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Infineon Technologies TC237LP32F200NACLXUMA1
- Part No.:
- TC237LP32F200NACLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC237LP32F200NACLXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
TC237LP32F200NACLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash, 128 KB data flash (EEPROM-emulated), and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM for autonomous I/O timing-designed for automotive ADAS and safety-critical powertrain control.
For engineers reviewing the TC237LP32F200NACLXUMA1 datasheet, TC237LP32F200NACLXUMA1 pinout, TC237LP32F200NACLXUMA1 application, or TC237LP32F200NACLXUMA1 equivalent, key selection criteria include ASIL-D support via lockstep core, ECC-protected memories, hardware safety monitors (SMU, MTU, IOM), and dual-core debug access via JTAG/DAP for functional safety validation.
Technical Context
The TC237LP32F200NACLXUMA1 implements a safety-certified architecture with dual TriCore CPUs in lockstep mode, where the shadow core continuously verifies instruction execution of the main core-enabling real-time fault detection per ISO 26262 ASIL-D requirements. Its System PLL delivers stable 200 MHz system clock from external crystal or oscillator input.
On-chip peripherals are safety-isolated: the GTM provides deterministic timing for motor control PWM generation, while the E-Ray module supports time-triggered communication with dual-channel redundancy and built-in CRC protection. The VADC features four independent kernels with 12-bit resolution and configurable sampling windows for sensor signal acquisition in engine management systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore TC1.6E + lockstepped shadow core for ASIL-D compliance |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40°C to 125°C) |
| Flash Memory | 2 MB PFLASH with ECC protection; 128 KB DFLASH for EEPROM emulation |
| RAM | 184 KB DSPR + 8 KB PSPR + 8 KB ICACHE + 512 KB EMEM, all ECC-protected |
| Communication Interfaces | 2× MultiCAN+ (6 CAN nodes), 1× FlexRay v2.1 (2 channels), 1× IEEE 802.3 Ethernet (MII/RMII), 4× QSPI, 2× ASCLIN |
| Analog Peripherals | VADC with 4 independent kernels, 12-bit resolution, 0–5.5 V input range, up to 16 Msample/s aggregate |
| Safety Features | SMU, MTU (MBIST/ECC), IOM, OCDS Level 1 debug, HSM optional on select variants |
Pinout & Package
This device uses the PG-LFBGA-292-6 package (292-pin low-profile fine-pitch ball grid array) with 1.0 mm ball pitch and 17 × 17 array layout. Thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3 | 1.3 V Core Power Supply | Supplies CPU, cache, and internal logic; requires low-noise regulation and local decoupling |
| VDDP_3.3 | 3.3 V I/O and Peripheral Power | Powers GPIO, CAN transceivers, ASCLIN, QSPI, and ETH PHY interface circuitry |
| OSC_IN / OSC_OUT | External Crystal Oscillator Interface | Supports 1–40 MHz crystal; feeds System PLL for precise clock generation and jitter control |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | Provides IEEE 802.3-compliant MDIO bus for PHY configuration and status monitoring |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Data Lines | Differential signaling pair for time-triggered, fault-tolerant communication in chassis networks |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Real-time instruction-level comparison between main and shadow cores enables immediate fault detection and safe shutdown |
| ECC-Protected Memories | All SRAM, Flash, and cache blocks include single-bit error correction and double-bit error detection for runtime reliability |
| Hardware Safety Monitor (SMU) | Centralized alarm routing for watchdog timeouts, clock failure, voltage monitor faults, and peripheral error conditions |
| Generic Timer Module (GTM) | Offloads CPU from high-frequency PWM, capture, and complex signal conditioning tasks in motor control applications |
| MultiCAN+ with FIFO Buffering | Enables gateway functionality with configurable message objects and hardware filtering to reduce CPU interrupt load |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and exhaust gas recirculation control in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software with lockstep verification and memory ECC. Use Value: Enables deterministic 200 MHz execution with hardware fault containment-meeting ISO 26262 requirements without external safety co-processors. | Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for adaptive cruise control and automatic emergency braking. IC Role / Device Role / Timing Role: Central processing node managing time-synchronized data ingestion via FlexRay and Ethernet, with GTM-assisted timestamping. Use Value: Dual-channel FlexRay and RMII Ethernet provide redundant, low-latency communication paths for fail-operational behavior. |
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
Use Scenario: High-bandwidth torque assist computation with torque sensor feedback, motor current control, and fail-safe torque limiting. IC Role / Device Role / Timing Role: Real-time motor control processor using GTM for sub-microsecond PWM generation and CCU6 for position capture. Use Value: Integrated GTM eliminates need for external timer ASICs-reducing BOM count and PCB area while improving timing precision. | Use Scenario: Redundant actuator control for electro-hydraulic brake systems requiring dual independent control paths. IC Role / Device Role / Timing Role: Dual-lockstep TriCore core executes two independent ASIL-D control algorithms with cross-checking via HSM. Use Value: On-chip HSM (when enabled) provides cryptographic acceleration and secure boot-ensuring integrity of brake command firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200NACLXUMA1 | Same core, same frequency, but 1 MB PFLASH and no Ethernet MAC; lacks RMII/MII interface | Suitable for CAN/FlexRay-only gateways without Ethernet connectivity requirement | Select when Ethernet is not needed and cost-sensitive BOM optimization is prioritized |
| TC275TP128F200NACLXUMA1 | TriCore TC1.8P core, 200 MHz, 4 MB PFLASH, includes HSM as standard; larger LFBGA-356 package | Targeted for higher-integration domain controllers requiring secure boot and extended crypto services | Choose when hardware security module and >2 MB flash are mandatory for OTA update and secure boot workflows |
Compared with TC234LP32F200NACLXUMA1, this part adds Ethernet MAC and 1 MB more flash-critical for ADAS domain controllers needing over-the-air updates and sensor data streaming. Versus TC275TP128F200NACLXUMA1, it trades HSM and extra flash for smaller footprint and lower thermal envelope-ideal for space-constrained ECU designs.
Availability
TC237LP32F200NACLXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, ADAS sensor fusion, electric power steering, and brake-by-wire systems requiring stable component supply across long production lifecycles.
Supply support for TC237LP32F200NACLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and automotive-grade manufacturing facilities.
This part belongs to the AURIX™ TC23x family-designed specifically for ISO 26262 ASIL-D automotive applications including engine control, chassis systems, and advanced driver assistance, emphasizing functional safety, real-time performance, and integrated communication.
FAQ
What is the maximum ambient temperature rating for TC237LP32F200NACLXUMA1?
The device is qualified for operation from −40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating applies to the full 200 MHz CPU frequency range and all on-chip peripherals including Ethernet MAC and FlexRay modules, validated under JEDEC JESD22-A104 temperature cycling and JESD22-A108 high-temperature operating life testing.
Does TC237LP32F200NACLXUMA1 include an integrated Ethernet PHY?
No, it integrates only the IEEE 802.3-compliant Media Access Controller (MAC) with MII and RMII interfaces. An external PHY chip (e.g., LAN8720A or KSZ8081RNB) must be used for physical layer signaling, with RMII requiring just 5 pins for 10/100 Mbps operation and reduced PCB routing complexity.
How is functional safety certification supported in hardware?
Hardware safety mechanisms include lockstep CPU cores with continuous instruction comparison, ECC on all memories, SMU for centralized alarm handling, MTU for memory self-test (MBIST), and IOM for digital I/O pin monitoring. These features collectively enable ASIL-D decomposition per ISO 26262 Part 5 and are documented in Infineon's Safety Manual (V1.0, 2017).
Can the VADC operate independently of CPU intervention?
Yes-the VADC supports autonomous conversion sequences triggered by GTM timers or peripheral events, with results stored directly into DMA-accessible buffers. Each of the four ADC kernels can be configured with dedicated scan lists, window comparators, and post-processing (e.g., averaging), enabling sensor monitoring without CPU wake-up in low-power modes.
TC237LP32F200NACLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 1.43V, 2.97V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC237LP32F200NACLXUMA1 FAQ
1.How can I place an order for TC237LP32F200NACLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC237LP32F200NACLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC237LP32F200NACLXUMA1 reliable?
The price and inventory of TC237LP32F200NACLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC237LP32F200NACLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC237LP32F200NACLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC237LP32F200NACLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC237LP32F200NACLXUMA1?
TC237LP32F200NACLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC237LP32F200NACLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC237LP32F200NACLXUMA1?
For technical support, including TC237LP32F200NACLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC237LP32F200NACLXUMA1 requirements.
6.How does Aetrix verify that TC237LP32F200NACLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC237LP32F200NACLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC237LP32F200NACLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC237LP32F200NACLXUMA1?
All TC237LP32F200NACLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC237LP32F200NACLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC237LP32F200NACLXUMA1 part is unused and in its original packaging.
Return procedure for TC237LP32F200NACLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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