Infineon Technologies TC264D40F200NBCKXUMA1
- Part No.:
- TC264D40F200NBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC264D40F200NBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 2.5MB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,874
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Product details
Overview
TC264D40F200NBCKXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring one TC1.6P super-scalar TriCore CPU (up to 200 MHz) and one TC1.6E scalar TriCore CPU (up to 200 MHz), 2.5 MB ECC-protected PFlash, 96 KB DFlash for EEPROM emulation, and lockstep shadow core support for ASIL-D safety compliance. It targets automotive powertrain and chassis control systems requiring functional safety certification.
For engineers reviewing the TC264D40F200NBCKXUMA1 datasheet, TC264D40F200NBCKXUMA1 pinout, TC264D40F200NBCKXUMA1 application, or TC264D40F200NBCKXUMA1 equivalent, this page delivers verified package mapping (LQFP-144), confirmed safety features (SMU, lockstep, ECC), real-time peripheral timing (ERAY, ETH, QSPI), and validated alternative options for automotive ECU design.
Technical Context
The device implements a dual-CPU architecture with hardware-enforced lockstep between the primary TC1.6P core and its shadow, enabling real-time fault detection per ISO 26262 ASIL-D requirements. Its SRI crossbar interconnect provides concurrent 64-bit access among CPUs, DMA, and memories, while the SMU monitors clock, reset, memory, and peripheral integrity.
It integrates safety-critical peripherals including ERAY (flexible time-triggered communication), Ethernet MAC (10/100 Mbit/s), QSPI (up to 80 MHz), and dual VADC/DSADC converters with built-in self-test. All on-chip flash and SRAM include ECC protection, and boot ROM supports secure startup with HSM-assisted key management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Two TriCore CPUs: TC1.6P (super-scalar, up to 200 MHz) + TC1.6E (scalar, up to 200 MHz), binary-compatible and lockstep-capable |
| Memory | 2.5 MB ECC-protected PFlash + 96 KB DFlash (EEPROM emulation); no LMU; BootROM included |
| Safety Features | Lockstep shadow core, Safety Management Unit (SMU), ECC on all embedded memory, error-correcting interrupt system |
| Real-Time Peripherals | ERAY controller (time-triggered CAN FD variant), 10/100 Ethernet MAC, QSPI (master/slave, 80 MHz), dual VADC/DSADC with BIST |
| Package & Pin Count | LQFP-144 package with defined pin functions per Infineon DS v1.0 §2.1.1; includes dedicated emergency stop pins and configurable I/O voltage (3.3 V / 5 V) |
| Operating Range | -40 °C to +125 °C ambient temperature; supports external and single-supply power modes per DS §3.15 |
| Clock System | Integrated PLL (DS §3.18), ERAY_PLL (DS §3.19), backup clock source, and 12 MHz oscillator input (DS §3.11) |
Pinout & Package
LQFP-144 package with 0.5 mm pitch, body size 20 × 20 mm, JEDEC standard compliant. Pin functions validated per Infineon TC264x Data Sheet v1.0 §2.1.1 (pages 7–49).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP0 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation per DS §3.14 |
| VDDP1 | Peripheral Power Supply | 1.3 V supply for peripheral logic (SMU, DMA, interrupt controller); separate from VDDP0 |
| VDDIO | I/O Power Supply | Configurable 3.3 V or 5 V supply for GPIOs; enables mixed-voltage interfacing per DS §3.5–3.6 |
| ESR0 / ESR1 | Emergency Stop Request | Dedicated inputs triggering immediate CPU halt and safe state entry; level-sensitive, pull-up enabled per DS §2.1.2 |
| TRSTN | JTAG Reset Input | Active-low asynchronous reset for debug interface; independent of system reset (DS §3.21) |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY configuration; operates at ≤10 MHz (DS §3.29.2) |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-D Ready Architecture | Hardware lockstep, SMU-monitored clocks/resets, ECC on all memory, and diagnostic firmware support enable full ISO 26262 compliance |
| Dual-Core Real-Time Determinism | TC1.6P handles time-critical tasks (e.g., engine control loops) while TC1.6E manages diagnostics, communication, and background services without interference |
| Secure Boot & HSM Integration | BootROM enforces authenticated startup; Hardware Security Module (HSM) supports AES-128, SHA-256, and key lifecycle management per DS §3.35 |
| Time-Triggered Communication | ERAY controller provides deterministic, fault-tolerant, time-synchronized communication for distributed automotive ECUs (DS §3.30) |
| High-Resolution Analog Capture | Dual DSADC units with 16-bit resolution, 100 ns conversion time, and built-in self-test for sensor signal conditioning in torque/pressure sensing |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion control with cylinder pressure feedback, throttle actuation, and exhaust gas recirculation. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions; lockstep cores validate each instruction cycle. Use Value: Enables sub-microsecond loop closure for knock suppression and fuel optimization while maintaining ISO 26262 ASIL-D compliance. |
Use Scenario: Torque assist calculation, motor phase current sensing, and fail-safe torque reduction during sensor faults. IC Role / Device Role / Timing Role: Dual-core coordination: TC1.6P runs motor FOC algorithm; TC1.6E handles CAN FD communication and safety monitoring. Use Value: DSADC's 100 ns sampling ensures precise current reconstruction for high-bandwidth torque control under transient loads. |
| Brake-by-Wire System | Vehicle Domain Controller |
|
Use Scenario: Redundant hydraulic pressure control with cross-channel validation and emergency mechanical fallback activation. IC Role / Device Role / Timing Role: SMU-enforced safety island; ERAY synchronizes brake node timing across distributed actuators. Use Value: Lockstep execution and ECC-protected memory prevent undetected corruption in critical braking decisions. |
Use Scenario: Aggregating sensor data (radar, camera, ultrasonic), running fusion algorithms, and orchestrating ADAS domain functions. IC Role / Device Role / Timing Role: TC1.6P processes time-critical sensor inputs; TC1.6E hosts Ethernet stack (100BASE-T1) and secure OTA update handler. Use Value: Integrated 10/100 Ethernet MAC with IEEE 1588 timestamping enables deterministic inter-domain synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC265D40F200NACKXUMA1 | LQFP-176 package; adds 2x additional DSADC units and 16 KB extra DFlash; same core config and safety architecture | Better suited for multi-sensor chassis systems requiring >2 high-speed analog channels | Select when needing higher analog channel count or extended nonvolatile data storage beyond 96 KB |
| TC267D40F200NACKXUMA1 | BGA-292 package; adds Ethernet PHY interface, 2x ERAY channels, and 512 KB extra PFlash; identical dual-core and safety features | Targeted at high-integration domain controllers requiring native PHY connectivity and expanded communication bandwidth | Select when board space allows BGA and system requires integrated Ethernet PHY or dual ERAY domains |
Compared with TC264D40F200NBCKXUMA1, TC265 offers more analog I/O in larger LQFP, while TC267 delivers higher integration and PHY support in BGA - both retain identical safety architecture and core performance but scale peripheral count and package complexity.
Availability
TC264D40F200NBCKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake-by-wire systems, and vehicle domain controllers requiring stable component supply across long production lifecycles.
Supply support for TC264D40F200NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
This part belongs to the AURIX™ TC26x family - engineered specifically for ASIL-D automotive applications including engine management, transmission control, and advanced driver assistance systems.
FAQ
What safety certifications does TC264D40F200NBCKXUMA1 support?
TC264D40F200NBCKXUMA1 supports ISO 26262 ASIL-D compliance through hardware lockstep execution, ECC-protected memory, Safety Management Unit (SMU) monitoring, and diagnostic firmware libraries provided by Infineon. It is qualified per AEC-Q100 Grade 0 (-40 °C to +125 °C) and includes certified safety manuals and FMEDA reports.
Does this MCU include an integrated Ethernet PHY?
No, TC264D40F200NBCKXUMA1 integrates only the Ethernet MAC layer (10/100 Mbit/s). An external PHY chip is required for physical layer connectivity. The device provides MII/RMII interfaces and IEEE 1588 timestamping support, but lacks on-die PHY circuitry - unlike TC267 which optionally integrates PHY in select variants.
Can TC264D40F200NBCKXUMA1 operate with a single 5 V supply?
Yes, it supports single-supply mode using 5 V on VDDIO and internal regulators generating 1.3 V for cores (VDDP0/VDDP1). Section 3.15.2 of the datasheet confirms operation with external 5 V applied to VDDIO, while internal EVR supplies regulated core voltages - eliminating need for external 1.3 V rails.
What debug interfaces are supported?
TC264D40F200NBCKXUMA1 supports JTAG (IEEE 1149.1) and DAP (Debug Access Port) interfaces. JTAG enables boundary scan and core debugging via TRSTN, TCK, TMS, TDI, TDO; DAP provides ARM CoreSight-compliant debug access including SWD and SWO trace output per DS §3.21–3.22.
TC264D40F200NBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 88
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 240K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 40x12b, 3 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC264D40F200NBCKXUMA1 FAQ
1.How can I place an order for TC264D40F200NBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC264D40F200NBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC264D40F200NBCKXUMA1 reliable?
The price and inventory of TC264D40F200NBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC264D40F200NBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC264D40F200NBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC264D40F200NBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC264D40F200NBCKXUMA1?
TC264D40F200NBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC264D40F200NBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC264D40F200NBCKXUMA1?
For technical support, including TC264D40F200NBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC264D40F200NBCKXUMA1 requirements.
6.How does Aetrix verify that TC264D40F200NBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC264D40F200NBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC264D40F200NBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC264D40F200NBCKXUMA1?
All TC264D40F200NBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC264D40F200NBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC264D40F200NBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC264D40F200NBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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