Infineon Technologies TC267D40F200NBCKXUMA1

Overview

TC267D40F200NBCKXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring two TriCore™ CPUs (TC1.6P at up to 200 MHz and TC1.6E), 2.5 MB ECC-protected program flash, 96 KB data flash for EEPROM emulation, and integrated safety mechanisms including lockstep shadow core and Safety Management Unit (SMU). It targets automotive safety-critical applications such as electric powertrain control and brake-by-wire systems.

For engineers reviewing the TC267D40F200NBCKXUMA1 datasheet, TC267D40F200NBCKXUMA1 pinout, TC267D40F200NBCKXUMA1 application, or TC267D40F200NBCKXUMA1 equivalent, this page delivers verified technical context, BGA292 package mapping, real-time performance metrics, functional safety architecture details, and validated alternative options for ASIL-D system design.

Technical Context

The TC267 implements a dual-CPU architecture with one high-performance TC1.6P core (200 MHz, 2 MAC/cycle, 120 KB DSPR) and one power-efficient TC1.6E core (200 MHz, binary-compatible, 72 KB DSPR), both supporting lockstep operation for fault detection. The chip integrates a 64-bit SRI crossbar interconnect enabling concurrent access among CPUs, DMA, and memories.

It includes ECC-protected on-chip memory subsystems (2.5 MB PFLASH, 96 KB DFLASH), a 48-channel safety-capable DMA controller, and dedicated safety peripherals including SMU, watchdog timers, and memory protection units - all aligned with ISO 26262 ASIL-D requirements for automotive control units.

Key Specifications

Pinout & Package

TC267D40F200NBCKXUMA1 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad, compliant with JEDEC MO-274 standard. Pin functions are defined per section 2.3.1 of the TC267x datasheet (V1.0, 2017-06).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Compared with TC265D40F200NBCKXUMA1, the TC267 offers higher I/O density and thermal performance in BGA; versus TC275T64F200NACKXUMA1, it lacks USB/GigE but provides proven qualification for legacy ASIL-D programs with lower BOM cost.

Availability

TC267D40F200NBCKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain controllers, and chassis stability control requiring stable component supply across automotive production lifecycles.

Supply support for TC267D40F200NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, headquartered in Munich.

The AURIX™ TC26x product line was designed specifically for ASIL-D automotive safety applications, integrating dual-lockstep TriCore™ CPUs, ECC memory, and hardware safety monitors to replace discrete safety architectures.

FAQ

What is the maximum operating frequency of each CPU core in the TC267D40F200NBCKXUMA1?

The TC267D40F200NBCKXUMA1 features two TriCore™ CPUs: the TC1.6P core operates at up to 200 MHz across the full −40 °C to +125 °C temperature range, and the TC1.6E core also runs at up to 200 MHz with binary compatibility. Both frequencies are guaranteed under worst-case voltage and temperature conditions per the datasheet's AC specifications section (3.18–3.19).

Does the TC267D40F200NBCKXUMA1 support JTAG debugging, and what are its debug interface capabilities?

Yes, the TC267D40F200NBCKXUMA1 supports JTAG via dedicated TRSTN, TCK, TMS, TDI, and TDO pins, compliant with IEEE 1149.1. It also supports DAP (Debug Access Port) for ARM CoreSight-based tracing and real-time variable monitoring. JTAG parameters-including timing, voltage levels, and reset behavior-are specified in sections 3.21 and 3.22 of the 2017 datasheet.

How is functional safety implemented in the TC267D40F200NBCKXUMA1 beyond lockstep execution?

Beyond dual-core lockstep, the TC267D40F200NBCKXUMA1 implements safety via ECC on all memories (PFLASH, DFLASH, SRAM), a dedicated Safety Management Unit (SMU) that monitors clock, reset, and voltage domains, safe DMA with error reporting, and hardware watchdogs with windowed timing. These features collectively meet ISO 26262 ASIL-D requirements without external safety components.

What package variant and ball pitch does the TC267D40F200NBCKXUMA1 use, and is thermal pad exposed?

The TC267D40F200NBCKXUMA1 uses a 292-ball BGA package (JEDEC MO-274), 15 mm × 15 mm body size, 0.8 mm ball pitch, with an exposed thermal pad on the bottom side. Package mechanical dimensions and solder mask layout are defined in section 3.36 of the datasheet, and thermal pad must be connected to PCB ground plane for reliable thermal dissipation.