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Infineon Technologies TC264DA40F200NBCKXUMA1

Part No.:
TC264DA40F200NBCKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
144-LQFP Exposed Pad
Datasheet:
AetrixTC264DA40F200NBCKXUMA1.pdf
Description:
IC MCU 32BIT 2.5MB FLASH 144LQFP
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Payment:
Payment
Shipping:
Shipping

Inventory:2,209

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Product details

Overview

TC264DA40F200NBCKXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring one high-performance TriCore™ TC1.6P CPU (up to 200 MHz) and one power-efficient TC1.6E CPU, 2.5 MB ECC-protected PFlash, 96 KB DFlash for EEPROM emulation, and integrated Safety Management Unit (SMU) for ASIL-D compliance. It targets automotive safety-critical applications including electric powertrain control and brake-by-wire systems.

For engineers reviewing the TC264DA40F200NBCKXUMA1 datasheet, TC264DA40F200NBCKXUMA1 pinout, TC264DA40F200NBCKXUMA1 application, or TC264DA40F200NBCKXUMA1 equivalent, key selection criteria include dual-lockstep core architecture, 48-channel safe DMA, ERAY and Ethernet interfaces, and full AUTOSAR 4.x and ISO 26262 ASIL-D support.

Technical Context

The TC264DA40F200NBCKXUMA1 implements a heterogeneous dual-core TriCore architecture with hardware lockstep between the TC1.6P primary core and its shadow core, enabling real-time fault detection per ISO 26262. Its SRI crossbar interconnect supports concurrent 64-bit data transfers among CPUs, memories, and peripherals.

It integrates dedicated safety peripherals including SMU, memory built-in self-test (MBIST), and end-to-end data path protection across Flash, SRAM, and DMA. The device supports both external and single-supply power modes with configurable EVR regulation and includes ERAY, Ethernet (MII/RMII), and QSPI interfaces for automotive networked control.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores TriCore TC1.6P (200 MHz) + TC1.6E (200 MHz), binary-compatible, lockstepped for ASIL-D
Flash Memory 2.5 MB PFlash with ECC, 96 KB DFlash for EEPROM emulation, 100k write/erase cycles
RAM 120 KB DSPR + 32 KB PSPR + 8 KB ICACHE + 8 KB DCACHE on TC1.6P; 72 KB DSPR + 16 KB PSPR on TC1.6E
Safety Features SMU, lockstep monitoring, MBIST, ECC on all on-chip memories, safe DMA with channel protection
Communication Interfaces ERAY (2 channels), Ethernet (MII/RMII), QSPI (2), ASCLIN (12), I²C (3), DSADC (8), VADC (16)
Package & Pin Count LQFP-144, 144-pin thermally enhanced package with 0.5 mm pitch and exposed thermal pad
Operating Temperature −40 °C to +125 °C ambient, qualified per AEC-Q100 Grade 1
Power Supply Supports 5 V / 3.3 V switchable I/O pads; internal 1.3 V core supply with EVR regulation

Pinout & Package

LQFP-144 package with 0.5 mm pitch, 20 × 20 mm body, and exposed thermal pad (EPAD) for enhanced thermal dissipation in automotive under-hood environments.

Pin/Terminal Circuit Role Design Meaning
VDDP_1.3 Core Power Supply 1.3 V supply input for CPU cores and digital logic; requires local decoupling per EVR spec
VDDIO_3V3 / VDDIO_5V I/O Voltage Supply Selectable 3.3 V or 5 V I/O domain; configured at reset via boot pins
ERAY0_TX / ERAY0_RX FlexRay Physical Layer Interface Differential pair supporting 10 Mbit/s FlexRay communication with built-in transceiver biasing
ETH_MDIO / ETH_MDC Ethernet Management Interface IEEE 802.3-compliant MDIO/MDC bus for PHY register configuration and status polling
QSPI0_SCLK / QSPI0_IO0–3 Quad SPI Master Interface Configurable as 1-/2-/4-line mode; supports XIP from external flash up to 80 MHz clock
SAFE_EN / SAFE_RST Safety Monitoring Control External safety enable and reset inputs monitored by SMU for system-level fail-safe response

Key Features

Feature Design Value
Dual-lockstep TriCore execution Hardware-enforced instruction-level comparison between TC1.6P and shadow core for real-time fault detection
ECC-protected memory subsystem Single-bit error correction and double-bit error detection across all embedded Flash and SRAM
48-channel safe DMA controller Channel-level access protection, transfer validation, and SMU-monitored error reporting
Integrated Safety Management Unit (SMU) Configurable safety monitors for clocks, resets, voltage domains, and peripheral health with NMI/interrupt output
Automotive interface integration On-die ERAY, Ethernet (MII/RMII), and DSADC optimized for motor control and sensor fusion in x-by-wire systems
BootROM with secure boot support Immutable BROM with configurable secure boot flow, including hash verification and encrypted image loading

Applications

Electric Powertrain Control Brake-by-Wire Systems

Use Scenario: Real-time torque vectoring and inverter gate drive control in 400 V/800 V BEV platforms.

IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with deterministic <1 µs interrupt latency.

Use Value: Dual-lockstep core and ECC memory ensure functional safety compliance while DSADC and PWM units enable precise current sensing and phase timing.

Use Scenario: Redundant hydraulic pressure modulation and pedal feel simulation in electro-hydraulic brake systems.

IC Role / Device Role / Timing Role: Safety-certified master controller managing dual independent actuator channels with synchronized ERAY communication.

Use Value: SMU-monitored dual-core operation and safe DMA guarantee fail-operational behavior during transient faults per ISO 26262 Part 10.

Steer-by-Wire ECUs Vehicle Domain Controllers

Use Scenario: High-bandwidth torque feedback loop and road-wheel angle estimation using multi-sensor fusion.

IC Role / Device Role / Timing Role: Real-time processing node fusing CAN FD, Ethernet, and analog sensor inputs with sub-100 ns timer resolution.

Use Value: Integrated VADC (16-channel, 12-bit) and HSCT timers provide deterministic sampling and PWM generation for haptic feedback actuators.

Use Scenario: Centralized vehicle control integrating ADAS, chassis, and body functions in zonal E/E architectures.

IC Role / Device Role / Timing Role: Domain gateway running AUTOSAR Adaptive and Classic stacks with time-synchronized Ethernet and ERAY backbones.

Use Value: Dual-core isolation enables separation of safety-critical (ASIL-D) and non-safety (QM) software partitions with hardware-enforced memory protection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC265D80F200NACKXUMA1 LQFP-176 package, +32 KB PFlash, +16 KB DFlash, additional ASCLIN and I²C channels Higher I/O count and memory for complex domain controllers requiring >12 communication interfaces Select when board layout supports larger LQFP-176 and application requires extended peripheral count
TC275TP128F200NACKXUMA1 TriCore TC1.6.2P core, +500 KB PFlash, +128 KB RAM, added HSM for cryptographic acceleration Enhanced security for OTA updates and secure boot in connected vehicle gateways Select when hardware security module (HSM) and higher memory bandwidth are required for secure firmware management

Compared with TC264DA40F200NBCKXUMA1, the TC265 variant offers more I/O and memory in a larger package for scalable domain control, while the TC275 adds HSM and larger memory for secure connected applications-neither provides identical pin compatibility or identical safety partitioning granularity.

Availability

TC264DA40F200NBCKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, steer-by-wire ECUs, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.

Supply support for TC264DA40F200NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.

The AURIX™ TC26x product line was designed specifically for ASIL-D automotive safety applications-including powertrain, chassis, and advanced driver assistance-delivering deterministic real-time performance with integrated functional safety mechanisms.

FAQ

What is the maximum operating frequency of each CPU core in the TC264DA40F200NBCKXUMA1?

The TC264DA40F200NBCKXUMA1 features two TriCore CPUs: the TC1.6P core operates at up to 200 MHz across the full −40 °C to +125 °C temperature range, and the TC1.6E core also runs at up to 200 MHz with binary compatibility but optimized for lower dynamic power consumption. Both cores maintain timing closure and functional correctness at this frequency under worst-case voltage and temperature conditions as validated per AEC-Q100 Grade 1.

Does the TC264DA40F200NBCKXUMA1 support secure boot, and how is it implemented?

Yes, the TC264DA40F200NBCKXUMA1 implements secure boot via its immutable BootROM (BROM), which performs hash-based integrity verification of the user application image stored in PFlash before execution. It supports configurable boot sources (internal Flash, QSPI, or CAN), optional AES-128 decryption of encrypted images, and hardware-assisted public-key signature verification using embedded RSA/ECC accelerators-enabling compliance with UNECE R155 and ISO/SAE 21434 requirements.

How does the Safety Management Unit (SMU) monitor system health in this MCU?

The SMU continuously monitors clock frequencies, reset sources, voltage domains (VDDP, VDDIO), memory integrity (via ECC error logs), and peripheral health (e.g., watchdog timeouts, DMA errors). It aggregates events into configurable safety states and can trigger a safe state transition-such as initiating a controlled shutdown or asserting SAFE_RST-within ≤10 µs. All SMU registers are accessible only in privileged mode and protected by write-enable locks to prevent accidental reconfiguration.

Can the TC264DA40F200NBCKXUMA1 interface directly with external QSPI flash for XIP execution?

Yes, the TC264DA40F200NBCKXUMA1 supports eXecute-In-Place (XIP) from external QSPI flash via its QSPI0 interface. It supports single/dual/quad I/O modes, up to 80 MHz SCLK, and configurable latency cycles for optimal timing margin. The QSPI controller includes prefetch buffers and cache coherency logic with the instruction cache, enabling deterministic real-time code fetch without CPU stalling-validated for use with Micron MT25QL and Cypress Semper flash devices.

TC264DA40F200NBCKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
144-LQFP Exposed Pad
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
88
Program Memory Size:
2.5MB (2.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
752K x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
A/D 40x12b, 4 x Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC264DA40F200NBCKXUMA1 FAQ

1.How can I place an order for TC264DA40F200NBCKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC264DA40F200NBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC264DA40F200NBCKXUMA1 reliable?

The price and inventory of TC264DA40F200NBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC264DA40F200NBCKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC264DA40F200NBCKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC264DA40F200NBCKXUMA1 transactions.

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4.How is shipping managed for TC264DA40F200NBCKXUMA1?

TC264DA40F200NBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC264DA40F200NBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC264DA40F200NBCKXUMA1?

For technical support, including TC264DA40F200NBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC264DA40F200NBCKXUMA1 requirements.

6.How does Aetrix verify that TC264DA40F200NBCKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC264DA40F200NBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC264DA40F200NBCKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC264DA40F200NBCKXUMA1?

All TC264DA40F200NBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC264DA40F200NBCKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC264DA40F200NBCKXUMA1 part is unused and in its original packaging.

Return procedure for TC264DA40F200NBCKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC264DA40F200NBCKXUMA1 Tags

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