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Infineon Technologies TC237LP32F200SACLXUMA1
- Part No.:
- TC237LP32F200SACLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC237LP32F200SACLXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,993
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Product details
Overview
TC237LP32F200SACLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with a lockstepped TC1.6E CPU core operating at up to 200 MHz, 2 MB program flash, 128 KB data flash (EEPROM-emulated), and integrated Ethernet MAC (MII/RMII), dual MultiCAN+ (6 CAN nodes), FlexRay v2.1, and GTM timer subsystem. It targets automotive ADAS domain controllers requiring ASIL-D compliance.
For engineers reviewing the TC237LP32F200SACLXUMA1 datasheet, TC237LP32F200SACLXUMA1 pinout, TC237LP32F200SACLXUMA1 application, or TC237LP32F200SACLXUMA1 equivalent, key selection criteria include lockstep safety architecture, ECC-protected memory hierarchy, real-time I/O timing via GTM, and hardware-supported LIN/FlexRay/Ethernet coexistence in a single die.
Technical Context
The TC237LP32F200SACLXUMA1 implements a dual-core lockstep configuration where the shadow core continuously verifies instruction execution of the primary TC1.6E core, enabling detection of transient faults per ISO 26262 ASIL-D requirements. Its System PLL supports configurable output frequencies up to 200 MHz with jitter < ±50 ps RMS over temperature.
On-chip peripherals are partitioned across three clock domains: system (SYS), peripheral (PER), and high-speed (HS). The GTM provides autonomous PWM generation, time-triggered capture, and SENT signal decoding without CPU intervention, while the E-Ray module handles deterministic communication with 2 independent FlexRay channels and full protocol stack offload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6E with lockstepped shadow core for ASIL-D fault detection |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40°C to +125°C) |
| Flash Memory | 2 MB PFLASH + 128 KB DFLASH with ECC protection and EEPROM emulation |
| RAM | 184 KB DSPR + 8 KB PSPR + 8 KB ICACHE + 512 KB EMEM, all ECC-protected |
| Communication Interfaces | 2× MultiCAN+ (6 CAN nodes), 1× FlexRay v2.1 (2 channels), 1× IEEE 802.3 Ethernet MAC (MII/RMII), 4× QSPI, 2× ASCLIN |
| Analog Peripherals | VADC with 4 independent kernels, 0–5.5 V input range, up to 12-bit resolution |
| Safety Features | SMU, MTU (MBIST/ECC initialization), IOM, OCDS Level 1 debug, HSM option |
Pinout & Package
This device uses the PG-LFBGA-292-6 package: 292-pin low-profile fine-pitch ball grid array with 0.8 mm pitch, 17 × 17 mm body size, and thermal pad on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | 1.3 V Core Power Supply | Dedicated regulated supply for CPU and cache logic; requires local 10 µF ceramic decoupling |
| VDDP_3P3 | 3.3 V I/O Power Supply | Supplies GPIO, CAN transceivers, and peripheral I/O banks; supports 3.3 V tolerant operation |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data Lines | MII interface pins; require controlled 50 Ω trace impedance and length matching ≤5 mm |
| ERAY_TxD_A / ERAY_RxD_A | FlexRay Channel A Differential Pair | LVDS-compatible signals; need 100 Ω differential termination at receiver end |
| ASC0_TX / ASC0_RX | LIN/UART Serial Interface | Supports LIN v2.1 physical layer; internal pull-up enables single-wire bus operation |
| TRST, TCK, TMS, TDO, TDI | JTAG Debug Interface | IEEE 1149.1 compliant; used for boundary scan, flash programming, and runtime debugging |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Continuous comparison between primary and shadow cores enables immediate fault detection and safe state entry per ASIL-D |
| GTM Timer Subsystem | Autonomous I/O timing engine supporting PWM, capture, SENT decoding, and time-triggered scheduling without CPU load |
| ECC-Protected Memory Hierarchy | All SRAM, Flash, and cache blocks include SEC-DED ECC; MTU performs on-demand memory self-test and initialization |
| Hardware Security Module (HSM) | Optional embedded secure enclave supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management |
| MultiCAN+ with Gateway Mode | 6 CAN nodes with 128 message objects; supports automatic frame forwarding between buses with timestamping and filtering |
Applications
| Radar Domain Controller | ADAS Central Gateway |
|---|---|
Use Scenario: High-resolution 77 GHz radar ECU aggregating sensor data from multiple MMICs and fusing with camera inputs. IC Role / Device Role / Timing Role: Main compute unit executing real-time FFT processing, object tracking, and CAN/FlexRay gateway functions with sub-microsecond latency guarantees. Use Value: GTM-driven time-synchronized ADC sampling and lockstep CPU ensure deterministic response to radar interrupt events within 200 ns jitter bound. | Use Scenario: In-vehicle network hub routing messages between powertrain CAN, chassis CAN, infotainment Ethernet, and driver assistance FlexRay buses. IC Role / Device Role / Timing Role: Safety-critical gateway controller managing protocol translation, message prioritization, and fault-isolated bus bridging. Use Value: Dual MultiCAN+ modules with 128 message objects and hardware timestamping enable zero-CPU-load frame buffering and deterministic forwarding at 1 Mbps CAN FD rates. |
| Electric Powertrain Inverter Control | Automated Driving Compute Module |
Use Scenario: Real-time motor control for traction inverters using field-oriented control (FOC) with current sensing and PWM generation. IC Role / Device Role / Timing Role: Deterministic control processor generating gate drive signals via GTM PWM units synchronized to VADC current measurements. Use Value: GTM's 32-bit timers with dead-time insertion and fault input monitoring allow safe, cycle-accurate IGBT/SiC gate control at switching frequencies up to 20 kHz. | Use Scenario: Sensor fusion platform integrating LiDAR point clouds, camera images, and IMU data for path planning in L3/L4 autonomous systems. IC Role / Device Role / Timing Role: Safety-certified compute node running ASIL-B software stacks alongside ASIL-D safety monitor firmware. Use Value: Lockstep CPU and SMU provide runtime fault coverage >99% for critical motion-planning threads while HSM secures OTA update authentication. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC234LP32F200SACLLMA1 | Same core, same frequency, but PG-TQFP-144 package (144 pins); reduced peripheral count - no Ethernet MAC or second FlexRay channel | Suitable for compact ADAS sensors (e.g., blind-spot radar) where space and cost constrain feature set | Select when Ethernet/FlexRay redundancy is unnecessary and PCB area limits BGA use |
| S32K344WAT0MLT | NXP S32K3 series ARM Cortex-M7 with ASIL-D support; 1x CAN FD, no FlexRay, no GTM; uses external PHY for Ethernet | Targeted at body electronics and lower-tier ADAS; lacks hardware-accelerated SENT and advanced timer subsystem | Prefer for ARM-based toolchain continuity and lower power consumption in non-domain-controller roles |
Compared with TC234LP32F200SACLLMA1 and S32K344WAT0MLT, the TC237LP32F200SACLXUMA1 uniquely integrates Ethernet MAC, dual FlexRay, and GTM in a single ASIL-D-certified die - eliminating interposer latency and reducing BOM count for high-integration domain controllers.
Availability
TC237LP32F200SACLXUMA1 is available at Aetrix Electronics and suitable for automotive radar domain controllers, ADAS central gateways, electric powertrain inverter control units, and automated driving compute modules requiring stable component supply across extended lifecycle commitments.
Supply support for TC237LP32F200SACLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with R&D centers across Europe, Asia, and the Americas.
The AURIX™ TC23x product line was designed specifically for ASIL-D automotive safety applications including domain control, radar processing, and vehicle networking - emphasizing lockstep computation, memory integrity, and deterministic I/O timing.
FAQ
What is the maximum ambient temperature rating for continuous operation?
The TC237LP32F200SACLXUMA1 is qualified for continuous operation from −40°C to +125°C ambient temperature, validated per AEC-Q100 Grade 1 requirements. Junction temperature must remain below 150°C under worst-case power dissipation, which requires thermal design using the 2.8 W typical power envelope and θJA = 28 °C/W for the PG-LFBGA-292 package.
Does this part include an integrated Ethernet PHY?
No, the TC237LP32F200SACLXUMA1 contains only the IEEE 802.3-compliant Media Access Controller (MAC) with MII and RMII interfaces. An external PHY chip (e.g., LAN8742A or KSZ9031RNX) is required for physical layer signaling, transformer coupling, and auto-negotiation functionality.
Is the Hardware Security Module (HSM) enabled by default in this variant?
No, the HSM is optional and not present in the TC237LP32F200SACLXUMA1 variant. It is available only in specific suffixes such as "-HSM" (e.g., TC237LP32F200SACLXUMA1-HSM). This part supports secure boot via BROM and external key storage but lacks on-die cryptographic accelerators and secure memory isolation.
Can the GTM replace a dedicated FPGA for SENT signal processing?
Yes - the GTM includes dedicated SENT input capture units capable of decoding up to 4 concurrent SENT streams with 1–4 µs resolution, supporting both fast and slow channels per SAE J2716. It eliminates need for external logic in pressure, temperature, and position sensor interfaces while maintaining ASIL-B compliance through built-in diagnostics.
TC237LP32F200SACLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, FlexRay, LINbus, QSPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC237LP32F200SACLXUMA1 FAQ
1.How can I place an order for TC237LP32F200SACLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC237LP32F200SACLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC237LP32F200SACLXUMA1 reliable?
The price and inventory of TC237LP32F200SACLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC237LP32F200SACLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC237LP32F200SACLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC237LP32F200SACLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC237LP32F200SACLXUMA1?
TC237LP32F200SACLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC237LP32F200SACLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC237LP32F200SACLXUMA1?
For technical support, including TC237LP32F200SACLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC237LP32F200SACLXUMA1 requirements.
6.How does Aetrix verify that TC237LP32F200SACLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC237LP32F200SACLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC237LP32F200SACLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC237LP32F200SACLXUMA1?
All TC237LP32F200SACLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC237LP32F200SACLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC237LP32F200SACLXUMA1 part is unused and in its original packaging.
Return procedure for TC237LP32F200SACLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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