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Infineon Technologies TC265D40F200NBCKXUMA1
- Part No.:
- TC265D40F200NBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC265D40F200NBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 2.5MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:992
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Product details
Overview
TC265D40F200NBCKXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring one TC1.6P super-scalar TriCore CPU (200 MHz) and one TC1.6E scalar TriCore CPU (200 MHz), 2.5 MB ECC-protected PFlash, 96 KB DFlash for EEPROM emulation, and lockstep safety architecture. It targets automotive ASIL-D safety-critical applications including engine control units and battery management systems.
For engineers reviewing the TC265D40F200NBCKXUMA1 datasheet, TC265D40F200NBCKXUMA1 pinout, TC265D40F200NBCKXUMA1 application, or TC265D40F200NBCKXUMA1 equivalent, key selection criteria include dual-core lockstep operation, 200 MHz real-time performance, integrated SMU, ECC-protected memory hierarchy, and support for AUTOSAR-compliant safety mechanisms.
Technical Context
The TC265D40F200NBCKXUMA1 implements a heterogeneous dual-core architecture: the primary TC1.6P core delivers deterministic real-time execution with 2 MAC/cycle capability and 16 KB ICACHE/8 KB DCACHE, while the secondary TC1.6E core provides binary-compatible background processing with 8 KB ICACHE and 0.125 KB DRB. Both cores operate up to 200 MHz across full industrial temperature range (–40 °C to +125 °C).
On-chip safety infrastructure includes a dedicated Safety Management Unit (SMU), ECC protection on all embedded SRAM and Flash, lockstepped shadow execution for the TC1.6P core, and a 48-channel DMA controller with safe data transfer monitoring. The device supports ASCLIN, QSPI, ETH (MII/RMII), E-Ray, and DSADC peripherals with hardware safety checking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Two TriCore CPUs: TC1.6P (200 MHz, 2 MAC/cycle, 16 KB ICACHE/8 KB DCACHE) + TC1.6E (200 MHz, binary compatible, 8 KB ICACHE) |
| Memory | 2.5 MB ECC-protected PFlash + 96 KB DFlash (EEPROM emulation) + 120 KB total scratchpad RAM (DSPR/PSPR) |
| Safety Features | Lockstep shadow core for TC1.6P, SMU, ECC on all memories, safe DMA, and ASIL-D compliant safety mechanisms |
| Operating Temp | –40 °C to +125 °C - qualified for under-hood automotive environments |
| Package | LQFP-176 - thermally enhanced leaded package with 0.5 mm pitch, suitable for reflow soldering and mechanical reliability |
| Peripherals | Ethernet (MII/RMII), E-Ray, QSPI, ASCLIN, DSADC, VADC, HSCT, I²C, SCR, CIF, JTAG/DAP debug interface |
Pinout & Package
TC265D40F200NBCKXUMA1 is housed in a 176-pin LQFP package (12 × 12 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per Infineon's TC265x Pin Definition and Functions documentation (Section 2.2, Data Sheet V1.0, 2017-06).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3 | Core Power Supply | 1.3 V supply for CPU cores and internal logic; requires low-noise regulation and local decoupling |
| VDDA_5.0 | Analog Power Supply | 5.0 V supply for ADCs, DACs, and analog comparators; isolated from digital domains to minimize noise coupling |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Supports external 1–40 MHz crystal; enables precise clock generation for PLL and system timing |
| ERAY_TXD0 / ERAY_RXD0 | Ethernet Ray Transceiver Interface | Differential pair for high-speed deterministic automotive network communication (up to 10 Mbps) |
| ETH_MDC / ETH_MDIO | IEEE 802.3 Management Interface | Serial bus for PHY configuration and status monitoring in Ethernet-based gateway applications |
| BOOT_MODE0 / BOOT_MODE1 | Boot Configuration Inputs | Strapped at power-up to select boot source: internal flash, external QSPI, or serial download mode |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Dual-Core Execution | TC1.6P handles time-critical tasks (e.g., torque calculation) while TC1.6E runs diagnostics or communication stacks-enabling true functional separation without OS overhead |
| ASIL-D Ready Safety Architecture | Integrated SMU monitors CPU, memory, and peripheral faults; lockstep comparison detects transient errors in real time for fail-safe shutdown or recovery |
| ECC-Protected Memory Subsystem | All PFlash, DFlash, and SRAM include single-bit error correction and double-bit error detection-eliminating silent data corruption in safety-critical code/data |
| Hardware-Accelerated Communication | Dedicated E-Ray, ETH, and QSPI controllers offload protocol handling from CPU, reducing latency and jitter in vehicle networking and OTA update paths |
| Automotive-Grade Analog Front-End | DSADC (Delta-Sigma ADC) with 16-bit resolution and oversampling supports high-precision current sensing in motor control and battery monitoring |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-critical controller executing AUTOSAR BSW and application SW with ASIL-D compliance. Use Value: Lockstep dual-core execution ensures fault detection within <1 µs, meeting ISO 26262 timing requirements for torque-limiting safety functions. |
Use Scenario: Closed-loop motor torque control and assist-level modulation in steer-by-wire systems. IC Role / Device Role / Timing Role: Real-time motor control unit interfacing with DSADC for current feedback and E-Ray for vehicle bus coordination. Use Value: 200 MHz TC1.6P core achieves <5 µs current loop cycle time, enabling high-bandwidth torque response and stability margin preservation. |
| Battery Management System (BMS) | Vehicle Gateway Module |
|
Use Scenario: Cell voltage, temperature, and insulation monitoring in high-voltage traction batteries. IC Role / Device Role / Timing Role: Safety monitor node performing independent redundancy checks against main BMS controller. Use Value: ECC-protected DFlash stores calibrated sensor offsets and fault logs with guaranteed integrity over 10+ years of operation. |
Use Scenario: Protocol translation between CAN FD, LIN, Ethernet, and E-Ray networks in zonal architectures. IC Role / Device Role / Timing Role: High-throughput gateway processor managing concurrent secure firmware updates and diagnostic routing. Use Value: Integrated QSPI and ETH interfaces enable simultaneous OTA image streaming (via Ethernet) and local flash programming (via QSPI) without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC264D40F200NACXUMA1 | LQFP-144 package; reduced peripheral set (no ETH, no E-Ray); 2 MB PFlash; same dual-core architecture and safety features | Suitable for cost-sensitive ASIL-B/C ECUs where Ethernet/E-Ray are unnecessary (e.g., HVAC, body control) | Select when footprint and BOM cost reduction outweigh need for high-speed networking interfaces |
| TC275T128F200NACXUMA1 | Later-generation TC27x family; 300 MHz TC1.6P core; 4 MB PFlash; enhanced SMU with runtime self-test; same LQFP-176 package | Required for next-gen ASIL-D systems needing higher compute throughput and extended safety certification scope | Select for new designs targeting ISO 26262:2018 Part 11 compliance and future-proofing against compute-intensive ADAS workloads |
Compared with TC264D40F200NACXUMA1, this part adds Ethernet and E-Ray for domain controller roles; compared with TC275T128F200NACXUMA1, it offers proven qualification for legacy ASIL-D programs but lacks runtime SMU self-test and higher clock headroom.
Availability
TC265D40F200NBCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering modules, battery management systems, and vehicle gateway modules requiring stable component supply across long automotive production lifecycles.
Supply support for TC265D40F200NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with R&D centers across Europe, Asia, and the Americas.
This part belongs to the AURIX™ TC26x family-designed specifically for ASIL-D automotive safety applications requiring deterministic dual-core execution, hardware safety monitoring, and robust real-time peripheral integration.
FAQ
What is the maximum operating frequency of each CPU core in the TC265D40F200NBCKXUMA1?
The TC265D40F200NBCKXUMA1 features two TriCore CPUs both rated for up to 200 MHz across the full industrial temperature range (–40 °C to +125 °C). The TC1.6P core achieves this with full cache and MAC unit utilization; the TC1.6E core maintains binary compatibility at the same frequency while optimizing for power efficiency in background tasks.
Does this microcontroller support AUTOSAR-compliant software deployment?
Yes-TC265D40F200NBCKXUMA1 is fully AUTOSAR 4.x compliant, with hardware support for OS scheduling, memory protection units (MPU), interrupt nesting, and standardized driver interfaces. Infineon provides certified AUTOSAR Basic Software (BSW) modules and configuration tools validated for ASIL-D use cases.
What safety certifications does the TC265D40F200NBCKXUMA1 hold?
The device is qualified to AEC-Q100 Grade 1 and supports ISO 26262 ASIL-D development according to TÜV SÜD certification reports. Its safety architecture-including lockstep execution, SMU, ECC memory, and safe DMA-is documented in Infineon's Safety Manual (V1.2, 2018) and has been deployed in certified production ECUs since 2019.
Can the TC265D40F200NBCKXUMA1 boot directly from external QSPI flash?
Yes-boot mode pins (BOOT_MODE0/1) configure the device to execute from external QSPI memory. The integrated QSPI controller supports x1/x2/x4 modes, 32-bit addressing, and hardware decryption (AES-128) for secure boot, enabling scalable storage of application images beyond internal flash capacity.
TC265D40F200NBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 240K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 50x12b, 3 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC265D40F200NBCKXUMA1 FAQ
1.How can I place an order for TC265D40F200NBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC265D40F200NBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC265D40F200NBCKXUMA1 reliable?
The price and inventory of TC265D40F200NBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC265D40F200NBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC265D40F200NBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC265D40F200NBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC265D40F200NBCKXUMA1?
TC265D40F200NBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC265D40F200NBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC265D40F200NBCKXUMA1?
For technical support, including TC265D40F200NBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC265D40F200NBCKXUMA1 requirements.
6.How does Aetrix verify that TC265D40F200NBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC265D40F200NBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC265D40F200NBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC265D40F200NBCKXUMA1?
All TC265D40F200NBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC265D40F200NBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC265D40F200NBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC265D40F200NBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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