Infineon Technologies TC265D40F200WBBKXUMA1
- Part No.:
- TC265D40F200WBBKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC265D40F200WBBKXUMA1.pdf
- Description:
- IC MCU 32BIT 2.5MB FLASH 176LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,999
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC265D40F200WBBKXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring one TC1.6P super-scalar TriCore CPU (200 MHz) and one TC1.6E scalar TriCore CPU (200 MHz), 2.5 MB ECC-protected PFlash, 96 KB DFlash for EEPROM emulation, and integrated Safety Management Unit (SMU). It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC265D40F200WBBKXUMA1 datasheet, TC265D40F200WBBKXUMA1 pinout, TC265D40F200WBBKXUMA1 application, or TC265D40F200WBBKXUMA1 equivalent, key selection criteria include dual-lockstep-capable CPU architecture, ASIL-D compliance support, ERAY/ETH/DSADC peripheral integration, and LQFP176 package with 176 pins and 5 V/3.3 V switchable I/O capability.
Technical Context
The TC265D40F200WBBKXUMA1 implements a heterogeneous dual-core architecture: the primary TC1.6P core delivers real-time deterministic execution with 2 MAC/cycle DSP capability and 120 KB DSPR, while the TC1.6E shadow core provides binary-compatible redundancy and safety monitoring. Both cores operate up to 200 MHz across full industrial temperature range (–40 °C to +125 °C).
On-chip memory subsystem includes 2.5 MB program flash with ECC, 96 KB data flash supporting EEPROM emulation, and multiple scratchpad RAMs (DSPR/PSPR) with ECC protection. Peripheral set includes ERAY (flexible high-speed automotive bus), Ethernet MAC (10/100 Mbit/s), DSADC (16-bit, 2 Msps), and 48-channel safety DMA with error detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual TriCore: TC1.6P (200 MHz, 120 KB DSPR) + TC1.6E (200 MHz, 72 KB DSPR), lockstep-capable for ASIL-D |
| Flash Memory | 2.5 MB PFlash (ECC-protected) + 96 KB DFlash (EEPROM emulation) |
| Operating Voltage | 5 V / 3.3 V switchable I/O pads; core supply 1.3 V (regulated on-chip) |
| Peripheral Interfaces | ERAY (100 Mbit/s), Ethernet (MII/RMII), DSADC (2 Msps, 16-bit), QSPI, ASCLIN, I²C, SCI |
| Package & Pins | LQFP176, 176-pin quad flat pack with exposed thermal pad; 144 user I/Os |
| Safety Features | Safety Management Unit (SMU), ECC on all SRAM/Flash, lockstep CPU monitoring, BIST, safe DMA |
Pinout & Package
TC265D40F200WBBKXUMA1 is housed in a 176-pin LQFP package (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad for enhanced thermal dissipation in automotive ECU environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3V | Core Power Supply | 1.3 V regulated supply input for CPU and logic; requires local decoupling |
| VDDIO_5V / VDDIO_3V3 | I/O Supply Selector | Selects 5 V or 3.3 V operation for associated I/O banks via external configuration |
| ERAY_TX / ERAY_RX | ERAY Physical Layer Interface | Differential pair supporting 100 Mbit/s automotive time-triggered communication |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY register access and configuration |
| DSADC0_CH0 / DSADC0_CH1 | Delta-Sigma ADC Input Channels | High-precision analog inputs supporting 16-bit resolution at 2 Msps sampling rate |
Key Features
| Feature | Design Value |
|---|---|
| Dual TriCore Architecture | Heterogeneous pairing of TC1.6P (performance) and TC1.6E (safety monitor) enables ASIL-D decomposition per ISO 26262 |
| ECC-Protected Memory Subsystem | Full ECC coverage on PFlash, DFlash, DSPR, PSPR, and cache ensures single-bit correction/double-bit detection in safety-critical code/data |
| Integrated Safety Management Unit (SMU) | Hardware-based fault collection, classification, and response coordination for CPU, memory, and peripheral errors |
| ERAY Communication Controller | Dedicated hardware accelerator supporting time-triggered, deterministic, fault-tolerant communication for x-by-wire systems |
| DSADC with Oversampling | 16-bit delta-sigma ADC with configurable oversampling ratio up to 128×, enabling >18-bit effective resolution for motor current sensing |
Applications
| Electric Powertrain Inverter Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and PWM generation for 3-phase traction inverters in BEV powertrains. IC Role / Device Role / Timing Role: Primary real-time controller executing FOC algorithms, gate driver interface, and functional safety monitoring. Use Value: Dual-core lockstep execution and DSADC oversampling enable <1 µs current loop closure and ASIL-D compliance per ISO 26262 Part 6. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for automated emergency braking (AEB). IC Role / Device Role / Timing Role: Central safety processor managing time-triggered task scheduling, inter-ECU communication via ERAY/Ethernet, and fail-safe state management. Use Value: Integrated SMU and ECC-protected memory ensure deterministic fault handling and diagnostic coverage >99% for ASIL-D system-level requirements. |
| Brake-by-Wire Control Unit | Chassis Domain Controller |
|
Use Scenario: Redundant actuation control for electro-hydraulic brake systems requiring dual independent control paths. IC Role / Device Role / Timing Role: Dual-lockstep TriCore cores execute parallel brake pressure calculations with cross-checking; ERAY handles distributed actuator commands. Use Value: Hardware-supported lockstep comparison and SMU-triggered fail-safe transitions meet ASIL-D fault reaction time <10 ms. |
Use Scenario: Integrated chassis control coordinating suspension damping, steering angle, and yaw stability across multiple vehicle domains. IC Role / Device Role / Timing Role: High-bandwidth interconnect via SRI crossbar enables concurrent access to DSADC, ETH, and QSPI peripherals for multi-sensor data ingestion. Use Value: 2.5 MB PFlash supports over-the-air (OTA) update partitioning with secure boot and rollback protection for field-deployed ECUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC264D40F200WBBKXUMA1 | LQFP144 package (144 pins), reduced peripheral count: no Ethernet MAC, no DSADC, only 1.5 MB PFlash | Suitable for mid-tier ADAS sensors or gateway modules where Ethernet and high-res ADC are not required | Select when footprint, cost, and peripheral scalability are prioritized over ASIL-D domain controller capability |
| TC267B40F200WBBKXUMA1 | BGA292 package (292 pins), adds second Ethernet port, additional DSADC units, and 3.5 MB PFlash | Targeted at zonal controllers or central compute units requiring higher I/O density and dual-network redundancy | Select when board space allows BGA, and dual Ethernet/expanded sensor fusion is mandatory |
Compared with TC264D40F200WBBKXUMA1, this part adds Ethernet and DSADC for domain-level control; compared with TC267B40F200WBBKXUMA1, it trades pin count and flash capacity for LQFP manufacturability and thermal performance in constrained ECU envelopes.
Availability
TC265D40F200WBBKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, ADAS domain controllers, brake-by-wire systems, and chassis domain management requiring stable component supply and long-term lifecycle support.
Supply support for TC265D40F200WBBKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC26x family-designed specifically for ISO 26262-compliant automotive safety applications, emphasizing lockstep processing, memory safety, and deterministic real-time performance in powertrain and ADAS systems.
FAQ
What is the maximum operating frequency and temperature range for TC265D40F200WBBKXUMA1?
The TC265D40F200WBBKXUMA1 operates at up to 200 MHz for both its TC1.6P and TC1.6E TriCore CPUs across the full industrial temperature range of –40 °C to +125 °C, validated per AEC-Q100 Grade 1 qualification. This rating applies under specified 1.3 V core supply and 5 V/3.3 V I/O conditions with proper thermal management.
Does TC265D40F200WBBKXUMA1 support AUTOSAR Classic and Adaptive platforms?
Yes-the TC265D40F200WBBKXUMA1 is certified for AUTOSAR Classic R4.x and supports foundational services for AUTOSAR Adaptive via its dual-core architecture, Ethernet interface, and POSIX-compliant OS abstraction layer. Infineon provides validated MCAL drivers and SafeTcore safety software for ASIL-D integration.
How is functional safety implemented in the TC265D40F200WBBKXUMA1?
Functional safety is implemented through hardware-enforced mechanisms: lockstep CPU monitoring, ECC on all memories (PFlash, DFlash, DSPR, PSPR), Safety Management Unit (SMU) with configurable fault response, BIST for logic and memory, and safe DMA with address/data integrity checking-all aligned with ISO 26262 ASIL-D requirements for automotive safety-critical systems.
What debug and programming interfaces does TC265D40F200WBBKXUMA1 support?
The device supports JTAG and DAP (Debug Access Port) interfaces compliant with ARM CoreSight, enabling full-cycle debugging, trace capture, and flash programming. It also supports serial bootloader via ASCLIN or ETH, and secure boot with hardware cryptographic acceleration (HSM) for firmware authentication and encryption key management.
TC265D40F200WBBKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 240K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 50x12b, 3 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC265D40F200WBBKXUMA1 FAQ
1.How can I place an order for TC265D40F200WBBKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC265D40F200WBBKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC265D40F200WBBKXUMA1 reliable?
The price and inventory of TC265D40F200WBBKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC265D40F200WBBKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC265D40F200WBBKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC265D40F200WBBKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC265D40F200WBBKXUMA1?
TC265D40F200WBBKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC265D40F200WBBKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC265D40F200WBBKXUMA1?
For technical support, including TC265D40F200WBBKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC265D40F200WBBKXUMA1 requirements.
6.How does Aetrix verify that TC265D40F200WBBKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC265D40F200WBBKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC265D40F200WBBKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC265D40F200WBBKXUMA1?
All TC265D40F200WBBKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC265D40F200WBBKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC265D40F200WBBKXUMA1 part is unused and in its original packaging.
Return procedure for TC265D40F200WBBKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC265D40F200WBBKXUMA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

