32F200NACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure aligned to automotive quality standards.
This device belongs to the AURIX™ TC23x family - engineered specifically for ISO 26262-compliant automotive safety applications, emphasizing lockstep processing, memory safety, and multi-protocol real-time networking for ADAS and vehicle dynamics control.
FAQ
What is the maximum ambient temperature rating for TC237LP32F200NACKXUMA1?
The device is qualified per AEC-Q100 Grade 1, supporting continuous operation from –40 °C to +125 °C ambient temperature. Junction temperature must remain ≤ +150 °C under worst-case power dissipation; thermal design must account for PG-LFBGA-292 package thermal resistance (RθJA = 22.5 °C/W typical) and board copper area.
Does TC237LP32F200NACKXUMA1 include hardware cryptographic acceleration?
Yes - an optional Hardware Security Module (HSM) is integrated in this variant, supporting AES-128/256 encryption/decryption, SHA-256 hashing, RSA-2048 signature verification, and secure boot key provisioning. HSM operates independently of the main TriCore CPU and enforces strict memory isolation via dedicated bus interface.
How many CAN message objects are supported, and are they configurable per node?
The dual MultiCAN+ module provides 128 total message objects, assignable across its six CAN nodes (3 per module). Each object supports individual ID masking, direction (TX/RX), FIFO buffering, and priority-based transmission scheduling - enabling flexible gateway and protocol translation configurations without CPU intervention.
Is external clock source required, or does TC237LP32F200NACKXUMA1 support internal oscillator startup?
The device includes an internal RC oscillator (IRC) for initial power-on reset and boot sequence, but full-speed operation (up to 200 MHz) requires an external crystal (4–20 MHz) connected to OSCIN/OSCOUT pins to drive the System PLL. The IRC alone supports only low-power debug and wake-up modes, not functional operation.
TC237LP32F200NACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 1.43V, 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC237LP32F200NACKXUMA1 FAQ
1.How can I place an order for TC237LP32F200NACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC237LP32F200NACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC237LP32F200NACKXUMA1 reliable?
The price and inventory of TC237LP32F200NACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC237LP32F200NACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC237LP32F200NACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC237LP32F200NACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC237LP32F200NACKXUMA1?
TC237LP32F200NACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC237LP32F200NACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC237LP32F200NACKXUMA1?
For technical support, including TC237LP32F200NACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC237LP32F200NACKXUMA1 requirements.
6.How does Aetrix verify that TC237LP32F200NACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC237LP32F200NACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC237LP32F200NACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC237LP32F200NACKXUMA1?
All TC237LP32F200NACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC237LP32F200NACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC237LP32F200NACKXUMA1 part is unused and in its original packaging.
Return procedure for TC237LP32F200NACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC237LP32F200NACKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
