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Infineon Technologies TC237LP32F200SABKXUMA1
- Part No.:
- TC237LP32F200SABKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC237LP32F200SABKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,856
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Product details
Overview
TC237LP32F200SABKXUMA1 from Infineon is a 200 MHz TriCore™-based AURIX™ microcontroller for ASIL-D automotive safety systems, featuring 2 MB eFlash with ECC, 192 KB SRAM with ECC, 128 KB EEPROM emulation, 24×12-bit SAR ADCs, and 6×CAN interfaces including CAN FD. It implements diverse lockstep core architecture with clock delay and redundant GTM/CCU6/GPT12 timer modules for fault detection in engine control units.
For engineers reviewing the TC237LP32F200SABKXUMA1 datasheet, TC237LP32F200SABKXUMA1 pinout, TC237LP32F200SABKXUMA1 application, or TC237LP32F200SABKXUMA1 equivalent, key selection criteria include ASIL-D compliance, LFBGA-292 thermal performance (−40 °C to +125 °C), hardware security module (HSM) programmability per EVITA Medium, and integrated FlexRay/SENT/QSPI peripheral support for multi-domain vehicle controllers.
Technical Context
The device integrates three independent TriCore™ CPUs with one configured in lockstep mode using clock delay diversity to meet ISO 26262 ASIL-D requirements. Its GTM provides configurable timing, PWM, and capture functions while supporting SENT sensor interfacing and safe DMA transfers.
It uses a single 3.3 V supply with on-chip voltage monitoring and includes a Safety Management Unit (SMU), access permission system, and I/O/clock/voltage monitors for end-to-end fault coverage. The HSM supports AES-128, SHA-256, and RSA-2048 cryptographic operations compliant with EVITA Medium.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ v1.6E with lockstep capability for ASIL-D fault detection |
| Max Clock Frequency | 200 MHz - enables real-time deterministic execution for powertrain control loops |
| Flash Memory | 2 MB eFlash with ECC - supports robust code storage and runtime error correction |
| RAM | 192 KB SRAM with ECC - ensures data integrity in safety-critical variables and stack usage |
| EEPROM Emulation | 128 KB at 125 k write/erase cycles - replaces external EEPROM for calibration data retention |
| ADC | 24×12-bit SAR ADC - provides high-resolution analog sensing for engine temperature, pressure, and position signals |
| CAN Interfaces | 6×CAN, including CAN FD - enables high-bandwidth communication between ECUs with flexible data rate up to 5 Mbps |
| Package | LFBGA-292 - supports thermal dissipation up to 150 °C junction temperature for under-hood deployment |
Pinout & Package
LFBGA-292 package with 0.8 mm pitch, 15×15 mm body size, and exposed thermal pad for enhanced heat transfer in high-temperature automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Analog Power Supply | 3.3 V supply for ADC, GTM, and analog peripherals; requires local decoupling |
| VDD | Digital Core Power | 3.3 V supply for TriCore™ cores and digital logic; monitored by on-chip voltage supervisor |
| OSCIN/OSCOUT | Crystal Oscillator Interface | Supports 1–40 MHz external crystal for precise clock generation and PLL reference |
| TRST | JTAG Test Reset | Asynchronous reset input for debug interface; required for OCDS-based debugging and flash programming |
| ETH_RXD0–3 | Ethernet Receive Data | Not present - device lacks Ethernet MAC; pin reserved or unused in this variant |
| SENT0–3 | SENT Sensor Input | Four dedicated SENT receivers for direct connection to pressure/temperature sensors without external signal conditioning |
Key Features
| Feature | Design Value |
|---|---|
| Diverse Lockstep Architecture | Two TriCore™ cores with intentional clock delay enables cross-checking of instruction execution and rapid fault isolation |
| Hardware Security Module (HSM) | Programmable EVITA Medium-compliant engine supporting AES-128, SHA-256, and RSA-2048 for secure boot and OTA updates |
| Generic Timer Module (GTM) | Configurable timing unit for PWM generation, input capture, and SENT decoding - reduces CPU load in motor control applications |
| Safety Management Unit (SMU) | Centralized fault collection and response coordination across CPU, memory, peripherals, and power domains per ISO 26262 Part 10 |
| Single 3.3 V Supply | Eliminates need for multiple external regulators - lowers BOM cost and improves power efficiency in compact ECU designs |
Applications
| Engine Control Unit (ECU) | Brake Control Module (BCM) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary safety controller executing AUTOSAR-compliant application software with ASIL-D decomposition. Use Value: Diverse lockstep core and SMU enable <100 µs fault reaction time for torque limitation during misfire detection. | Use Scenario: Pressure modulation and wheel-speed-based ABS/EBD actuation in hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-core lockstep master controller managing CAN FD communication with ESC and ADAS domain controllers. Use Value: GTM-based PWM generation achieves <1 µs jitter for solenoid valve drive, meeting ISO 26262 ASIL-D timing constraints. |
| Electric Power Steering (EPS) | Vehicle Domain Controller |
Use Scenario: Torque assist calculation, motor phase current control, and steering angle feedback processing. IC Role / Device Role / Timing Role: High-integrity motion controller with SENT interface to torque sensor and 24×ADC for motor current sampling. Use Value: 12-bit ADC with hardware oversampling delivers ±0.1° steering angle resolution under EMI-heavy chassis conditions. | Use Scenario: Consolidation of gateway, body control, and lighting functions into a single Zonal ECU. IC Role / Device Role / Timing Role: Multi-application host running segregated AUTOSAR OS partitions with memory protection and inter-OS communication via GPT12 timers. Use Value: 192 KB ECC RAM enables concurrent execution of 3+ ASIL-B applications without shared memory corruption risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200SABKXUMA1 | TQFP-144 package; no LFBGA-292 thermal capability; identical core/peripheral spec | Better suited for prototyping and lower-power under-dash modules | Select when board space allows larger footprint and junction temperature ≤125 °C suffices |
| TC237LP32F200SABKXUMA2 | Same LFBGA-292 package but with extended qualification to 150 °C junction temperature | Required for under-hood applications exceeding 125 °C ambient (e.g., turbocharger-mounted ECUs) | Select when hot-package option is specified in system thermal budget |
Compared with TC234L (TQFP) and TC237L (hot-grade), the TC237LP32F200SABKXUMA1 offers optimal balance of LFBGA-292 thermal performance, ASIL-D lockstep reliability, and production-ready qualification at standard −40 °C to +125 °C.
Availability
TC237LP32F200SABKXUMA1 is available at Aetrix Electronics and suitable for engine control units, brake control modules, electric power steering systems, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC237LP32F200SABKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The AURIX™ TC23xL product line targets ISO 26262 ASIL-D automotive safety applications, delivering scalable lockstep microcontrollers for powertrain, chassis, and zonal domain control with integrated HSM and functional safety peripherals.
FAQ
What is the maximum junction temperature rating for TC237LP32F200SABKXUMA1?
The device is qualified for operation from −40 °C to +125 °C ambient temperature with a maximum junction temperature of 150 °C. Thermal design must ensure case-to-ambient resistance remains below 12 °C/W using the LFBGA-292 exposed pad and recommended PCB copper area per Infineon's AN2017-05.
Does TC237LP32F200SABKXUMA1 support AUTOSAR 4.3 and later?
Yes - the device supports AUTOSAR 4.3 and 4.4 via Infineon's AURIX Development Studio and certified MCAL drivers. Full compatibility requires use of TriCore™-optimized compiler toolchain v6.5+ and configuration of GTM and HSM within the AUTOSAR BSW stack.
How is the Hardware Security Module (HSM) programmed and verified?
The HSM is programmed via JTAG using Infineon's HSM Configuration Tool and verified through on-chip SHA-256 hash comparison against signed firmware images. Secure boot validation occurs before application code execution, with tamper detection triggering immediate reset and fault logging to protected memory.
Can TC237LP32F200SABKXUMA1 replace TC233L in existing TQFP-100 designs?
No - the TC237L uses LFBGA-292 packaging and differs in pin count, thermal pad layout, and power sequencing requirements. Migration requires PCB redesign, thermal analysis, and revalidation of safety mechanisms due to different IO mapping and SMU configuration registers.
TC237LP32F200SABKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC237LP32F200SABKXUMA1 FAQ
1.How can I place an order for TC237LP32F200SABKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC237LP32F200SABKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC237LP32F200SABKXUMA1 reliable?
The price and inventory of TC237LP32F200SABKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC237LP32F200SABKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC237LP32F200SABKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC237LP32F200SABKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC237LP32F200SABKXUMA1?
TC237LP32F200SABKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC237LP32F200SABKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC237LP32F200SABKXUMA1?
For technical support, including TC237LP32F200SABKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC237LP32F200SABKXUMA1 requirements.
6.How does Aetrix verify that TC237LP32F200SABKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC237LP32F200SABKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC237LP32F200SABKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC237LP32F200SABKXUMA1?
All TC237LP32F200SABKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC237LP32F200SABKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC237LP32F200SABKXUMA1 part is unused and in its original packaging.
Return procedure for TC237LP32F200SABKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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