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Infineon Technologies TC264D40F200NBCKXUMA2
- Part No.:
- TC264D40F200NBCKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC264D40F200NBCKXUMA2.pdf
- Description:
- IC MCU 32BIT 2.5MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,817
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Product details
Overview
TC264D40F200NBCKXUMA2 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring one high-performance TriCore™ TC1.6P CPU (up to 200 MHz) and one power-efficient TC1.6E CPU, 2.5 MB ECC-protected program flash, 96 KB data flash for EEPROM emulation, and integrated Safety Management Unit (SMU) for ASIL-D compliance. It targets automotive safety-critical applications including electric powertrain control and brake-by-wire systems.
For engineers reviewing the TC264D40F200NBCKXUMA2 datasheet, TC264D40F200NBCKXUMA2 pinout, TC264D40F200NBCKXUMA2 application, or TC264D40F200NBCKXUMA2 equivalent, key selection criteria include dual-core lockstep capability, 200 MHz real-time execution, on-chip ECC memory protection, ERAY and Ethernet interface support, and functional safety certification per ISO 26262.
Technical Context
The TC264D40F200NBCKXUMA2 implements a heterogeneous dual-core architecture: the TC1.6P core delivers deterministic real-time performance with 2 MAC/cycle DSP capability and 120 KB DSPR, while the TC1.6E core provides binary-compatible low-power operation. Both cores share a 64-bit SRI crossbar interconnect and access ECC-protected memories.
It integrates safety-critical peripherals including lockstep-capable ERAY (flexible data-rate automotive bus), IEEE 802.3-compliant Ethernet MAC (10/100 Mbps), and ASCLIN/DSADC modules with built-in diagnostic coverage. The SMU monitors clock, voltage, temperature, and memory integrity to support ASIL-D system-level decomposition.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual TriCore™: TC1.6P (200 MHz, 120 KB DSPR) + TC1.6E (200 MHz, 72 KB DSPR), lockstep-capable for ASIL-D |
| Memory | 2.5 MB PFLASH + 96 KB DFLASH (EEPROM-emulation), all ECC-protected; no LMU; includes BootROM |
| Clock System | Integrated PLL supporting up to 200 MHz core clock; backup clock input; 1.3 V domain EVR regulation |
| Safety Features | Safety Management Unit (SMU), ECC on all SRAM/Flash, lockstep CPU monitoring, memory BIST, and error injection test support |
| Communication | ERAY controller (flexray-compatible), 10/100 Ethernet MAC, 6x ASCLIN (UART/SPI/LIN), 2x I²C, QSPI, MSC |
| Analog Peripherals | 2x VADC (12-bit, 16-channel), 2x DSADC (24-bit sigma-delta, 4-channel), temperature sensor, 5 V/3.3 V switchable I/O pads |
Pinout & Package
This device is packaged in LQFP144 (144-pin Low-Profile Quad Flat Package) with 0.5 mm pitch, body size 20 × 20 mm, and exposed thermal pad. Pin functions are defined per Infineon's TC264x Pin Definition and Functions documentation (Section 2.1.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Core Power Supply | 1.3 V supply for CPU, cache, and SRI; requires local decoupling for noise immunity in safety-critical operation |
| VDDIO | I/O Power Supply | 3.3 V or 5 V selectable per pad group; enables mixed-voltage interfacing with legacy automotive sensors and actuators |
| ERAY_TX / ERAY_RX | FlexRay Physical Interface | Differential pair supporting 10 Mbit/s FlexRay communication with built-in bus guardian and protocol acceleration |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC interface for PHY configuration and status monitoring in AUTOSAR-compliant networks |
| ASCLIN0_TX / ASCLIN0_RX | Asynchronous Serial Communication | Full-duplex UART channel supporting LIN 2.2, UART, and SPI master/slave modes with hardware CRC and DMA trigger |
| TRSTN | JTAG Debug Reset | Active-low asynchronous reset for debug interface; independent of system reset to enable safe post-failure debugging |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep operation | TC1.6P core runs in lockstep with shadow core for real-time fault detection, enabling ASIL-D decomposition without external checker IC |
| ECC-protected memory subsystem | All embedded Flash and SRAM include single-bit error correction and double-bit error detection-required for ISO 26262 FMEDA compliance |
| Integrated Safety Management Unit (SMU) | Hardware-monitored clock supervision, voltage monitoring, temperature sensing, and memory BIST with configurable error response (interrupt, trap, or reset) |
| ERAY controller with bus guardian | On-chip FlexRay protocol engine with time-triggered scheduling, dynamic segment support, and hardware-enforced timing guardbanding |
| High-resolution DSADC | Two 24-bit sigma-delta ADCs with 4-channel simultaneous sampling, ideal for motor current sensing and torque estimation in e-drive inverters |
Applications
| Electric Powertrain Control | Brake-by-Wire Systems |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive control in 400 V/800 V traction inverters. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with <1 µs jitter on PWM outputs. Use Value: Dual-core lockstep and DSADC enable precise current loop closure at >20 kHz with full fault coverage per ISO 26262 Part 6. |
Use Scenario: Redundant hydraulic pressure modulation and fail-operational braking actuation. IC Role / Device Role / Timing Role: Master controller managing dual independent brake channels with synchronized ERAY communication to wheel modules. Use Value: Integrated SMU and ERAY bus guardian ensure deterministic response within 5 ms during fault conditions per ISO 26262 ASIL-D requirements. |
| ADAS Domain Controller | Vehicle Gateway Module |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for Level 2+ autonomy. IC Role / Device Role / Timing Role: High-bandwidth data aggregator using Ethernet MAC and QSPI to offload vision processing to companion SoC. Use Value: 100 Mbps Ethernet interface and 64-bit SRI interconnect sustain >800 MB/s internal bandwidth for time-synchronized sensor streaming. |
Use Scenario: Secure CAN-FD to Ethernet bridging between chassis, infotainment, and OTA update domains. IC Role / Device Role / Timing Role: Firewall-enabled gateway processor enforcing message filtering, authentication, and rate limiting across protocols. Use Value: Hardware-accelerated crypto engine (AES-128/SHA-256) and isolated memory partitions prevent lateral attack propagation in multi-domain architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC265D40F200NACKXUMA2 | LQFP176 package; adds 2x additional ASCLIN, 1x extra DSADC, and extended temperature range (−40°C to +150°C) | Better suited for under-hood applications requiring higher ambient tolerance and expanded peripheral count | Select when needing >144 pins or extended junction temperature rating beyond TC264's −40°C to +125°C spec |
| TC275T64F200NACKXUMA2 | Higher integration: 4 MB PFLASH, 192 KB DFLASH, added HSM security module, and enhanced Ethernet (TSN-ready) | Targeted at zonal architecture controllers requiring secure OTA updates and time-sensitive networking | Choose for next-gen E/E architectures requiring HSM-based secure boot and IEEE 802.1AS timestamping |
Compared with TC264D40F200NBCKXUMA2, the TC265 offers pin-count and thermal headroom for complex under-hood designs, while the TC275 delivers scalable security and TSN readiness for software-defined vehicle platforms-neither is pin-compatible, but both share TriCore™ toolchain and AUTOSAR stack compatibility.
Availability
TC264D40F200NBCKXUMA2 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain controllers, and vehicle gateway modules requiring stable component supply across automotive production lifecycles.
Supply support for TC264D40F200NBCKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
The AURIX™ TC26x product line was designed specifically for ASIL-D automotive safety applications-including powertrain, chassis, and advanced driver assistance-combining dual TriCore™ CPUs, hardware safety mechanisms, and automotive-grade peripheral sets.
FAQ
What is the maximum operating temperature range for TC264D40F200NBCKXUMA2?
The TC264D40F200NBCKXUMA2 is rated for operation from −40°C to +125°C ambient temperature, with junction temperature limits defined in Section 3.4 of the 2017 datasheet. This range supports placement in engine compartment-adjacent locations such as transmission control units and battery management interfaces, provided board-level thermal design maintains case-to-ambient ΔT within specification.
Does TC264D40F200NBCKXUMA2 support AUTOSAR OS and MCAL drivers?
Yes-Infineon provides certified AUTOSAR 4.2.2 and 4.3.1 MCAL drivers (including DIO, PORT, ICU, GPT, PWM, ADC, SPI, ETH, ERAY) and compatible OS configurations through the AURIX Development Studio. These drivers are validated against the TC264 hardware revision and support both single-core and lockstep execution modes required for ASIL-D integration.
How is functional safety certification documented for this part?
TC264D40F200NBCKXUMA2 is qualified per AEC-Q100 Grade 1 and supports ISO 26262 ASIL-D at the system level when used with recommended safety mechanisms (e.g., lockstep, ECC, SMU). Infineon provides a Functional Safety Manual (FSM), Safety Analysis Report (SAR), and FMEDA data-available under NDA via Infineon's SafeAssure program-not embedded in the public datasheet.
Can the DSADC modules perform simultaneous sampling across all channels?
Each DSADC unit supports true simultaneous sampling on its four dedicated input channels, with independent programmable oversampling ratios (up to 1024×) and hardware-accelerated sinc³ filtering. The two DSADC blocks can be triggered synchronously via shared timer events, enabling coordinated current sensing across dual-motor or three-phase inverter topologies without software coordination overhead.
TC264D40F200NBCKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 88
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 240K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 48x12b SAR, 3 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC264D40F200NBCKXUMA2 FAQ
1.How can I place an order for TC264D40F200NBCKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC264D40F200NBCKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC264D40F200NBCKXUMA2 reliable?
The price and inventory of TC264D40F200NBCKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC264D40F200NBCKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC264D40F200NBCKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC264D40F200NBCKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC264D40F200NBCKXUMA2?
TC264D40F200NBCKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC264D40F200NBCKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC264D40F200NBCKXUMA2?
For technical support, including TC264D40F200NBCKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC264D40F200NBCKXUMA2 requirements.
6.How does Aetrix verify that TC264D40F200NBCKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC264D40F200NBCKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC264D40F200NBCKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC264D40F200NBCKXUMA2?
All TC264D40F200NBCKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC264D40F200NBCKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC264D40F200NBCKXUMA2 part is unused and in its original packaging.
Return procedure for TC264D40F200NBCKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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