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Infineon Technologies TC237LP32F200SACKXUMA1
- Part No.:
- TC237LP32F200SACKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC237LP32F200SACKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,045
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Product details
Overview
TC237LP32F200SACKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash, 128 KB data flash (EEPROM-emulated), and integrated Ethernet MAC (MII/RMII), FlexRay v2.1, and dual MultiCAN+ modules. It targets automotive ADAS domain controllers requiring ASIL-D compliance support.
For engineers reviewing the TC237LP32F200SACKXUMA1 datasheet, TC237LP32F200SACKXUMA1 pinout, TC237LP32F200SACKXUMA1 application, or TC237LP32F200SACKXUMA1 equivalent, this page delivers verified package mapping (PG-LFBGA-292), confirmed safety features (SMU, MTU, IOM), real-time peripheral timing (ERAY_PLL, ETH RMII), and validated automotive-grade alternatives.
Technical Context
The TC237LP32F200SACKXUMA1 implements a dual-core lockstep architecture where the shadow core continuously verifies the primary TC1.6E CPU's instruction execution, enabling ASIL-D fault detection per ISO 26262. Its System PLL supports 200 MHz core clock generation with ±1% accuracy over –40°C to 125°C.
On-chip memory includes ECC-protected 2 MB PFLASH and 128 KB DFLASH for EEPROM emulation, while the GTM provides autonomous I/O signal processing-reducing CPU load for time-critical sensor actuation in brake-by-wire or steering control systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | TriCore™ TC1.6E + lockstepped shadow core for ASIL-D runtime verification |
| Max Core Frequency | 200 MHz across full industrial temperature range (–40°C to +125°C) |
| Flash Memory | 2 MB program flash (PFLASH) with ECC and 128 KB data flash (DFLASH) for EEPROM emulation |
| RAM | 184 KB DSPR + 8 KB PSPR + 32 KB LMU + 512 KB EMEM, all ECC-protected |
| Communication Interfaces | Dual MultiCAN+ (3 CAN nodes each), FlexRay v2.1 (2 channels), IEEE 802.3 Ethernet MAC (MII/RMII), 4× SENT, 4× QSPI |
| Safety Features | SMU (Safety Management Unit), MTU (Memory Test Unit), IOM (I/O Monitor), OCDS Level 1 debug |
| Clock Sources | System PLL (up to 200 MHz), ERAY_PLL, backup clock (32 kHz), external crystal support (1–40 MHz) |
Pinout & Package
TC237LP32F200SACKXUMA1 is housed in a PG-LFBGA-292-6 package (15 mm × 15 mm, 0.8 mm pitch), qualified for automotive applications per AEC-Q100 Grade 1. The package supports thermal dissipation up to 2.5 W under typical ADAS operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | 1.3 V core power supply | Supplies CPU, cache, and internal logic; requires low-noise regulation and local decoupling |
| VDDP_3V3 | 3.3 V I/O and peripheral power | Drives GPIO, CAN transceivers, QSPI, ASCLIN; tolerant of ±5% variation |
| ETH_TXD0–ETH_TXD3 | Ethernet transmit data lines (MII mode) | Drive 10/100 Mbps MII signals; require controlled impedance (50 Ω) routing |
| ERAY_TxD_A / ERAY_RxD_A | FlexRay channel A differential transceiver pins | Support 10 Mbps differential signaling; require 110 Ω termination between Tx and Rx pairs |
| CCU60_OUT0A / CCU60_OUT0B | Complementary PWM outputs (GTM-CCU6 kernel) | Generate dead-time-controlled gate drive signals for motor inverter stages |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Verification | Real-time comparison of primary and shadow core outputs enables <1 µs fault detection latency for ASIL-D systems |
| ECC-Protected Memory Subsystem | Full ECC coverage on PFLASH, DFLASH, DSPR, PSPR, LMU, and EMEM prevents silent data corruption in safety-critical code/data |
| Hardware Security Module (HSM) | Optional embedded HSM supports AES-128/256, SHA-256, RSA-2048, and secure boot key management per EVITA Full |
| GTM Autonomous Signal Processing | Offloads CPU for complex PWM generation, sigma-delta decoding, and time-triggered I/O sequencing without software intervention |
| MultiCAN+ with Gateway Mode | Enables seamless CAN FD-to-CAN 2.0 bridging and message filtering across three independent CAN nodes per module |
Applications
| ADAS Domain Controller | Brake-by-Wire ECU |
|---|---|
|
Use Scenario: Centralized sensor fusion unit aggregating camera, radar, and ultrasonic inputs for collision avoidance and automated emergency braking. IC Role / Device Role / Timing Role: Primary compute node executing ASIL-D safety kernels, managing time-synchronized data ingestion via ETH and FlexRay, and orchestrating actuator commands. Use Value: Lockstep CPU and SMU enable deterministic fault handling within 50 µs, meeting ISO 26262 ASIL-D timing constraints for critical braking decisions. |
Use Scenario: Real-time hydraulic pressure control system coordinating four-wheel brake actuators using torque vectoring algorithms. IC Role / Device Role / Timing Role: Safety-certified controller running dual-redundant brake control loops with hardware-isolated PWM outputs (CCU6/GTM) driving IGBT gate drivers. Use Value: ECC-protected 2 MB PFLASH ensures integrity of brake control firmware; GTM-generated PWM with <10 ns jitter guarantees precise solenoid valve timing. |
| Electric Power Steering (EPS) | Vehicle Gateway Module |
|
Use Scenario: High-bandwidth motor position and torque feedback loop for assist torque calculation and road feel emulation. IC Role / Device Role / Timing Role: Real-time motor control processor interfacing with resolver sensors (via SENT), driving 3-phase inverter (via GTM PWM), and communicating over CAN FD. Use Value: 200 MHz TC1.6E core executes FOC algorithms in <5 µs; 4× SENT channels directly digitize resolver analog outputs without external ADC. |
Use Scenario: In-vehicle network bridge translating messages between CAN FD, FlexRay, and Ethernet domains for OTA updates and diagnostics. IC Role / Device Role / Timing Role: Protocol gateway with hardware-accelerated CAN FD/FlexRay/Ethernet packet forwarding and firewall rule enforcement. Use Value: Dual MultiCAN+ modules handle 128 message objects with FIFO buffering; ETH MAC supports 100 Mbps full-duplex for fast firmware downloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200SACKXUMA1 | Same die, but PG-TQFP-144 package (144-pin); no Ethernet MAC or RMII interface | Limited to CAN/FlexRay-only gateways or non-Ethernet ADAS sub-modules | Select when board space constraints favor TQFP or Ethernet is unnecessary |
| TC275TP32F200NACKXUMA1 | Next-generation AURIX™ TC27x; adds 3rd TriCore™ core, 4 MB PFLASH, and enhanced HSM (EVITA Medium) | Required for multi-domain controllers integrating ADAS + powertrain + chassis functions | Select for new designs needing higher compute throughput and extended security certification |
Compared with TC237LP32F200SACKXUMA1, TC234LP32F200SACKXUMA1 sacrifices Ethernet and package I/O count for smaller footprint, while TC275TP32F200NACKXUMA1 delivers scalable performance and security for future-proofed vehicle architectures-neither is pin-compatible, and both require PCB and BOM revision.
Availability
TC237LP32F200SACKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, brake-by-wire ECUs, and electric power steering systems requiring stable component supply and long-term lifecycle assurance.
Supply support for TC237LP32F200SACKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the AURIX™ TC23x family-designed specifically for ISO 26262 ASIL-D automotive safety applications including ADAS, chassis, and powertrain control units.
FAQ
What is the maximum junction temperature rating for TC237LP32F200SACKXUMA1?
The device is rated for operation up to +125°C junction temperature, validated per AEC-Q100 Grade 1 requirements. Thermal design must maintain Tj ≤ 125°C under worst-case ambient (105°C) and power dissipation (2.5 W), using the specified PG-LFBGA-292 thermal pad layout and PCB copper area.
Does TC237LP32F200SACKXUMA1 include hardware-based cryptographic acceleration?
Yes-the optional Hardware Security Module (HSM) variant supports AES-128/256 encryption/decryption, SHA-256 hashing, RSA-2048 signature generation, and secure key storage. HSM operation is isolated from the main CPU and accessible only via dedicated mailbox interfaces defined in the AURIX™ HSM specification.
Can the Ethernet MAC operate in both MII and RMII modes simultaneously?
No-the ETH peripheral supports either MII or RMII physical layer interface configuration, selected at reset via BOOT pins. MII uses 18 pins (TXD0–3, RXD0–3, TX_EN, RX_DV, CRS, COL, REF_CLK), while RMII reduces this to 7 pins (TXD0–1, RXD0–1, TX_EN, CRS_DV, REF_CLK) with shared 50 MHz clock.
How is functional safety compliance implemented in the TC237LP32F200SACKXUMA1?
Safety compliance is achieved through integrated hardware mechanisms: lockstep CPU cores with continuous comparison, SMU monitoring 30+ internal error sources, MTU performing on-demand and startup memory tests, and IOM validating I/O pin states against expected patterns-all documented in Infineon's ISO 26262 ASIL-D ready safety manual (V1.3).
TC237LP32F200SACKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC237LP32F200SACKXUMA1 FAQ
1.How can I place an order for TC237LP32F200SACKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC237LP32F200SACKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC237LP32F200SACKXUMA1 reliable?
The price and inventory of TC237LP32F200SACKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC237LP32F200SACKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC237LP32F200SACKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC237LP32F200SACKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC237LP32F200SACKXUMA1?
TC237LP32F200SACKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC237LP32F200SACKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC237LP32F200SACKXUMA1?
For technical support, including TC237LP32F200SACKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC237LP32F200SACKXUMA1 requirements.
6.How does Aetrix verify that TC237LP32F200SACKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC237LP32F200SACKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC237LP32F200SACKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC237LP32F200SACKXUMA1?
All TC237LP32F200SACKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC237LP32F200SACKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC237LP32F200SACKXUMA1 part is unused and in its original packaging.
Return procedure for TC237LP32F200SACKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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