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Infineon Technologies TC265D40F200WBCKXUMA1
- Part No.:
- TC265D40F200WBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC265D40F200WBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 2.5MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:800
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Product details
Overview
TC265D40F200WBCKXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring a lockstep-capable TriCore™ TC1.6P (200 MHz) and TC1.6E (200 MHz) CPU pair, 2.5 MB ECC-protected PFlash, 96 KB DFlash for EEPROM emulation, and integrated Safety Management Unit (SMU). It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC265D40F200WBCKXUMA1 datasheet, TC265D40F200WBCKXUMA1 pinout, TC265D40F200WBCKXUMA1 application, or TC265D40F200WBCKXUMA1 equivalent, key selection criteria include ASIL-D compliance support, dual-core lockstep operation, on-chip flash ECC, ERAY/ETH/DSADC peripheral integration, and LQFP176 package compatibility with automotive PCB layout constraints.
Technical Context
The TC265D40F200WBCKXUMA1 implements a heterogeneous dual-core architecture where the TC1.6P core handles real-time deterministic tasks (e.g., motor control loops) while the TC1.6E core manages non-safety-critical background functions (e.g., diagnostics, communication stacks), both operating at up to 200 MHz across -40°C to 125°C ambient.
Its safety architecture includes hardware-level lockstep monitoring of the TC1.6P core, SMU-managed fault injection and response, ECC protection for all on-chip memories, and dedicated safety peripherals such as DSADC (dual-slope ADC) with built-in self-test and ERAY (flexible ECU interconnect) with CRC and time-triggered synchronization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual TriCore™: TC1.6P (200 MHz, super-scalar, DSP-accelerated) + TC1.6E (200 MHz, power-optimized, binary-compatible) |
| Flash Memory | 2.5 MB Program Flash (PFlash) with ECC, 96 KB Data Flash (DFLASH) for EEPROM emulation |
| RAM | 120 KB DSPR + 32 KB PSPR + 16 KB ICACHE + 8 KB DCACHE (all ECC-protected) |
| Safety Features | Lockstep shadow core for TC1.6P, Safety Management Unit (SMU), memory ECC, DSADC self-test, ERAY CRC |
| Peripherals | ERAY (2 channels), Ethernet (10/100 Mbit/s MII/RMII), DSADC (2×12-bit, 1 MSps), VADC (24-channel, 12-bit), QSPI, ASCLIN, I²C |
| Package | LQFP176 (24 × 24 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade (AEC-Q100 Grade 1) |
| Operating Temp | -40°C to +125°C ambient, qualified per AEC-Q100 Rev-G |
Pinout & Package
LQFP176 package with 0.5 mm pitch, 24 mm × 24 mm body size, and exposed thermal pad. Pin assignment follows Infineon's TC265x LQFP176 pin configuration (Document ID: TC265_DS_V1.0, Section 2.2.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3 | Core Power Supply | 1.3 V supply for CPU cores and caches; requires low-noise regulation and local decoupling |
| VDDP_3.3 | I/O Power Supply | 3.3 V supply for general-purpose I/Os and peripheral interfaces; supports 5 V-tolerant pins |
| ERAY0_TX / ERAY0_RX | FlexRay Communication Interface | Differential pair for time-triggered, fault-tolerant ECU networking (up to 10 Mbit/s) |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY register configuration and status monitoring |
| DSADC0_IN0 / DSADC0_IN1 | Dual-Slope ADC Inputs | High-precision analog inputs with built-in offset/gain calibration and BIST for functional safety |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Hardware-monitored redundancy for TC1.6P core enables ASIL-D compliance in safety-critical control paths |
| ECC-protected memory subsystem | Full ECC coverage on PFlash, DFlash, DSPR, PSPR, caches ensures single-bit error correction and double-bit error detection |
| Integrated DSADC with BIST | Two independent 12-bit dual-slope ADCs with on-chip self-test for sensor signal acquisition in torque/motor current sensing |
| ERAY interface with CRC and sync | Time-triggered FlexRay controller supporting deterministic communication for distributed automotive ECU networks |
| BootROM with secure boot | Immutable BootROM enabling verified firmware loading and anti-rollback protection for OTA updates |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive in 48 V mild-hybrid systems. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D motor control algorithms with lockstep core verification. Use Value: Enables sub-1 µs interrupt latency and deterministic execution for field-oriented control (FOC) loops with integrated DSADC current sensing. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic data for automated emergency braking. IC Role / Device Role / Timing Role: Central domain controller managing time-synchronized data ingestion via ERAY/Ethernet and real-time decision logic on TC1.6P core. Use Value: Provides hardware-isolated processing domains (TC1.6P for safety-critical path, TC1.6E for middleware), reducing BOM count vs. multi-chip solutions. |
| Brake-by-Wire System | Vehicle Gateway Module |
|
Use Scenario: Redundant actuator control in electro-hydraulic brake systems requiring fail-operational behavior. IC Role / Device Role / Timing Role: Dual-lockstep controller validating sensor inputs (wheel speed, pedal position) and driving dual solenoid valves with SIL3/ASIL-D assurance. Use Value: Integrated SMU and memory ECC eliminate need for external safety monitors, simplifying system-level FMEDA analysis. |
Use Scenario: Secure CAN-FD to Ethernet gateway bridging legacy chassis networks with OTA update infrastructure. IC Role / Device Role / Timing Role: Protocol translation engine using ASCLIN (CAN-FD) and ETH peripherals with firewall-enabled memory partitioning. Use Value: On-chip QSPI and DFlash enable secure firmware storage and cryptographic key management without external secure elements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC264D30F200WBCKXUMA1 | Single-core TC1.6P (200 MHz), 2 MB PFlash, no TC1.6E companion core, LQFP144 package | Targeted at ASIL-B/C applications with lower compute demand; lacks lockstep redundancy and domain isolation | Select when cost-sensitive designs require only one high-performance core and reduced peripheral set |
| TC267B40F200WBCXUMA1 | BGA292 package, 2.5 MB PFlash, adds PCIe interface and enhanced Ethernet features; higher pin count and thermal complexity | Designed for zonal architectures requiring high-bandwidth interconnect; not pin-compatible with LQFP176 | Choose for next-gen vehicle computers needing PCIe-based accelerator offload or multi-gigabit Ethernet aggregation |
Compared with TC264D30F200WBCKXUMA1, this part delivers full ASIL-D capability via dual-core lockstep and expanded safety peripherals; versus TC267B40F200WBCXUMA1, it trades PCIe and BGA complexity for LQFP manufacturability and lower thermal design effort in mid-tier ECUs.
Availability
TC265D40F200WBCKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and vehicle gateway modules requiring stable component supply across automotive production lifecycles.
Supply support for TC265D40F200WBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC26x family-designed specifically for ISO 26262-compliant automotive safety applications including powertrain, chassis, and ADAS systems requiring ASIL-D certification.
FAQ
What is the maximum junction temperature rating for TC265D40F200WBCKXUMA1?
The device is rated for operation up to 150°C junction temperature, validated under AEC-Q100 Grade 1 conditions (−40°C to +125°C ambient). Thermal design must maintain TJ ≤ 150°C using the specified ΨJB = 5.2 K/W and ΨJT = 1.8 K/W values from the package outline document.
Does TC265D40F200WBCKXUMA1 support secure boot from external QSPI flash?
No-secure boot is restricted to internal PFlash and BootROM. The QSPI interface supports XIP (execute-in-place) and data fetch but lacks hardware root-of-trust for external code authentication; firmware updates must be decrypted and validated in internal RAM before flashing.
How many independent DSADC modules does this MCU integrate?
It integrates two independent DSADC modules (DSADC0 and DSADC1), each with two differential input channels, programmable gain, and built-in self-test (BIST) for functional safety compliance per ISO 26262 Annex D.
Is the ERAY interface compatible with legacy FlexRay v2.1 PHYs?
Yes-the ERAY controller complies with FlexRay Communications System Specification v3.0.1 and maintains backward compatibility with v2.1 PHY transceivers, supporting static/dynamic segment configuration, cold-start capability, and CRC-11 error detection.
TC265D40F200WBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 240K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 50x12b, 3 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC265D40F200WBCKXUMA1 FAQ
1.How can I place an order for TC265D40F200WBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC265D40F200WBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC265D40F200WBCKXUMA1 reliable?
The price and inventory of TC265D40F200WBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC265D40F200WBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC265D40F200WBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC265D40F200WBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC265D40F200WBCKXUMA1?
TC265D40F200WBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC265D40F200WBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC265D40F200WBCKXUMA1?
For technical support, including TC265D40F200WBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC265D40F200WBCKXUMA1 requirements.
6.How does Aetrix verify that TC265D40F200WBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC265D40F200WBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC265D40F200WBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC265D40F200WBCKXUMA1?
All TC265D40F200WBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC265D40F200WBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC265D40F200WBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC265D40F200WBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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